KR101849446B1 - 구리 및/또는 구리 산화물 분산체, 및 이 분산체를 이용하여 형성된 도전막 - Google Patents
구리 및/또는 구리 산화물 분산체, 및 이 분산체를 이용하여 형성된 도전막 Download PDFInfo
- Publication number
- KR101849446B1 KR101849446B1 KR1020157034234A KR20157034234A KR101849446B1 KR 101849446 B1 KR101849446 B1 KR 101849446B1 KR 1020157034234 A KR1020157034234 A KR 1020157034234A KR 20157034234 A KR20157034234 A KR 20157034234A KR 101849446 B1 KR101849446 B1 KR 101849446B1
- Authority
- KR
- South Korea
- Prior art keywords
- dispersion
- less
- mass
- copper
- copper oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
- C09C1/627—Copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H01L29/4908—
-
- H01L29/7869—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013152799 | 2013-07-23 | ||
| JPJP-P-2013-152799 | 2013-07-23 | ||
| PCT/JP2014/069321 WO2015012264A1 (ja) | 2013-07-23 | 2014-07-22 | 銅及び/又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187006001A Division KR102117579B1 (ko) | 2013-07-23 | 2014-07-22 | 구리 및/또는 구리 산화물 분산체, 및 이 분산체를 이용하여 형성된 도전막 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160003840A KR20160003840A (ko) | 2016-01-11 |
| KR101849446B1 true KR101849446B1 (ko) | 2018-04-16 |
Family
ID=52393299
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157034234A Active KR101849446B1 (ko) | 2013-07-23 | 2014-07-22 | 구리 및/또는 구리 산화물 분산체, 및 이 분산체를 이용하여 형성된 도전막 |
| KR1020187006001A Active KR102117579B1 (ko) | 2013-07-23 | 2014-07-22 | 구리 및/또는 구리 산화물 분산체, 및 이 분산체를 이용하여 형성된 도전막 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187006001A Active KR102117579B1 (ko) | 2013-07-23 | 2014-07-22 | 구리 및/또는 구리 산화물 분산체, 및 이 분산체를 이용하여 형성된 도전막 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10424648B2 (enExample) |
| EP (1) | EP3026677B1 (enExample) |
| JP (2) | JP6175500B2 (enExample) |
| KR (2) | KR101849446B1 (enExample) |
| CN (1) | CN105393312B (enExample) |
| WO (1) | WO2015012264A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103451682B (zh) * | 2013-09-16 | 2017-06-06 | 北京科技大学 | 一种含钛可溶阳极熔盐电解提取金属钛的方法 |
| US10091875B2 (en) | 2014-04-01 | 2018-10-02 | Korea Electronics Technology Institute | Ink composition for light sintering, wiring board using same and manufacturing method therefor |
| JP6633488B2 (ja) * | 2015-09-29 | 2020-01-22 | 三ツ星ベルト株式会社 | 導電性ペースト及び導電膜付基板の製造方法 |
| IL247113B (en) * | 2016-08-04 | 2018-02-28 | Copprint Tech Ltd | Formulations and processes for making a high conductivity copper pattern |
| US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
| TWI665332B (zh) * | 2017-03-16 | 2019-07-11 | 日商旭化成股份有限公司 | 分散體及使用該分散體的附導電性圖案之構造體的製造方法以及附導電性圖案之構造體 |
| US10812974B2 (en) * | 2017-05-06 | 2020-10-20 | Vmware, Inc. | Virtual desktop client connection continuity |
| TWI691403B (zh) * | 2017-07-18 | 2020-04-21 | 日商旭化成股份有限公司 | 銅配線 |
| WO2019022230A1 (ja) * | 2017-07-27 | 2019-01-31 | 旭化成株式会社 | 酸化銅インク及びこれを用いた導電性基板の製造方法、塗膜を含む製品及びこれを用いた製品の製造方法、導電性パターン付製品の製造方法、並びに、導電性パターン付製品 |
| JP7430483B2 (ja) * | 2017-11-10 | 2024-02-13 | 旭化成株式会社 | 導電性パターン領域付構造体及びその製造方法 |
| CA3082457C (en) * | 2017-11-14 | 2024-01-23 | Hitachi Chemical Company, Ltd. | A copper composition, its use as a conductor and the method of manufacture |
| JP7176847B2 (ja) * | 2018-03-15 | 2022-11-22 | 旭化成株式会社 | 分散体、塗膜を含む製品、導電性パターン付き構造体の製造方法、及び、導電性パターン付き構造体 |
| JP7099867B2 (ja) * | 2018-05-16 | 2022-07-12 | 日本化学工業株式会社 | 光焼結型組成物及びそれを用いた導電膜の形成方法 |
