JP2016527665A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016527665A5 JP2016527665A5 JP2016519553A JP2016519553A JP2016527665A5 JP 2016527665 A5 JP2016527665 A5 JP 2016527665A5 JP 2016519553 A JP2016519553 A JP 2016519553A JP 2016519553 A JP2016519553 A JP 2016519553A JP 2016527665 A5 JP2016527665 A5 JP 2016527665A5
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- polymer thick
- film copper
- copper conductor
- conductor composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000003381 stabilizer Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 4
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- OILFVDKXWWPVNO-UHFFFAOYSA-N ethyl n-phenoxycarbamate Chemical compound CCOC(=O)NOC1=CC=CC=C1 OILFVDKXWWPVNO-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 4
- 239000010452 phosphate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 14
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 235000011090 malic acid Nutrition 0.000 description 3
- 239000001630 malic acid Substances 0.000 description 3
- 235000002906 tartaric acid Nutrition 0.000 description 3
- 239000011975 tartaric acid Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- GAJQCIFYLSXSEZ-UHFFFAOYSA-N tridecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCOP(O)(O)=O GAJQCIFYLSXSEZ-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/916,759 US9190188B2 (en) | 2013-06-13 | 2013-06-13 | Photonic sintering of polymer thick film copper conductor compositions |
| US13/916,759 | 2013-06-13 | ||
| PCT/US2014/041196 WO2015050589A2 (en) | 2013-06-13 | 2014-06-06 | Photonic sintering of polymer thick film copper conductor compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016527665A JP2016527665A (ja) | 2016-09-08 |
| JP2016527665A5 true JP2016527665A5 (enExample) | 2017-07-20 |
Family
ID=52018433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016519553A Pending JP2016527665A (ja) | 2013-06-13 | 2014-06-06 | ポリマー厚膜銅導体組成物の光焼結 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9190188B2 (enExample) |
| EP (1) | EP3008735B1 (enExample) |
| JP (1) | JP2016527665A (enExample) |
| CN (1) | CN105264614B (enExample) |
| WO (1) | WO2015050589A2 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5275498B1 (ja) * | 2012-07-03 | 2013-08-28 | 石原薬品株式会社 | 導電膜形成方法及び焼結進行剤 |
| JP5941588B2 (ja) * | 2014-09-01 | 2016-06-29 | Ｄｏｗａエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
| US10544317B2 (en) * | 2014-10-14 | 2020-01-28 | Sun Chemical Corporation | Thermoformable conductive inks and coatings and a process for fabrication of a thermoformed device |
| US20170044382A1 (en) * | 2015-08-12 | 2017-02-16 | E I Du Pont De Nemours And Company | Process for forming a solderable polyimide-based polymer thick film conductor |
| US9649730B2 (en) * | 2015-08-12 | 2017-05-16 | E I Du Pont De Nemours And Company | Paste and process for forming a solderable polyimide-based polymer thick film conductor |
| US9637647B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a polymer thick film copper conductor composition |
| US9637648B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a solderable polymer thick film copper conductor composition |
| JP6505572B2 (ja) * | 2015-09-30 | 2019-04-24 | 日東電工株式会社 | 加熱接合用シート及びダイシングテープ付き加熱接合用シート |
| JP6509770B2 (ja) * | 2016-03-31 | 2019-05-08 | Ｊｘ金属株式会社 | 導電性金属粉ペースト |
| EP3282453B1 (en) | 2016-08-11 | 2023-07-12 | Henkel AG & Co. KGaA | Improved processing of polymer based inks and pastes |
| US10870587B2 (en) * | 2016-11-17 | 2020-12-22 | Nippon Chemical Industrial Co., Ltd. | Cuprous oxide particle, method of producing the same, photosintering composition, method of forming conductive film using the same and paste of cuprous oxide particles |
| TWI665332B (zh) | 2017-03-16 | 2019-07-11 | 日商旭化成股份有限公司 | 分散體及使用該分散體的附導電性圖案之構造體的製造方法以及附導電性圖案之構造體 |
| US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
| TWI691403B (zh) | 2017-07-18 | 2020-04-21 | 日商旭化成股份有限公司 | 銅配線 |
| WO2019022230A1 (ja) * | 2017-07-27 | 2019-01-31 | 旭化成株式会社 | 酸化銅インク及びこれを用いた導電性基板の製造方法、塗膜を含む製品及びこれを用いた製品の製造方法、導電性パターン付製品の製造方法、並びに、導電性パターン付製品 |
| TWI652695B (zh) * | 2017-08-16 | 2019-03-01 | 昇貿科技股份有限公司 | Liquid composition |
| JP7099867B2 (ja) * | 2018-05-16 | 2022-07-12 | 日本化学工業株式会社 | 光焼結型組成物及びそれを用いた導電膜の形成方法 |
| KR102486410B1 (ko) * | 2018-06-26 | 2023-01-09 | 알파 어셈블리 솔루션스 인크. | 소결된 다이 부착 및 유사한 응용을 위한 나노구리 페이스트 및 필름 |
