JP5972172B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5972172B2 JP5972172B2 JP2012544134A JP2012544134A JP5972172B2 JP 5972172 B2 JP5972172 B2 JP 5972172B2 JP 2012544134 A JP2012544134 A JP 2012544134A JP 2012544134 A JP2012544134 A JP 2012544134A JP 5972172 B2 JP5972172 B2 JP 5972172B2
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- 239000004065 semiconductor Substances 0.000 title claims description 82
- 239000000758 substrate Substances 0.000 claims description 96
- 230000000149 penetrating effect Effects 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 44
- 230000000903 blocking effect Effects 0.000 claims description 39
- 238000005452 bending Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 description 67
- 229920005989 resin Polymers 0.000 description 67
- 229910000679 solder Inorganic materials 0.000 description 20
- 238000009413 insulation Methods 0.000 description 18
- 230000035515 penetration Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Description
図1は、この発明の実施の形態1にかかる半導体装置について示す説明図である。図1(a)には、パワーモジュール100のパッケージ101の要部平面図を示す。図1(b)には、図1(a)の切断線X−X’における断面図を示す。図1(c)には、図1(a)の切断線Y−Y’における断面図を示す。図1(b),1(c)には、図1(a)の各切断線近傍に示す白抜き矢印の方向から見たパワーモジュール100を示す。図1(d)には、図1(b)の絶縁基板2近傍Aを拡大して示す。
図10は、この発明の実施の形態2にかかる半導体装置の要部について示す断面図である。また、図11は、図10に示す半導体装置の要部について示す断面図である。図10には、パワーモジュール200を構成する制御端子6を樹脂ケース7に挿入したときの要部断面図を示す。図11(a)は、図10のパワーモジュール200のパッケージ101を構成する制御端子6を突起部10が設けられていない側面側から見た断面図である。図11(b)は、図11(a)に示す制御端子6を突起部10が設けられた側面側(白抜き左向矢印Kで示す方向)から見た断面図である。
図12は、この発明の実施の形態3にかかる半導体装置の要部について示す断面図である。図12には、パワーモジュール300を構成する制御端子6を樹脂ケース7に挿入したときの要部断面図を示す。
図13は、この発明の実施の形態4にかかる半導体装置の要部について示す断面図である。図13には、パワーモジュール400を構成する制御端子6を樹脂ケース7に挿入したときの要部断面図を示す。
2 絶縁基板
3 はんだ
4 半導体チップ
5 主端子
6 制御端子
6a 制御端子の貫通部
6b 制御端子のL字加工部
6c 制御端子の接続部
6aa,6bb,6cc,21 制御端子の側面
7 樹脂ケース
8 樹脂ケースの側壁
9 樹脂ケースの蓋
9a 樹脂ケースの貫通孔
9b 樹脂ケースの突起受け部
9c 樹脂ケースの凸部
10,20,30 突起部
10a,23 突起部の下端面
11 第1阻止部
12 第2阻止部
13 ボンディングワイヤ
14 金属平板
15 制御端子の長手方向
16 コネクタ
22 貫通孔の側壁
41 切り欠き部
42 貫通孔の側壁
43 切り欠きの上部側壁
44 切り欠きの下部側壁
100,200,300,400 パワーモジュール
101 パッケージ
Claims (3)
- 絶縁基板と、
前記絶縁基板に接合され、当該絶縁基板に接合された半導体チップと電気的に接続された制御端子と、
前記制御端子が貫通するケースと、
前記絶縁基板に対する方向への前記制御端子の移動を阻止する第1阻止部と、