| JP7263124B2 (ja) * | 2018-05-30 | 2023-04-24 | 旭化成株式会社 | インクジェット用酸化銅インク及びこれを用いて導電性パターンを付与した導電性基板の製造方法 |
| JP7070988B2 (ja) | 2018-07-30 | 2022-05-18 | 旭化成株式会社 | 導電性フィルム、並びに、それを用いた導電性フィルムロール、電子ペーパー、タッチパネル、及びフラットパネルディスプレイ |
| CN115101239B (zh) | 2018-07-30 | 2025-08-15 | 旭化成株式会社 | 导电性薄膜、以及使用了其的导电性薄膜卷、电子纸、触摸面板和平板显示器 |
| CN118222142B (zh) * | 2024-05-22 | 2024-07-19 | 汕头大学 | 一种多功能水性涂料及其制备方法与应用 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129790A (ja) * | 2008-11-27 | 2010-06-10 | Tokyo Electron Ltd | 成膜方法 |
| WO2013073200A1 (ja) * | 2011-11-14 | 2013-05-23 | 石原薬品株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
Family Cites Families (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2091800A (en) * | 1931-09-15 | 1937-08-31 | Rohm & Haas | Method of hydrogenating esters |
| US3213145A (en) * | 1960-03-28 | 1965-10-19 | Standard Oil Co | Catalytic hydrogenation of esters of aromatic monocarboxylic acids to aryl-substituted methanols |
| JP2526989B2 (ja) * | 1988-05-20 | 1996-08-21 | 三菱瓦斯化学株式会社 | 芳香族多価アルコ―ルの製造方法 |
| US5158849A (en) * | 1990-10-25 | 1992-10-27 | Custom Papers Group Inc. | Composition useful in transparent conductive coatings |
| US5855818A (en) * | 1995-01-27 | 1999-01-05 | Rogers Corporation | Electrically conductive fiber filled elastomeric foam |
| TW505685B (en) * | 1997-09-05 | 2002-10-11 | Mitsubishi Materials Corp | Transparent conductive film and composition for forming same |
| US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
| MY125159A (en) * | 1998-09-14 | 2006-07-31 | Mitsubishi Materials Corp | Fine metal particle-dispersion solution and conductive film using the same |
| JP3545974B2 (ja) * | 1999-08-16 | 2004-07-21 | 日本パーカライジング株式会社 | 金属材料のりん酸塩化成処理方法 |
| US7858818B2 (en) * | 2001-01-31 | 2010-12-28 | Momentive Performance Materials Inc. | Nanosized copper catalyst precursors for the direct synthesis of trialkoxysilanes |
| CN100395059C (zh) * | 2001-12-18 | 2008-06-18 | 旭化成株式会社 | 金属氧化物分散体、由其得到的金属薄膜和生产该金属薄膜的方法 |
| US8252961B2 (en) * | 2002-04-22 | 2012-08-28 | The Curators Of The University Of Missouri | Method of producing lower alcohols from glycerol |
| US7663004B2 (en) * | 2002-04-22 | 2010-02-16 | The Curators Of The University Of Missouri | Method of producing lower alcohols from glycerol |
| US20100009540A1 (en) * | 2002-09-25 | 2010-01-14 | Asahi Glass Company Limited | Polishing compound, its production process and polishing method |
| CN100488339C (zh) * | 2003-05-16 | 2009-05-13 | 播磨化成株式会社 | 形成微细铜颗粒烧结产物类的微细形状导电体的方法 |
| JP4493942B2 (ja) | 2003-06-26 | 2010-06-30 | 旭化成イーマテリアルズ株式会社 | 酸化第一銅コロイド分散液 |
| JP4407311B2 (ja) * | 2004-02-20 | 2010-02-03 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| US7238654B2 (en) * | 2004-05-17 | 2007-07-03 | Phibro-Tech, Inc. | Compatibilizing surfactant useful with slurries of copper particles |
| BR122017019084B1 (pt) * | 2004-08-31 | 2018-08-14 | Sumitomo Metal Mining Co., Ltd. | Artigo eletrocondutor transparente, métodos para fabricar o artigo eletrocondutor transparente, e as nanopartículas de óxido compósito, dispersão de nanopartícula de proteção contra o infravermelho, e, nanopartículas de proteção contra o infravermelho |
| US7771625B2 (en) * | 2004-11-29 | 2010-08-10 | Dainippon Ink And Chemicals, Inc. | Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder |
| WO2006076612A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices |
| EP1853537A2 (en) * | 2005-02-24 | 2007-11-14 | A Periana Roy | New catalytic systems for the conversion of hydrocarbons to functionalized products |
| DE102005043242A1 (de) * | 2005-09-09 | 2007-03-15 | Basf Ag | Dispersion zum Aufbringen einer Metallschicht |
| JP4839767B2 (ja) * | 2005-10-14 | 2011-12-21 | 東洋インキScホールディングス株式会社 | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性パターン。 |
| US8084401B2 (en) * | 2006-01-25 | 2011-12-27 | Clearwater International, Llc | Non-volatile phosphorus hydrocarbon gelling agent |
| WO2008013199A1 (fr) * | 2006-07-28 | 2008-01-31 | The Furukawa Electric Co., Ltd. | DISPERSION DE FINES PARTICULES ET procédé de fabrication de DISPERSION DE FINES PARTICULES |
| JP2008144010A (ja) * | 2006-12-08 | 2008-06-26 | Konica Minolta Holdings Inc | 樹脂組成物の製造方法及び樹脂組成物フィルム |
| KR101184674B1 (ko) * | 2007-03-15 | 2012-09-20 | 디아이씨 가부시끼가이샤 | 볼록판 반전 인쇄용 도전성 잉크 |
| US7976733B2 (en) * | 2007-11-30 | 2011-07-12 | Xerox Corporation | Air stable copper nanoparticle ink and applications therefor |
| US20090214764A1 (en) * | 2008-02-26 | 2009-08-27 | Xerox Corporation | Metal nanoparticles stabilized with a bident amine |
| US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| US20110139228A1 (en) * | 2008-08-27 | 2011-06-16 | Mitsubishi Materials Corporation | Transparent electroconductive film for solar cell, composition for transparent electroconductive film and multi-junction solar cell |
| JP5531504B2 (ja) * | 2009-08-25 | 2014-06-25 | Dic株式会社 | 銀ナノ粒子を用いる接合体の製造方法、及び接合体 |
| KR101221780B1 (ko) | 2009-08-28 | 2013-01-11 | 주식회사 엘지화학 | 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법 |
| KR20120102599A (ko) * | 2009-09-18 | 2012-09-18 | 스미또모 가가꾸 가부시키가이샤 | 은-공액 화합물 복합체 |
| CN102596455B (zh) * | 2009-09-30 | 2015-02-04 | 大日本印刷株式会社 | 金属微粒分散体、导电性基板的制造方法及导电性基板 |
| US9272970B2 (en) * | 2010-07-09 | 2016-03-01 | Celanese International Corporation | Hydrogenolysis of ethyl acetate in alcohol separation processes |
| EP2604683B1 (en) * | 2010-08-12 | 2018-02-28 | Mitsui Chemicals, Inc. | Isopropyl alcohol-producing bacterium having improved productivity by gntr destruction |
| EP2468827B1 (en) * | 2010-12-21 | 2014-03-12 | Agfa-Gevaert | A dispersion comprising metallic, metal oxide or metal precursor nanoparticles |
| KR101260956B1 (ko) | 2011-02-25 | 2013-05-06 | 한화케미칼 주식회사 | 오프셋 또는 리버스오프셋 인쇄용 전도성 잉크 조성물 |
| JP5849426B2 (ja) | 2011-03-31 | 2016-01-27 | 大日本印刷株式会社 | 金属酸化物微粒子分散体、導電性基板及びその製造方法 |
| US9061894B2 (en) * | 2011-04-02 | 2015-06-23 | Institute Of Chemistry, Chinese Academy Of Sciences | Method for forming microelectrode-pair arrays on silicon substrate surface with hydrophobic silicon pillars |
| JP2013004309A (ja) * | 2011-06-16 | 2013-01-07 | Toyota Motor Corp | 金属ナノ粒子ペースト |
| JP6035887B2 (ja) * | 2011-06-21 | 2016-11-30 | セントラル硝子株式会社 | ポジ型レジスト組成物 |
| JP2013008907A (ja) * | 2011-06-27 | 2013-01-10 | Hitachi Chem Co Ltd | 導電性ペースト用酸化銅粉末、導電性ペースト用酸化銅粉末の製造方法、導電性ペースト及びこれを用いて得られる銅配線層 |
| FR2980791A1 (fr) * | 2011-10-03 | 2013-04-05 | Rhodia Operations | Procede de preparation d'un melange d'alcools |
| JP5772539B2 (ja) * | 2011-11-21 | 2015-09-02 | 日立化成株式会社 | 酸化銅ペースト及び金属銅層の製造方法 |
| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| CN104040641A (zh) * | 2011-12-07 | 2014-09-10 | 杜克大学 | 铜镍合金纳米导线的合成及其在透明导电膜中的应用 |
| KR101391697B1 (ko) * | 2011-12-14 | 2014-05-07 | 제일모직주식회사 | 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름 |
