JP2016527665A5 - - Google Patents
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- Publication number
- JP2016527665A5 JP2016527665A5 JP2016519553A JP2016519553A JP2016527665A5 JP 2016527665 A5 JP2016527665 A5 JP 2016527665A5 JP 2016519553 A JP2016519553 A JP 2016519553A JP 2016519553 A JP2016519553 A JP 2016519553A JP 2016527665 A5 JP2016527665 A5 JP 2016527665A5
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- polymer thick
- film copper
- copper conductor
- conductor composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000003381 stabilizer Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 4
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- OILFVDKXWWPVNO-UHFFFAOYSA-N ethyl n-phenoxycarbamate Chemical compound CCOC(=O)NOC1=CC=CC=C1 OILFVDKXWWPVNO-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 4
- 239000010452 phosphate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 14
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 235000011090 malic acid Nutrition 0.000 description 3
- 239000001630 malic acid Substances 0.000 description 3
- 235000002906 tartaric acid Nutrition 0.000 description 3
- 239000011975 tartaric acid Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- GAJQCIFYLSXSEZ-UHFFFAOYSA-N tridecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCOP(O)(O)=O GAJQCIFYLSXSEZ-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/916,759 US9190188B2 (en) | 2013-06-13 | 2013-06-13 | Photonic sintering of polymer thick film copper conductor compositions |
| US13/916,759 | 2013-06-13 | ||
| PCT/US2014/041196 WO2015050589A2 (en) | 2013-06-13 | 2014-06-06 | Photonic sintering of polymer thick film copper conductor compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016527665A JP2016527665A (ja) | 2016-09-08 |
| JP2016527665A5 true JP2016527665A5 (enExample) | 2017-07-20 |
Family
ID=52018433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016519553A Pending JP2016527665A (ja) | 2013-06-13 | 2014-06-06 | ポリマー厚膜銅導体組成物の光焼結 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9190188B2 (enExample) |
| EP (1) | EP3008735B1 (enExample) |
| JP (1) | JP2016527665A (enExample) |
| CN (1) | CN105264614B (enExample) |
| WO (1) | WO2015050589A2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5275498B1 (ja) * | 2012-07-03 | 2013-08-28 | 石原薬品株式会社 | 導電膜形成方法及び焼結進行剤 |
| JP5941588B2 (ja) * | 2014-09-01 | 2016-06-29 | Ｄｏｗａエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
| WO2016060838A1 (en) * | 2014-10-14 | 2016-04-21 | Sun Chemical Corporation | Thermoformable conductive inks and coatings and a process for fabrication of a thermoformed device |
| US9649730B2 (en) * | 2015-08-12 | 2017-05-16 | E I Du Pont De Nemours And Company | Paste and process for forming a solderable polyimide-based polymer thick film conductor |
| US20170044382A1 (en) * | 2015-08-12 | 2017-02-16 | E I Du Pont De Nemours And Company | Process for forming a solderable polyimide-based polymer thick film conductor |
| US9637647B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a polymer thick film copper conductor composition |
| US9637648B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a solderable polymer thick film copper conductor composition |
| JP6505572B2 (ja) * | 2015-09-30 | 2019-04-24 | 日東電工株式会社 | 加熱接合用シート及びダイシングテープ付き加熱接合用シート |
| JP6509770B2 (ja) * | 2016-03-31 | 2019-05-08 | Ｊｘ金属株式会社 | 導電性金属粉ペースト |
| EP3282453B1 (en) | 2016-08-11 | 2023-07-12 | Henkel AG & Co. KGaA | Improved processing of polymer based inks and pastes |
| JP7048193B2 (ja) * | 2016-11-17 | 2022-04-05 | 日本化学工業株式会社 | 亜酸化銅粒子の製造方法 |
| WO2018169012A1 (ja) * | 2017-03-16 | 2018-09-20 | 旭化成株式会社 | 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体 |
