JP6175500B2 - 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 - Google Patents

銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 Download PDF

Info

Publication number
JP6175500B2
JP6175500B2 JP2015528290A JP2015528290A JP6175500B2 JP 6175500 B2 JP6175500 B2 JP 6175500B2 JP 2015528290 A JP2015528290 A JP 2015528290A JP 2015528290 A JP2015528290 A JP 2015528290A JP 6175500 B2 JP6175500 B2 JP 6175500B2
Authority
JP
Japan
Prior art keywords
dispersion
copper
printing
mass
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015528290A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2015012264A1 (ja
Inventor
晋平 小川
晋平 小川
栄一 大野
栄一 大野
雅典 鶴田
雅典 鶴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Publication of JPWO2015012264A1 publication Critical patent/JPWO2015012264A1/ja
Application granted granted Critical
Publication of JP6175500B2 publication Critical patent/JP6175500B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C09C1/627—Copper
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739—Conductor-insulator-semiconductor electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thin Film Transistor (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
JP2015528290A 2013-07-23 2014-07-22 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 Active JP6175500B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013152799 2013-07-23
JP2013152799 2013-07-23
PCT/JP2014/069321 WO2015012264A1 (ja) 2013-07-23 2014-07-22 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017096322A Division JP6496351B2 (ja) 2013-07-23 2017-05-15 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜

Publications (2)

Publication Number Publication Date
JPWO2015012264A1 JPWO2015012264A1 (ja) 2017-03-02
JP6175500B2 true JP6175500B2 (ja) 2017-08-02

Family

ID=52393299

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015528290A Active JP6175500B2 (ja) 2013-07-23 2014-07-22 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜
JP2017096322A Active JP6496351B2 (ja) 2013-07-23 2017-05-15 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017096322A Active JP6496351B2 (ja) 2013-07-23 2017-05-15 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜

Country Status (6)

Country Link
US (2) US10424648B2 (enExample)
EP (1) EP3026677B1 (enExample)
JP (2) JP6175500B2 (enExample)
KR (2) KR101849446B1 (enExample)
CN (1) CN105393312B (enExample)
WO (1) WO2015012264A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103451682B (zh) * 2013-09-16 2017-06-06 北京科技大学 一种含钛可溶阳极熔盐电解提取金属钛的方法
WO2015152625A1 (ko) * 2014-04-01 2015-10-08 전자부품연구원 광 소결용 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법
JP6633488B2 (ja) * 2015-09-29 2020-01-22 三ツ星ベルト株式会社 導電性ペースト及び導電膜付基板の製造方法
IL247113B (en) * 2016-08-04 2018-02-28 Copprint Tech Ltd Formulations and processes for making a high conductivity copper pattern
US11270809B2 (en) 2017-03-16 2022-03-08 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US11328835B2 (en) 2017-03-16 2022-05-10 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US10812974B2 (en) * 2017-05-06 2020-10-20 Vmware, Inc. Virtual desktop client connection continuity
CN110870392B (zh) 2017-07-18 2023-04-14 旭化成株式会社 具有导电性图案区域的结构体及其制造方法、层积体及其制造方法、以及铜布线
KR102456821B1 (ko) * 2017-07-27 2022-10-19 아사히 가세이 가부시키가이샤 산화구리 잉크 및 이것을 이용한 도전성 기판의 제조 방법, 도막을 포함하는 제품 및 이것을 이용한 제품의 제조 방법, 도전성 패턴을 갖는 제품의 제조 방법, 및 도전성 패턴을 갖는 제품
JP7430483B2 (ja) * 2017-11-10 2024-02-13 旭化成株式会社 導電性パターン領域付構造体及びその製造方法
US11512214B2 (en) 2017-11-14 2022-11-29 Showa Denko Materials Co., Ltd. Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor
JP7176847B2 (ja) * 2018-03-15 2022-11-22 旭化成株式会社 分散体、塗膜を含む製品、導電性パターン付き構造体の製造方法、及び、導電性パターン付き構造体
JP7099867B2 (ja) * 2018-05-16 2022-07-12 日本化学工業株式会社 光焼結型組成物及びそれを用いた導電膜の形成方法
JP7263124B2 (ja) * 2018-05-30 2023-04-24 旭化成株式会社 インクジェット用酸化銅インク及びこれを用いて導電性パターンを付与した導電性基板の製造方法
US11520451B2 (en) * 2018-07-30 2022-12-06 Asahi Kasei Kabushiki Kaisha Conductive film and conductive film roll, electronic paper, touch panel and flat-panel display comprising the same
TWI766178B (zh) 2018-07-30 2022-06-01 日商旭化成股份有限公司 導電性膜、及使用其之導電性膜捲筒、電子紙、觸控面板、及平面顯示器
CN118222142B (zh) * 2024-05-22 2024-07-19 汕头大学 一种多功能水性涂料及其制备方法与应用