| KR101403865B1 (ko) * | 2011-12-16 | 2014-06-10 | 제일모직주식회사 | 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치 |
| KR101355855B1 (ko) * | 2011-12-19 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
| KR101355856B1 (ko) * | 2011-12-26 | 2014-01-27 | 제일모직주식회사 | 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름 |
| US9664009B2 (en) * | 2012-04-04 | 2017-05-30 | Weatherford Technologies, LLC | Apparatuses, systems, and methods for forming in-situ gel pills to lift liquids from horizontal wells |
| EP2875883B1 (en) * | 2012-07-19 | 2017-08-16 | Nof Corporation | Method for producing silver nanoparticles and silver nanoparticle dispersion liquid |
| WO2014052482A1 (en) * | 2012-09-25 | 2014-04-03 | University Of Connecticut Office Of Economic Development | Mesoporous metal oxides and processes for preparation thereof |
| JP6119763B2 (ja) * | 2012-10-15 | 2017-04-26 | 大日本印刷株式会社 | 導電性基板用金属粒子分散体及びその製造方法、並びに導電性基板の製造方法 |
| JP6237098B2 (ja) * | 2012-10-18 | 2017-11-29 | 大日本印刷株式会社 | 分散剤、導電性基板用金属粒子分散体、及び導電性基板の製造方法 |
| EP2911159A4 (en) * | 2012-10-24 | 2016-04-06 | Nat Inst For Materials Science | ADHESIVE BODY BETWEEN CONDUCTIVE POLYMETAL COMPLEX AND SUBSTRATE AND METHOD OF FORMING ADHESIVE BODY, CONDUCTIVE POLYMETAL COMPLEX DISPERSION LIQUID, METHOD FOR THE PRODUCTION AND USE THEREOF, AND METHOD OF LOOSING FILLING USING CONDUCTIVE MATERIAL |
| US20140127409A1 (en) * | 2012-11-06 | 2014-05-08 | Takuya Harada | Method for producing fine particle dispersion |
| WO2014130465A1 (en) * | 2013-02-19 | 2014-08-28 | Greenyug, Llc | Production of higher alcohols |
| JP5700864B2 (ja) * | 2013-05-15 | 2015-04-15 | 石原ケミカル株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
| WO2015002922A1 (en) * | 2013-07-02 | 2015-01-08 | Ut-Battelle, Llc | Catalytic conversion of alcohols having at least three carbon atoms to hydrocarbon blendstock |
-
2014
- 2014-07-22 US US14/906,422 patent/US10424648B2/en active Active
- 2014-07-22 KR KR1020157034234A patent/KR101849446B1/ko active Active
- 2014-07-22 EP EP14829560.3A patent/EP3026677B1/en active Active
- 2014-07-22 WO PCT/JP2014/069321 patent/WO2015012264A1/ja not_active Ceased
- 2014-07-22 CN CN201480040975.5A patent/CN105393312B/zh active Active
- 2014-07-22 JP JP2015528290A patent/JP6175500B2/ja active Active
- 2014-07-22 KR KR1020187006001A patent/KR102117579B1/ko active Active
-
2017
- 2017-05-15 JP JP2017096322A patent/JP6496351B2/ja active Active
-
2019
- 2019-08-14 US US16/540,446 patent/US20190371901A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129790A (ja) * | 2008-11-27 | 2010-06-10 | Tokyo Electron Ltd | 成膜方法 |
| WO2013073200A1 (ja) * | 2011-11-14 | 2013-05-23 | 石原薬品株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3026677A4 (en) | 2016-07-27 |
| JP6496351B2 (ja) | 2019-04-03 |
| EP3026677A1 (en) | 2016-06-01 |
| KR102117579B1 (ko) | 2020-06-01 |
| EP3026677B1 (en) | 2018-04-11 |
| JP6175500B2 (ja) | 2017-08-02 |
| WO2015012264A1 (ja) | 2015-01-29 |
| US10424648B2 (en) | 2019-09-24 |
| KR20160003840A (ko) | 2016-01-11 |
| JP2017143309A (ja) | 2017-08-17 |
| JPWO2015012264A1 (ja) | 2017-03-02 |
| CN105393312B (zh) | 2018-01-02 |
| US20190371901A1 (en) | 2019-12-05 |
| US20160155814A1 (en) | 2016-06-02 |
| KR20180024039A (ko) | 2018-03-07 |
| CN105393312A (zh) | 2016-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101849446B1 (ko) | 구리 및/또는 구리 산화물 분산체, 및 이 분산체를 이용하여 형성된 도전막 | |
