JP6175500B2 - 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 - Google Patents
銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 Download PDFInfo
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- JP6175500B2 JP6175500B2 JP2015528290A JP2015528290A JP6175500B2 JP 6175500 B2 JP6175500 B2 JP 6175500B2 JP 2015528290 A JP2015528290 A JP 2015528290A JP 2015528290 A JP2015528290 A JP 2015528290A JP 6175500 B2 JP6175500 B2 JP 6175500B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
- C09C1/627—Copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013152799 | 2013-07-23 | ||
| JP2013152799 | 2013-07-23 | ||
| PCT/JP2014/069321 WO2015012264A1 (ja) | 2013-07-23 | 2014-07-22 | 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017096322A Division JP6496351B2 (ja) | 2013-07-23 | 2017-05-15 | 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2015012264A1 JPWO2015012264A1 (ja) | 2017-03-02 |
| JP6175500B2 true JP6175500B2 (ja) | 2017-08-02 |
Family
ID=52393299
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015528290A Active JP6175500B2 (ja) | 2013-07-23 | 2014-07-22 | 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 |
| JP2017096322A Active JP6496351B2 (ja) | 2013-07-23 | 2017-05-15 | 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017096322A Active JP6496351B2 (ja) | 2013-07-23 | 2017-05-15 | 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10424648B2 (enExample) |
| EP (1) | EP3026677B1 (enExample) |
| JP (2) | JP6175500B2 (enExample) |
| KR (2) | KR101849446B1 (enExample) |
| CN (1) | CN105393312B (enExample) |
| WO (1) | WO2015012264A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103451682B (zh) * | 2013-09-16 | 2017-06-06 | 北京科技大学 | 一种含钛可溶阳极熔盐电解提取金属钛的方法 |
| EP3127969B1 (en) | 2014-04-01 | 2018-06-20 | Korea Electronics Technology Institute | Ink composition for light sintering, wiring board using same and manufacturing method therefor |
| JP6633488B2 (ja) * | 2015-09-29 | 2020-01-22 | 三ツ星ベルト株式会社 | 導電性ペースト及び導電膜付基板の製造方法 |
| IL247113B (en) * | 2016-08-04 | 2018-02-28 | Copprint Tech Ltd | Formulations and processes for making a high conductivity copper pattern |
| US11270809B2 (en) | 2017-03-16 | 2022-03-08 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
| US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
| US10812974B2 (en) * | 2017-05-06 | 2020-10-20 | Vmware, Inc. | Virtual desktop client connection continuity |
| WO2019017363A1 (ja) | 2017-07-18 | 2019-01-24 | 旭化成株式会社 | 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線 |
| EP3922451B1 (en) * | 2017-07-27 | 2023-06-28 | Asahi Kasei Kabushiki Kaisha | Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern |
| JP7430483B2 (ja) * | 2017-11-10 | 2024-02-13 | 旭化成株式会社 | 導電性パターン領域付構造体及びその製造方法 |
| CN111344814B (zh) * | 2017-11-14 | 2021-11-16 | 昭和电工材料株式会社 | 组合物、导体及其制造方法、以及结构体 |
| JP7176847B2 (ja) * | 2018-03-15 | 2022-11-22 | 旭化成株式会社 | 分散体、塗膜を含む製品、導電性パターン付き構造体の製造方法、及び、導電性パターン付き構造体 |
| JP7099867B2 (ja) * | 2018-05-16 | 2022-07-12 | 日本化学工業株式会社 | 光焼結型組成物及びそれを用いた導電膜の形成方法 |
| JP7263124B2 (ja) * | 2018-05-30 | 2023-04-24 | 旭化成株式会社 | インクジェット用酸化銅インク及びこれを用いて導電性パターンを付与した導電性基板の製造方法 |
| JP7062066B2 (ja) | 2018-07-30 | 2022-05-02 | 旭化成株式会社 | 導電性フィルム、並びに、それを用いた導電性フィルムロール、電子ペーパー、タッチパネル及びフラットパネルディスプレイ |
| EP3832668A4 (en) | 2018-07-30 | 2021-09-22 | Asahi Kasei Kabushiki Kaisha | CONDUCTIVE FILM AND CONDUCTIVE FILM ROLL, ELECTRONIC PAPER, TOUCH PANEL AND FLAT SCREEN WITH IT |
| CN118222142B (zh) * | 2024-05-22 | 2024-07-19 | 汕头大学 | 一种多功能水性涂料及其制备方法与应用 |