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2091800A (en) * 1931-09-15 1937-08-31 Rohm & Haas Method of hydrogenating esters
US3213145A (en) * 1960-03-28 1965-10-19 Standard Oil Co Catalytic hydrogenation of esters of aromatic monocarboxylic acids to aryl-substituted methanols
JP2526989B2 (ja) * 1988-05-20 1996-08-21 三菱瓦斯化学株式会社 芳香族多価アルコ―ルの製造方法
US5158849A (en) * 1990-10-25 1992-10-27 Custom Papers Group Inc. Composition useful in transparent conductive coatings
US5855818A (en) * 1995-01-27 1999-01-05 Rogers Corporation Electrically conductive fiber filled elastomeric foam
TW505685B (en) * 1997-09-05 2002-10-11 Mitsubishi Materials Corp Transparent conductive film and composition for forming same
US5855820A (en) * 1997-11-13 1999-01-05 E. I. Du Pont De Nemours And Company Water based thick film conductive compositions
MY125159A (en) * 1998-09-14 2006-07-31 Mitsubishi Materials Corp Fine metal particle-dispersion solution and conductive film using the same
JP3545974B2 (ja) * 1999-08-16 2004-07-21 日本パーカライジング株式会社 金属材料のりん酸塩化成処理方法
US7858818B2 (en) * 2001-01-31 2010-12-28 Momentive Performance Materials Inc. Nanosized copper catalyst precursors for the direct synthesis of trialkoxysilanes
WO2003051562A1 (en) * 2001-12-18 2003-06-26 Asahi Kasei Kabushiki Kaisha Metal oxide dispersion
US8252961B2 (en) * 2002-04-22 2012-08-28 The Curators Of The University Of Missouri Method of producing lower alcohols from glycerol
US7663004B2 (en) * 2002-04-22 2010-02-16 The Curators Of The University Of Missouri Method of producing lower alcohols from glycerol
US20100009540A1 (en) * 2002-09-25 2010-01-14 Asahi Glass Company Limited Polishing compound, its production process and polishing method
CN100488339C (zh) * 2003-05-16 2009-05-13 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法
JP4493942B2 (ja) 2003-06-26 2010-06-30 旭化成イーマテリアルズ株式会社 酸化第一銅コロイド分散液
JP4407311B2 (ja) * 2004-02-20 2010-02-03 セイコーエプソン株式会社 薄膜トランジスタの製造方法
US7238654B2 (en) * 2004-05-17 2007-07-03 Phibro-Tech, Inc. Compatibilizing surfactant useful with slurries of copper particles
US8980135B2 (en) * 2004-08-31 2015-03-17 Sumitomo Metal Mining Co., Ltd. Electroconductive particle, visible light transmitting particle-dispersed electrical conductor and manufacturing method thereof, transparent electroconductive thin film and manufacturing method thereof, transparent electroconductive article that uses the same, and infrared-shielding article
US7771625B2 (en) * 2004-11-29 2010-08-10 Dainippon Ink And Chemicals, Inc. Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder
WO2006076611A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Production of metal nanoparticles
KR20070118096A (ko) * 2005-02-24 2007-12-13 로이 에이. 페리아나 탄화수소의 작용기화된 생성물로의 전환을 위한 촉매시스템
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
JP4839767B2 (ja) * 2005-10-14 2011-12-21 東洋インキＳｃホールディングス株式会社 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性パターン。
US8084401B2 (en) * 2006-01-25 2011-12-27 Clearwater International, Llc Non-volatile phosphorus hydrocarbon gelling agent
US8337726B2 (en) * 2006-07-28 2012-12-25 Furukawa Electric Co., Ltd. Fine particle dispersion and method for producing fine particle dispersion
JP2008144010A (ja) * 2006-12-08 2008-06-26 Konica Minolta Holdings Inc 樹脂組成物の製造方法及び樹脂組成物フィルム
KR101184674B1 (ko) * 2007-03-15 2012-09-20 디아이씨 가부시끼가이샤 볼록판 반전 인쇄용 도전성 잉크
US7976733B2 (en) * 2007-11-30 2011-07-12 Xerox Corporation Air stable copper nanoparticle ink and applications therefor
US20090214764A1 (en) * 2008-02-26 2009-08-27 Xerox Corporation Metal nanoparticles stabilized with a bident amine