| Chen et al. | Solution-processed metal-oxide thin-film transistors: A review of recent developments | |
| Li et al. | Coffee-ring defined short channels for inkjet-printed metal oxide thin-film transistors | |
| Kim et al. | Organic thin film transistor using silver electrodes by the ink-jet printing technology | |
| Choi et al. | Printed oxide thin film transistors: a mini review | |
| JP4730623B2 (ja) | 薄膜トランジスタ、薄膜トランジスタの製造方法、および電子機器 | |
| US20080020572A1 (en) | Electrically conductive feature fabrication process | |
| Han et al. | High performance metal oxide field-effect transistors with a reverse offset printed Cu source/drain electrode | |
| Wu et al. | Screen printing of graphene-based nanocomposite inks for flexible organic integrated circuits | |
| US9486996B2 (en) | Gravure printing process using silver nanoparticle inks for high quality conductive features | |
| WO2010053171A1 (ja) | スイッチング素子及びその製造方法 | |
| CN101192651A (zh) | 通过有机半导体材料的氧化和选择性还原以制造有机薄膜晶体管的方法 | |
| KR20170114084A (ko) | 탄소나노튜브를 포함하는 반도체 잉크 조성물 및 그의 박막트랜지스터 제조 방법 | |
| Zhang et al. | Printing flexible thin-film transistors | |
| KR20110080776A (ko) | 단분자가 도핑된 단일 벽 탄소 나노튜브 및 이를 이용한 박막 트랜지스터 | |
| CN106459640A (zh) | 导体组合物油墨、导体、层叠体、层叠布线基板及电子设备 | |
| Jeong et al. | Printed Cu source/drain electrode capped by CuO hole injection layer for organic thin film transistors | |
| KR20160014409A (ko) | 도전성 잉크 조성물, 도전체 및 전자 소자 | |
| JP2010093260A (ja) | 半導体インク配合物 | |
| WO2010038570A1 (ja) | 機能性層の製造方法、機能性層及び電子デバイス | |
| Li et al. | Effect of hydrochloric acid solvent vapor annealing on spray coated silver electrode | |
| Wu et al. | Development of silver nanoparticle ink for printed electronics | |
| JP2015005618A (ja) | 有機半導体膜の製造方法、有機半導体膜、薄膜トランジスタ、アクティブマトリクス装置、電気光学装置および電子機器 | |
| JP6620556B2 (ja) | 機能材料の積層方法及び機能材料積層体 | |
| CA2974286A1 (en) | Device comprising dielectric interlayer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| AMND | Amendment | ||
| PA0105 | International application |
Patent event date: 20151201 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20151201 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20170302 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20171129 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20170302 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| AMND | Amendment | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20180228 |
|
| PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20171129 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20170703 Comment text: Amendment to Specification, etc. Patent event code: PX09012R01I Patent event date: 20151201 Comment text: Amendment to Specification, etc. |
|
| PX0701 | Decision of registration after re-examination |
Patent event date: 20180319 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20180228 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20171129 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20170703 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20151201 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
|
| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20180410 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20180410 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20210325 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20220323 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240315 Start annual number: 7 End annual number: 7 |