JP2017022125A - 銅ナノ粒子分散体、及び導電性基板の製造方法 - Google Patents

銅ナノ粒子分散体、及び導電性基板の製造方法 Download PDF

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Publication number
JP2017022125A
JP2017022125A JP2016162615A JP2016162615A JP2017022125A JP 2017022125 A JP2017022125 A JP 2017022125A JP 2016162615 A JP2016162615 A JP 2016162615A JP 2016162615 A JP2016162615 A JP 2016162615A JP 2017022125 A JP2017022125 A JP 2017022125A
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Japan
Prior art keywords
copper
conductive substrate
nanoparticle dispersion
copper nanoparticle
mgkoh
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Pending
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JP2016162615A
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Japanese (ja)
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JP2017022125A5 (enExample
Inventor
吉信 大森
Yoshinobu Omori
吉信 大森
洋介 田口
Yosuke Taguchi
洋介 田口
将徳 澤田
Masanori Sawada
将徳 澤田
北條　美貴子
Mikiko Hojo
美貴子 北條
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2016162615A priority Critical patent/JP2017022125A/ja
Publication of JP2017022125A publication Critical patent/JP2017022125A/ja
Publication of JP2017022125A5 publication Critical patent/JP2017022125A5/ja
Pending legal-status Critical Current

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  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2016162615A 2016-08-23 2016-08-23 銅ナノ粒子分散体、及び導電性基板の製造方法 Pending JP2017022125A (ja)

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JP2016162615A JP2017022125A (ja) 2016-08-23 2016-08-23 銅ナノ粒子分散体、及び導電性基板の製造方法

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JP2016162615A JP2017022125A (ja) 2016-08-23 2016-08-23 銅ナノ粒子分散体、及び導電性基板の製造方法

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JP2014092473A Division JP5994811B2 (ja) 2014-04-28 2014-04-28 銅ナノ粒子分散体、及び導電性基板の製造方法

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JP2017022125A true JP2017022125A (ja) 2017-01-26
JP2017022125A5 JP2017022125A5 (enExample) 2017-07-06

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020044982A1 (ja) * 2018-08-31 2020-03-05 京セラ株式会社 銅粒子の製造方法、接合用ペーストおよび半導体装置並びに電気・電子部品
CN115678347A (zh) * 2022-09-08 2023-02-03 江南大学 一种低温等离子体诱导功能薄膜的制备方法及其关键材料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010229544A (ja) * 2008-11-26 2010-10-14 Mitsuboshi Belting Ltd 金属コロイド粒子及びそのペースト並びにその製造方法
WO2011161817A1 (ja) * 2010-06-25 2011-12-29 リケンテクノス株式会社 塗料およびこれを用いたプライマー、インクジェット用インク

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010229544A (ja) * 2008-11-26 2010-10-14 Mitsuboshi Belting Ltd 金属コロイド粒子及びそのペースト並びにその製造方法
WO2011161817A1 (ja) * 2010-06-25 2011-12-29 リケンテクノス株式会社 塗料およびこれを用いたプライマー、インクジェット用インク

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020044982A1 (ja) * 2018-08-31 2020-03-05 京セラ株式会社 銅粒子の製造方法、接合用ペーストおよび半導体装置並びに電気・電子部品
CN115678347A (zh) * 2022-09-08 2023-02-03 江南大学 一种低温等离子体诱导功能薄膜的制备方法及其关键材料
CN115678347B (zh) * 2022-09-08 2024-03-22 江南大学 一种低温等离子体诱导功能薄膜的制备方法及其关键材料

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