前記絶縁基板から離れる方向への前記制御端子の移動を阻止する第2阻止部と、
を備え、
前記制御端子は、前記ケースの蓋を貫通する貫通部と、
前記貫通部に対しほぼ直角に連結され、当該貫通部とL字形状を形成するL字部材と、
前記L字部材の底面部に一端が連結され、かつ前記絶縁基板に他端が接合された接続部と、を備え、さらに、
前記貫通部に設けられ、前記ケースの前記蓋のおもて面に接触する第1突起部を有し、
前記貫通部に前記第1突起部と離れて設けられ、前記ケースの前記蓋の裏面に接触する第2突起部を有し、
前記第1阻止部は前記第1突起部であり、
前記第2阻止部は前記第2突起部であり、
前記制御端子の前記貫通部、前記L字部材および前記接続部が、当該貫通部の先端と当該接続部の先端が反対方向となるように、当該貫通部の長手方向と当該L字部材の長手方向および当該L字部材の長手方向と当該接続部の長手方向が直交して連続する平板部材であり、
前記L字部材の底面部の側面となる部分が前記貫通部の側面に対してほぼ直角に、前記L字部材の長手方向の端部に沿って、前記平板部材を折り曲げることによって形成され、
前記接続部の側面となる部分が前記L字部材の底面部の側面に対して前記貫通部と反対側にほぼ直角に、前記L字部材の長手方向の端部に沿って、前記平板部材を折り曲げ、かつ、前記貫通部の側面とほぼ平行にすることによって形成され、
前記第1突起部および前記第2突起部は、前記貫通部の側面に形成されることを特徴とする半導体装置。 - 絶縁基板と、
前記絶縁基板に接合され、当該絶縁基板に接合された半導体チップと電気的に接続された制御端子と、
前記制御端子が貫通するケースと、
前記絶縁基板に対する方向への前記制御端子の移動を阻止する第1阻止部と、
前記絶縁基板から離れる方向への前記制御端子の移動を阻止する第2阻止部と、
を備え、
前記制御端子は、前記ケースの蓋を貫通する貫通部と、
前記貫通部に対しほぼ直角に連結され、当該貫通部とL字形状を形成するL字部材と、
前記L字部材の底面部に一端が連結され、かつ前記絶縁基板に他端が接合された接続部と、を備え、さらに、
前記貫通部に設けられ、前記ケースの前記蓋を挟みこみ、前記ケースの前記蓋のおもて面および裏面に接触する切り欠き部を有し、
前記第1阻止部は、前記ケースの前記蓋のおもて面に接触する前記切り欠き部の側壁であり、
前記第2阻止部は、前記ケースの前記蓋の裏面に接触する前記切り欠き部の側壁であり、
前記制御端子の前記貫通部、前記L字部材および前記接続部が、当該貫通部の先端と当該接続部の先端が反対方向となるように、当該貫通部の長手方向と当該L字部材の長手方向および当該L字部材の長手方向と当該接続部の長手方向が直交して連続する平板部材であり、
前記L字部材の底面部の側面となる部分が前記貫通部の側面に対してほぼ直角に、前記L字部材の長手方向の端部に沿って、前記平板部材を折り曲げることによって形成され、
前記接続部の側面となる部分が前記L字部材の底面部の側面に対して前記貫通部と反対側にほぼ直角に、前記L字部材の長手方向の端部に沿って、前記平板部材を折り曲げ、かつ、前記貫通部の側面とほぼ平行にすることによって形成され、
前記切り欠き部は、前記貫通部の側面に形成されることを特徴とする半導体装置。 - 前記平板部材が、1枚の金属平板から切り出された連続する部材であることを特徴とする請求項1または2に記載の半導体装置。
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US9171768B2 (en) | 2011-09-28 | 2015-10-27 | Fuji Electric Co., Ltd. | Semiconductor device |
CN105074919B (zh) | 2013-02-26 | 2018-03-30 | 三菱电机株式会社 | 电力用半导体装置 |
JP6057016B2 (ja) * | 2014-03-19 | 2017-01-11 | 富士電機株式会社 | 半導体装置及びその製造方法 |
JP6233528B2 (ja) * | 2014-10-14 | 2017-11-22 | 富士電機株式会社 | 半導体装置 |
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JP6350765B2 (ja) | 2016-01-15 | 2018-07-04 | 富士電機株式会社 | 半導体装置 |
CN108010892B (zh) * | 2016-11-02 | 2020-06-26 | 株洲中车时代电气股份有限公司 | 一种功率半导体模块焊接装置 |
JP6806024B2 (ja) * | 2017-10-03 | 2020-12-23 | 三菱電機株式会社 | 半導体装置 |
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