JP2017143309A5 - - Google Patents

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JP2017143309A5
JP2017143309A5 JP2017096322A JP2017096322A JP2017143309A5 JP 2017143309 A5 JP2017143309 A5 JP 2017143309A5 JP 2017096322 A JP2017096322 A JP 2017096322A JP 2017096322 A JP2017096322 A JP 2017096322A JP 2017143309 A5 JP2017143309 A5 JP 2017143309A5
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dispersion
mass
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dispersion according
solvent
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JP6496351B2 (ja
JP2017143309A (ja
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JP2017096322A 2013-07-23 2017-05-15 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 Active JP6496351B2 (ja)

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JP2013152799 2013-07-23
JP2013152799 2013-07-23

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JP2015528290A Division JP6175500B2 (ja) 2013-07-23 2014-07-22 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜

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JP2017143309A JP2017143309A (ja) 2017-08-17
JP2017143309A5 true JP2017143309A5 (enExample) 2017-09-28
JP6496351B2 JP6496351B2 (ja) 2019-04-03

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JP2015528290A Active JP6175500B2 (ja) 2013-07-23 2014-07-22 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜
JP2017096322A Active JP6496351B2 (ja) 2013-07-23 2017-05-15 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜

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JP2015528290A Active JP6175500B2 (ja) 2013-07-23 2014-07-22 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜

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US (2) US10424648B2 (enExample)
EP (1) EP3026677B1 (enExample)
JP (2) JP6175500B2 (enExample)
KR (2) KR101849446B1 (enExample)
CN (1) CN105393312B (enExample)
WO (1) WO2015012264A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103451682B (zh) * 2013-09-16 2017-06-06 北京科技大学 一种含钛可溶阳极熔盐电解提取金属钛的方法
EP3127969B1 (en) 2014-04-01 2018-06-20 Korea Electronics Technology Institute Ink composition for light sintering, wiring board using same and manufacturing method therefor
JP6633488B2 (ja) * 2015-09-29 2020-01-22 三ツ星ベルト株式会社 導電性ペースト及び導電膜付基板の製造方法
IL247113B (en) * 2016-08-04 2018-02-28 Copprint Tech Ltd Formulations and processes for making a high conductivity copper pattern
US11270809B2 (en) 2017-03-16 2022-03-08 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US11328835B2 (en) 2017-03-16 2022-05-10 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US10812974B2 (en) * 2017-05-06 2020-10-20 Vmware, Inc. Virtual desktop client connection continuity
WO2019017363A1 (ja) 2017-07-18 2019-01-24 旭化成株式会社 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線
EP3922451B1 (en) * 2017-07-27 2023-06-28 Asahi Kasei Kabushiki Kaisha Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern
JP7430483B2 (ja) * 2017-11-10 2024-02-13 旭化成株式会社 導電性パターン領域付構造体及びその製造方法
CN111344814B (zh) * 2017-11-14 2021-11-16 昭和电工材料株式会社 组合物、导体及其制造方法、以及结构体
JP7176847B2 (ja) * 2018-03-15 2022-11-22 旭化成株式会社 分散体、塗膜を含む製品、導電性パターン付き構造体の製造方法、及び、導電性パターン付き構造体
JP7099867B2 (ja) * 2018-05-16 2022-07-12 日本化学工業株式会社 光焼結型組成物及びそれを用いた導電膜の形成方法
JP7263124B2 (ja) * 2018-05-30 2023-04-24 旭化成株式会社 インクジェット用酸化銅インク及びこれを用いて導電性パターンを付与した導電性基板の製造方法
JP7062066B2 (ja) 2018-07-30 2022-05-02 旭化成株式会社 導電性フィルム、並びに、それを用いた導電性フィルムロール、電子ペーパー、タッチパネル及びフラットパネルディスプレイ
EP3832668A4 (en) 2018-07-30 2021-09-22 Asahi Kasei Kabushiki Kaisha CONDUCTIVE FILM AND CONDUCTIVE FILM ROLL, ELECTRONIC PAPER, TOUCH PANEL AND FLAT SCREEN WITH IT
CN118222142B (zh) * 2024-05-22 2024-07-19 汕头大学 一种多功能水性涂料及其制备方法与应用