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US20110139228A1 (en) * 2008-08-27 2011-06-16 Mitsubishi Materials Corporation Transparent electroconductive film for solar cell, composition for transparent electroconductive film and multi-junction solar cell
JP2010129790A (ja) * 2008-11-27 2010-06-10 Tokyo Electron Ltd 成膜方法
JP5531504B2 (ja) * 2009-08-25 2014-06-25 Ｄｉｃ株式会社 銀ナノ粒子を用いる接合体の製造方法、及び接合体
CN102482522A (zh) 2009-08-28 2012-05-30 Lg化学株式会社 导电金属油墨组合物和形成导电图形的方法
KR20120102599A (ko) * 2009-09-18 2012-09-18 스미또모 가가꾸 가부시키가이샤 은-공액 화합물 복합체
US9497859B2 (en) * 2009-09-30 2016-11-15 Dai Nippon Printing Co., Ltd. Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
US9272970B2 (en) * 2010-07-09 2016-03-01 Celanese International Corporation Hydrogenolysis of ethyl acetate in alcohol separation processes
BR112013003336B1 (pt) * 2010-08-12 2020-12-01 Mitsui Chemicals, Inc bactéria produtora de álcool isopropílico e método de produção de álcool isopropílico
ES2453217T3 (es) * 2010-12-21 2014-04-04 Agfa-Gevaert Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal
KR101260956B1 (ko) 2011-02-25 2013-05-06 한화케미칼 주식회사 오프셋 또는 리버스­오프셋 인쇄용 전도성 잉크 조성물
JP5849426B2 (ja) 2011-03-31 2016-01-27 大日本印刷株式会社 金属酸化物微粒子分散体、導電性基板及びその製造方法
WO2012135997A1 (zh) * 2011-04-02 2012-10-11 中国科学院化学研究所 在含有疏水性的硅柱的硅片表面构筑微电极对阵列的方法
JP2013004309A (ja) * 2011-06-16 2013-01-07 Toyota Motor Corp 金属ナノ粒子ペースト
JP6035887B2 (ja) * 2011-06-21 2016-11-30 セントラル硝子株式会社 ポジ型レジスト組成物
JP2013008907A (ja) * 2011-06-27 2013-01-10 Hitachi Chem Co Ltd 導電性ペースト用酸化銅粉末、導電性ペースト用酸化銅粉末の製造方法、導電性ペースト及びこれを用いて得られる銅配線層
FR2980791A1 (fr) * 2011-10-03 2013-04-05 Rhodia Operations Procede de preparation d'un melange d'alcools
JP5088761B1 (ja) 2011-11-14 2012-12-05 石原薬品株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
JP5772539B2 (ja) 2011-11-21 2015-09-02 日立化成株式会社 酸化銅ペースト及び金属銅層の製造方法
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
US20140342177A1 (en) * 2011-12-07 2014-11-20 Duke University Synthesis of cupronickel nanowires and their application in transparent conducting films
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
KR101403865B1 (ko) * 2011-12-16 2014-06-10 제일모직주식회사 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치
KR101355855B1 (ko) * 2011-12-19 2014-01-29 제일모직주식회사 이방성 도전 필름
KR101355856B1 (ko) * 2011-12-26 2014-01-27 제일모직주식회사 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름
US9664009B2 (en) * 2012-04-04 2017-05-30 Weatherford Technologies, LLC Apparatuses, systems, and methods for forming in-situ gel pills to lift liquids from horizontal wells
US9496069B2 (en) * 2012-07-19 2016-11-15 Nof Corporation Silver nanoparticles, method for producing same, silver nanoparticle dispersion liquid, and base provided with silver material
WO2014052482A1 (en) * 2012-09-25 2014-04-03 University Of Connecticut Office Of Economic Development Mesoporous metal oxides and processes for preparation thereof
US9972413B2 (en) * 2012-10-15 2018-05-15 Dai Nippon Printing Co., Ltd. Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate
US9953740B2 (en) * 2012-10-18 2018-04-24 Dai Nippon Printing Co., Ltd. Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate
WO2014065242A1 (ja) * 2012-10-24 2014-05-01 独立行政法人物質・材料研究機構 導電性ポリマー－金属複合体と基材との付着体及びその形成方法、導電性ポリマー－金属複合体分散液、その製造方法及びその塗布方法、並びに穴を導電性材料で充填する方法
US20140127409A1 (en) * 2012-11-06 2014-05-08 Takuya Harada Method for producing fine particle dispersion
MY170550A (en) * 2013-02-19 2019-08-16 Rescurve Llc Production of higher alcohols
JP5700864B2 (ja) * 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
HK1221714A1 (zh) * 2013-07-02 2017-06-09 Ut 巴特勒有限公司 具有至少三個碳原子的醇到烴混合原料的催化轉化