| US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
| WO2019017363A1 (ja) | 2017-07-18 | 2019-01-24 | 旭化成株式会社 | 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線 |
| EP3660112B1 (en) * | 2017-07-27 | 2021-08-25 | Asahi Kasei Kabushiki Kaisha | Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern |
| TWI652695B (zh) * | 2017-08-16 | 2019-03-01 | 昇貿科技股份有限公司 | 一種液狀組成物 |
| JP7099867B2 (ja) * | 2018-05-16 | 2022-07-12 | 日本化学工業株式会社 | 光焼結型組成物及びそれを用いた導電膜の形成方法 |
| US11929341B2 (en) * | 2018-06-26 | 2024-03-12 | Alpha Assembly Solutions Inc. | Nano copper paste and film for sintered die attach and similar applications |
| SG11202100308YA (en) | 2018-08-08 | 2021-02-25 | Mitsui Mining & Smelting Co | Bonding composition, conductor bonding structure, and method for producing same |
| CN111867264B (zh) * | 2019-04-30 | 2021-10-22 | 云谷（固安）科技有限公司 | 导电线的制造方法、可拉伸显示器件以及可拉伸显示器件的制造方法 |
| JP7766900B2 (ja) * | 2021-02-05 | 2025-11-11 | 株式会社マテリアル・コンセプト | 銅ペースト |
| WO2024034662A1 (ja) * | 2022-08-10 | 2024-02-15 | 株式会社マテリアル・コンセプト | 銅ペースト |
| CN115642000B (zh) * | 2022-12-23 | 2023-04-07 | 西北工业大学 | 一种可光子烧结的导电铜浆制备方法 |
| CN117820898B (zh) * | 2023-12-25 | 2025-10-17 | 之江实验室 | 一种硼化锆浆料的制备方法及硼化锆薄膜 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3564636D1 (en) * | 1984-07-31 | 1988-09-29 | Mitsubishi Petrochemical Co | Copper-type conductive coating composition |
| JPH064791B2 (ja) * | 1985-09-30 | 1994-01-19 | タツタ電線株式会社 | 導電塗料 |
| US4687597A (en) * | 1986-01-29 | 1987-08-18 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| DE3782522T2 (de) | 1986-03-31 | 1993-06-03 | Tatsuta Densen Kk | Leitfaehige kupferpastenzusammensetzung. |
| JPS62230869A (ja) * | 1986-03-31 | 1987-10-09 | Tatsuta Electric Wire & Cable Co Ltd | 半田付可能な導電塗料 |
| JPS6420276A (en) * | 1987-07-15 | 1989-01-24 | Mitsubishi Petrochemical Co | Copper-containing electroconductive coating composition |
| US5064469A (en) * | 1989-10-03 | 1991-11-12 | Akzo N.V. | Preparation of oxidation resistant metal powder |
| JPH0412595A (ja) * | 1990-05-02 | 1992-01-17 | Mitsubishi Petrochem Co Ltd | 導電性ペースト組成物 |
| JPH11217522A (ja) * | 1998-02-04 | 1999-08-10 | Sumitomo Rubber Ind Ltd | 導電性ペーストとそれを用いたプリント基板、ならびにその製造方法 |
| JP2006117959A (ja) * | 2004-10-19 | 2006-05-11 | Fukuda Metal Foil & Powder Co Ltd | 電子材料用銅粉 |
| JP5408878B2 (ja) * | 2004-11-24 | 2014-02-05 | エヌシーシー ナノ， エルエルシー | ナノ材料組成物の電気的使用、めっき的使用および触媒的使用 |
| CN101237952B (zh) * | 2005-04-20 | 2012-08-15 | 法布罗技术有限公司 | 微粒铜粉的制备 |
| US8945686B2 (en) | 2007-05-24 | 2015-02-03 | Ncc | Method for reducing thin films on low temperature substrates |
| US8506849B2 (en) | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| US20110180137A1 (en) | 2010-01-25 | 2011-07-28 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
| CN102812520B (zh) * | 2010-03-18 | 2016-10-19 | 古河电气工业株式会社 | 导电性糊料和由该糊料得到的导电连接部件 |
| US8419981B2 (en) * | 2010-11-15 | 2013-04-16 | Cheil Industries, Inc. | Conductive paste composition and electrode prepared using the same |
| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| WO2013081664A1 (en) | 2011-12-02 | 2013-06-06 | E. I. Du Pont De Nemours And Company | Conductive metal composition |
-
2013
- 2013-06-13 US US13/916,759 patent/US9190188B2/en active Active
-
2014
- 2014-06-06 JP JP2016519553A patent/JP2016527665A/ja active Pending
- 2014-06-06 EP EP14830901.6A patent/EP3008735B1/en not_active Not-in-force
- 2014-06-06 WO PCT/US2014/041196 patent/WO2015050589A2/en not_active Ceased
- 2014-06-06 CN CN201480032685.6A patent/CN105264614B/zh not_active Expired - Fee Related
-
2015
- 2015-10-12 US US14/880,994 patent/US20160035455A1/en not_active Abandoned
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