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2091800A (en) * 1931-09-15 1937-08-31 Rohm & Haas Method of hydrogenating esters
US3213145A (en) * 1960-03-28 1965-10-19 Standard Oil Co Catalytic hydrogenation of esters of aromatic monocarboxylic acids to aryl-substituted methanols
JP2526989B2 (ja) * 1988-05-20 1996-08-21 三菱瓦斯化学株式会社 芳香族多価アルコ―ルの製造方法
US5158849A (en) * 1990-10-25 1992-10-27 Custom Papers Group Inc. Composition useful in transparent conductive coatings
US5855818A (en) * 1995-01-27 1999-01-05 Rogers Corporation Electrically conductive fiber filled elastomeric foam
TW505685B (en) * 1997-09-05 2002-10-11 Mitsubishi Materials Corp Transparent conductive film and composition for forming same
US5855820A (en) * 1997-11-13 1999-01-05 E. I. Du Pont De Nemours And Company Water based thick film conductive compositions
MY125159A (en) * 1998-09-14 2006-07-31 Mitsubishi Materials Corp Fine metal particle-dispersion solution and conductive film using the same
JP3545974B2 (ja) * 1999-08-16 2004-07-21 日本パーカライジング株式会社 金属材料のりん酸塩化成処理方法
US7858818B2 (en) * 2001-01-31 2010-12-28 Momentive Performance Materials Inc. Nanosized copper catalyst precursors for the direct synthesis of trialkoxysilanes
KR100622336B1 (ko) * 2001-12-18 2006-09-18 아사히 가세이 가부시키가이샤 금속 산화물 분산체, 그를 이용한 금속 박막 및 금속 박막의 제조방법
US7663004B2 (en) * 2002-04-22 2010-02-16 The Curators Of The University Of Missouri Method of producing lower alcohols from glycerol
US8252961B2 (en) * 2002-04-22 2012-08-28 The Curators Of The University Of Missouri Method of producing lower alcohols from glycerol
US20100009540A1 (en) * 2002-09-25 2010-01-14 Asahi Glass Company Limited Polishing compound, its production process and polishing method
CN100488339C (zh) * 2003-05-16 2009-05-13 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法
JP4493942B2 (ja) 2003-06-26 2010-06-30 旭化成イーマテリアルズ株式会社 酸化第一銅コロイド分散液
JP4407311B2 (ja) * 2004-02-20 2010-02-03 セイコーエプソン株式会社 薄膜トランジスタの製造方法
US7238654B2 (en) * 2004-05-17 2007-07-03 Phibro-Tech, Inc. Compatibilizing surfactant useful with slurries of copper particles
BRPI0514795B1 (pt) * 2004-08-31 2018-05-08 Sumitomo Metal Mining Co condutor elétrico dispersado em partícula que transmite luz visível, e, película eletrocondutora transparente
EP1825940B1 (en) * 2004-11-29 2012-06-13 DIC Corporation Method for producing surface-treated silver-containing powder
WO2006076613A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Metal nanoparticle compositions
JP2008531595A (ja) * 2005-02-24 2008-08-14 ロイ エー. ペリアナ, 炭化水素の官能基化型生成物への変換のための新規触媒系
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
JP4839767B2 (ja) * 2005-10-14 2011-12-21 東洋インキScホールディングス株式会社 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性パターン。
US8084401B2 (en) * 2006-01-25 2011-12-27 Clearwater International, Llc Non-volatile phosphorus hydrocarbon gelling agent
US8337726B2 (en) * 2006-07-28 2012-12-25 Furukawa Electric Co., Ltd. Fine particle dispersion and method for producing fine particle dispersion
JP2008144010A (ja) * 2006-12-08 2008-06-26 Konica Minolta Holdings Inc 樹脂組成物の製造方法及び樹脂組成物フィルム
CN101632136B (zh) * 2007-03-15 2012-01-11 Dic株式会社 凸版反转印刷用导电性油墨
US7976733B2 (en) * 2007-11-30 2011-07-12 Xerox Corporation Air stable copper nanoparticle ink and applications therefor
US20090214764A1 (en) * 2008-02-26 2009-08-27 Xerox Corporation Metal nanoparticles stabilized with a bident amine
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