Also Published As

Publication number Publication date
US20160155814A1 (en) 2016-06-02
WO2015012264A1 (ja) 2015-01-29
JP2017143309A (ja) 2017-08-17
JPWO2015012264A1 (ja) 2017-03-02
CN105393312B (zh) 2018-01-02
EP3026677A4 (en) 2016-07-27
KR101849446B1 (ko) 2018-04-16
EP3026677B1 (en) 2018-04-11
US10424648B2 (en) 2019-09-24
US20190371901A1 (en) 2019-12-05
CN105393312A (zh) 2016-03-09
KR102117579B1 (ko) 2020-06-01
KR20180024039A (ko) 2018-03-07
KR20160003840A (ko) 2016-01-11
JP6496351B2 (ja) 2019-04-03
EP3026677A1 (en) 2016-06-01

Similar Documents

Publication Publication Date Title
JP6496351B2 (ja) 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜
Garlapati et al. Printed electronics based on inorganic semiconductors: From processes and materials to devices
Song et al. All inkjet-printed electronics based on electrochemically exfoliated two-dimensional metal, semiconductor, and dielectric
Scheideler et al. Low‐temperature‐processed printed metal oxide transistors based on pure aqueous inks
Ko et al. Functionalized MXene ink enables environmentally stable printed electronics
CN104205340B (zh) 导电薄膜、用于形成导电薄膜的涂布液、场效应晶体管、以及用于生产场效应晶体管的方法
CN105098073B (zh) 金属氧化物-导电聚合物-醇组合物、其制备方法及应用
Han et al. High performance metal oxide field-effect transistors with a reverse offset printed Cu source/drain electrode
JP6611627B2 (ja) 高品質導電性特徴物のための印刷プロセス
KR20140073613A (ko) 그래핀 조성물 및 그를 이용한 전극을 포함하는 유기전자소자
KR101654133B1 (ko) 그래핀 조성물 및 그를 이용한 전극을 포함하는 유기전자소자
JP2018041697A (ja) 分散体及びプリント配線基板製造用基板
KR20110080776A (ko) 단분자가 도핑된 단일 벽 탄소 나노튜브 및 이를 이용한 박막 트랜지스터
CN112635102A (zh) 复合导电薄膜及其制备方法以及薄膜晶体管
Jeong et al. Printed Cu source/drain electrode capped by CuO hole injection layer for organic thin film transistors
JP5578078B2 (ja) 機能性層の製造方法
KR102753693B1 (ko) 2차원 물질 분산액을 이용하여 잉크젯 프린팅된 반도체 소자 및 이의 제조방법
KR20160014409A (ko) 도전성 잉크 조성물, 도전체 및 전자 소자
EP3223328B1 (en) Organic photovoltaic cell and manufacturing method thereof
Wu et al. Development of silver nanoparticle ink for printed electronics
JP2010103345A (ja) 機能性層の製造方法及び電子デバイス
Chen Inorganic Printable Electronic
Park et al. Functionalized MXene Ink Enables Environmentally Stable Printed Electronics
KR20230140119A (ko) 전기유체역학 프린팅용 콜로이드성 맥신 잉크 및 이의 제조방법
JP6620556B2 (ja) 機能材料の積層方法及び機能材料積層体

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170127

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170515

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20170522

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170613

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170622

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170704

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170710

R150 Certificate of patent or registration of utility model

Ref document number: 6175500

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350