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| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| CN104040641A (zh) * | 2011-12-07 | 2014-09-10 | 杜克大学 | 铜镍合金纳米导线的合成及其在透明导电膜中的应用 |
| KR101391697B1 (ko) * | 2011-12-14 | 2014-05-07 | 제일모직주식회사 | 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름 |
| KR101403865B1 (ko) * | 2011-12-16 | 2014-06-10 | 제일모직주식회사 | 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치 |
| KR101355855B1 (ko) * | 2011-12-19 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
| KR101355856B1 (ko) * | 2011-12-26 | 2014-01-27 | 제일모직주식회사 | 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름 |
| US9664009B2 (en) * | 2012-04-04 | 2017-05-30 | Weatherford Technologies, LLC | Apparatuses, systems, and methods for forming in-situ gel pills to lift liquids from horizontal wells |
| JP6191606B2 (ja) * | 2012-07-19 | 2017-09-06 | 日油株式会社 | 銀ナノ微粒子、その製造方法、銀ナノ微粒子分散液及び銀要素形成基材 |
| US9452933B2 (en) * | 2012-09-25 | 2016-09-27 | University Of Connecticut | Mesoporous metal oxides and processes for preparation thereof |
| US9972413B2 (en) * | 2012-10-15 | 2018-05-15 | Dai Nippon Printing Co., Ltd. | Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate |
| US9953740B2 (en) * | 2012-10-18 | 2018-04-24 | Dai Nippon Printing Co., Ltd. | Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate |
| US9622346B2 (en) * | 2012-10-24 | 2017-04-11 | National Institute For Materials Science | Adhesive body comprising conductive polymer-metal complex and substrate and method for forming the same, conductive polymer-metal complex dispersion liquid, method for manufacturing the same and method for applying the same, and method for filling hole using conductive material |
| US20140127409A1 (en) * | 2012-11-06 | 2014-05-08 | Takuya Harada | Method for producing fine particle dispersion |
| EP2958881A4 (en) * | 2013-02-19 | 2016-12-21 | Greenyug Llc | PREPARATION OF HIGHER ALCOHOLS |
| JP5700864B2 (ja) * | 2013-05-15 | 2015-04-15 | 石原ケミカル株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
| CN105377795A (zh) * | 2013-07-02 | 2016-03-02 | Ut巴特勒有限公司 | 具有至少三个碳原子的醇到烃混合原料的催化转化 |
-
2014
- 2014-07-22 WO PCT/JP2014/069321 patent/WO2015012264A1/ja not_active Ceased
- 2014-07-22 EP EP14829560.3A patent/EP3026677B1/en active Active
- 2014-07-22 JP JP2015528290A patent/JP6175500B2/ja active Active
- 2014-07-22 US US14/906,422 patent/US10424648B2/en active Active
- 2014-07-22 KR KR1020157034234A patent/KR101849446B1/ko active Active
- 2014-07-22 KR KR1020187006001A patent/KR102117579B1/ko active Active
- 2014-07-22 CN CN201480040975.5A patent/CN105393312B/zh active Active
-
2017
- 2017-05-15 JP JP2017096322A patent/JP6496351B2/ja active Active
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- 2019-08-14 US US16/540,446 patent/US20190371901A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2015012264A1 (ja) | 2017-03-02 |
| CN105393312A (zh) | 2016-03-09 |
| JP6496351B2 (ja) | 2019-04-03 |
| JP2017143309A (ja) | 2017-08-17 |
| US20190371901A1 (en) | 2019-12-05 |
| KR102117579B1 (ko) | 2020-06-01 |
| KR101849446B1 (ko) | 2018-04-16 |
| CN105393312B (zh) | 2018-01-02 |
| EP3026677B1 (en) | 2018-04-11 |
| WO2015012264A1 (ja) | 2015-01-29 |
| KR20180024039A (ko) | 2018-03-07 |
| EP3026677A1 (en) | 2016-06-01 |
| EP3026677A4 (en) | 2016-07-27 |
| US10424648B2 (en) | 2019-09-24 |
| KR20160003840A (ko) | 2016-01-11 |
| US20160155814A1 (en) | 2016-06-02 |
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