CN102197492A (zh) * 2008-08-27 2011-09-21 三菱综合材料株式会社 太阳能电池用透明导电膜及其透明导电膜用组合物、多接合型太阳能电池
JP2010129790A (ja) * 2008-11-27 2010-06-10 Tokyo Electron Ltd 成膜方法
JP5531504B2 (ja) * 2009-08-25 2014-06-25 Dic株式会社 銀ナノ粒子を用いる接合体の製造方法、及び接合体
CN102482522A (zh) 2009-08-28 2012-05-30 Lg化学株式会社 导电金属油墨组合物和形成导电图形的方法
JP2011084814A (ja) * 2009-09-18 2011-04-28 Sumitomo Chemical Co Ltd 銀−共役化合物複合体
CN102596455B (zh) * 2009-09-30 2015-02-04 大日本印刷株式会社 金属微粒分散体、导电性基板的制造方法及导电性基板
US9272970B2 (en) * 2010-07-09 2016-03-01 Celanese International Corporation Hydrogenolysis of ethyl acetate in alcohol separation processes
BR112013003336B1 (pt) * 2010-08-12 2020-12-01 Mitsui Chemicals, Inc bactéria produtora de álcool isopropílico e método de produção de álcool isopropílico
EP2468827B1 (en) * 2010-12-21 2014-03-12 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles
KR101260956B1 (ko) 2011-02-25 2013-05-06 한화케미칼 주식회사 오프셋 또는 리버스­오프셋 인쇄용 전도성 잉크 조성물
JP5849426B2 (ja) 2011-03-31 2016-01-27 大日本印刷株式会社 金属酸化物微粒子分散体、導電性基板及びその製造方法
WO2012135997A1 (zh) * 2011-04-02 2012-10-11 中国科学院化学研究所 在含有疏水性的硅柱的硅片表面构筑微电极对阵列的方法
JP2013004309A (ja) * 2011-06-16 2013-01-07 Toyota Motor Corp 金属ナノ粒子ペースト
JP6035887B2 (ja) * 2011-06-21 2016-11-30 セントラル硝子株式会社 ポジ型レジスト組成物
JP2013008907A (ja) * 2011-06-27 2013-01-10 Hitachi Chem Co Ltd 導電性ペースト用酸化銅粉末、導電性ペースト用酸化銅粉末の製造方法、導電性ペースト及びこれを用いて得られる銅配線層
FR2980791A1 (fr) * 2011-10-03 2013-04-05 Rhodia Operations Procede de preparation d'un melange d'alcools
JP5088761B1 (ja) * 2011-11-14 2012-12-05 石原薬品株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
JP5772539B2 (ja) * 2011-11-21 2015-09-02 日立化成株式会社 酸化銅ペースト及び金属銅層の製造方法
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
CN104040641A (zh) * 2011-12-07 2014-09-10 杜克大学 铜镍合金纳米导线的合成及其在透明导电膜中的应用
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
KR101403865B1 (ko) * 2011-12-16 2014-06-10 제일모직주식회사 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치
KR101355855B1 (ko) * 2011-12-19 2014-01-29 제일모직주식회사 이방성 도전 필름
KR101355856B1 (ko) * 2011-12-26 2014-01-27 제일모직주식회사 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름
US9664009B2 (en) * 2012-04-04 2017-05-30 Weatherford Technologies, LLC Apparatuses, systems, and methods for forming in-situ gel pills to lift liquids from horizontal wells
JP6191606B2 (ja) * 2012-07-19 2017-09-06 日油株式会社 銀ナノ微粒子、その製造方法、銀ナノ微粒子分散液及び銀要素形成基材
US9452933B2 (en) * 2012-09-25 2016-09-27 University Of Connecticut Mesoporous metal oxides and processes for preparation thereof
US9972413B2 (en) * 2012-10-15 2018-05-15 Dai Nippon Printing Co., Ltd. Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate
US9953740B2 (en) * 2012-10-18 2018-04-24 Dai Nippon Printing Co., Ltd. Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate
US9622346B2 (en) * 2012-10-24 2017-04-11 National Institute For Materials Science Adhesive body comprising conductive polymer-metal complex and substrate and method for forming the same, conductive polymer-metal complex dispersion liquid, method for manufacturing the same and method for applying the same, and method for filling hole using conductive material
US20140127409A1 (en) * 2012-11-06 2014-05-08 Takuya Harada Method for producing fine particle dispersion
EP2958881A4 (en) * 2013-02-19 2016-12-21 Greenyug Llc PREPARATION OF HIGHER ALCOHOLS
JP5700864B2 (ja) * 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
CN105377795A (zh) * 2013-07-02 2016-03-02 Ut巴特勒有限公司 具有至少三个碳原子的醇到烃混合原料的催化转化

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