| WO2020032161A1 (ja) | 2018-08-08 | 2020-02-13 | 三井金属鉱業株式会社 | 接合用組成物、並びに導電体の接合構造及びその製造方法 |
| CN111867264B (zh) * | 2019-04-30 | 2021-10-22 | 云谷（固安）科技有限公司 | 导电线的制造方法、可拉伸显示器件以及可拉伸显示器件的制造方法 |
| JP7766900B2 (ja) * | 2021-02-05 | 2025-11-11 | 株式会社マテリアル・コンセプト | 銅ペースト |
| CN115642000B (zh) * | 2022-12-23 | 2023-04-07 | 西北工业大学 | 一种可光子烧结的导电铜浆制备方法 |
| CN117820898B (zh) * | 2023-12-25 | 2025-10-17 | 之江实验室 | 一种硼化锆浆料的制备方法及硼化锆薄膜 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4663079A (en) * | 1984-07-31 | 1987-05-05 | Mitsubishi Petrochemical Co., Ltd. | Copper-type conductive coating composition |
| JPH064791B2 (ja) * | 1985-09-30 | 1994-01-19 | タツタ電線株式会社 | 導電塗料 |
| US4687597A (en) * | 1986-01-29 | 1987-08-18 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| JPS62230869A (ja) * | 1986-03-31 | 1987-10-09 | Tatsuta Electric Wire & Cable Co Ltd | 半田付可能な導電塗料 |
| DE3782522T2 (de) | 1986-03-31 | 1993-06-03 | Tatsuta Densen Kk | Leitfaehige kupferpastenzusammensetzung. |
| JPS6420276A (en) * | 1987-07-15 | 1989-01-24 | Mitsubishi Petrochemical Co | Copper-containing electroconductive coating composition |
| US5064469A (en) * | 1989-10-03 | 1991-11-12 | Akzo N.V. | Preparation of oxidation resistant metal powder |
| JPH0412595A (ja) * | 1990-05-02 | 1992-01-17 | Mitsubishi Petrochem Co Ltd | 導電性ペースト組成物 |
| JPH11217522A (ja) * | 1998-02-04 | 1999-08-10 | Sumitomo Rubber Ind Ltd | 導電性ペーストとそれを用いたプリント基板、ならびにその製造方法 |
| JP2006117959A (ja) * | 2004-10-19 | 2006-05-11 | Fukuda Metal Foil & Powder Co Ltd | 電子材料用銅粉 |
| US7820097B2 (en) | 2004-11-24 | 2010-10-26 | Ncc Nano, Llc | Electrical, plating and catalytic uses of metal nanomaterial compositions |
| JP5064379B2 (ja) * | 2005-04-20 | 2012-10-31 | フィブロ−テック，インコーポレイテッド | 銅粉末の生成方法、金属粉末の生成方法及びニッケル粉末の生成方法 |
| US8945686B2 (en) | 2007-05-24 | 2015-02-03 | Ncc | Method for reducing thin films on low temperature substrates |
| US8506849B2 (en) | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| US20110180137A1 (en) | 2010-01-25 | 2011-07-28 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
| EP2549488B1 (en) * | 2010-03-18 | 2016-06-08 | Furukawa Electric Co., Ltd. | Electrically conductive paste, and electrically conductive connection member produced using the paste |
| US8419981B2 (en) * | 2010-11-15 | 2013-04-16 | Cheil Industries, Inc. | Conductive paste composition and electrode prepared using the same |
| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| US9245664B2 (en) | 2011-12-02 | 2016-01-26 | E I Du Pont De Nemours And Company | Conductive metal ink |
-
2013
- 2013-06-13 US US13/916,759 patent/US9190188B2/en active Active
-
2014
- 2014-06-06 JP JP2016519553A patent/JP2016527665A/ja active Pending
- 2014-06-06 EP EP14830901.6A patent/EP3008735B1/en active Active
- 2014-06-06 CN CN201480032685.6A patent/CN105264614B/zh active Active
- 2014-06-06 WO PCT/US2014/041196 patent/WO2015050589A2/en not_active Ceased
-
2015
- 2015-10-12 US US14/880,994 patent/US20160035455A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016527665A5 (enExample) | ||
| JP2015210973A5 (enExample) | ||
| CN103173126A (zh) | 一种油漆 | |
| JP2018084740A5 (enExample) | ||
| TW201638244A (zh) | 導電性銅膏、導電性銅膏硬化膜及半導體裝置 | |
| CN105264614A (zh) | 聚合物厚膜铜导体组合物的光子烧结 | |
| CN105802441A (zh) | 一种水性石墨烯复合涂层、水性石墨烯复合涂料及其制备方法 | |
| JP2017111460A5 (enExample) | ||
| JP2013108005A (ja) | 導電性インク組成物 | |
| HRP20211271T1 (hr) | Pripravci aripiprazolskog predlijeka | |
| CN110591123B (zh) | 一种用于去除固化硅橡胶的溶解剂及其制备方法 | |
| MX2016002451A (es) | Chapa de acero electromagnetica con pelicula de recubrimiento aislante, metodo para producirla, y agente de recubrimiento para formar una pelicula de recubrimiento aislante. | |
| JP2019119635A5 (enExample) | ||
| CN102101962A (zh) | 一种聚苯胺环氧防腐涂料及其制备方法 | |
| TWI734697B (zh) | 具有改良導電性之墨水組合物 | |
| TWI567756B (zh) | 柔性基板用導電性糊組合物及其製備方法 | |
| MX376704B (es) | Composiciones curables formadoras de pelicula que demuestran resistencia al bruñido y bajo brillo, y metodos para mejorar la resistencia al bruñido de un sustrato. | |
| JP2017135058A5 (enExample) | ||
| JP2018525789A5 (enExample) | ||
| CN104145000A (zh) | 电路连接材料及使用其的安装体的制造方法 | |
| TW201736528A (zh) | 導電膏 | |
| JP2018529001A5 (enExample) | ||
| CN104464993B (zh) | 一种低温固化静电抑制器功能浆料的制备方法 | |
| DE102005050428A1 (de) | Gleitmittel für Lackdrähte | |
| CN104562722B (zh) | 一种水性绝缘合成革及其制备方法 |