JP2021150606A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2021150606A JP2021150606A JP2020051584A JP2020051584A JP2021150606A JP 2021150606 A JP2021150606 A JP 2021150606A JP 2020051584 A JP2020051584 A JP 2020051584A JP 2020051584 A JP2020051584 A JP 2020051584A JP 2021150606 A JP2021150606 A JP 2021150606A
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- H—ELECTRICITY
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H01—ELECTRIC ELEMENTS
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
10 放熱板
11 取付穴
20 樹脂筐体
21 ナット収容開口
22 端子面
22e 第1折り曲げ当接部
23 突起部
23e 第2折り曲げ当接部
24 段差部
240 ステップ面
241 ステップ壁
30 外部端子
31 第1端子
32 第2端子
33 第1締結孔
34 第2締結孔
40 端子ナット
41 配線
42 端子金具
43 締結ネジ
50 半導体素子
54 回路領域
Claims (8)
- 1又は2以上の半導体素子が配置される回路領域を一主面上に有する放熱板と、
前記半導体素子に接続され、締結孔を有する一対の端子と、
前記放熱板の前記回路領域を覆い前記半導体素子を封止するとともに、上面に形成された端子面と、長手方向の一対の側面と、短手方向の一対の前後面とを有し、端子ナットを埋没させるためのナット収容開口が前記端子面に形成された樹脂筐体と、を備え、
前記樹脂筐体は、一対の前記端子の夫々に当接し、前記端子の折り曲げ位置を規定する一対の折り曲げ当接部を有し、
一方の前記端子に対応する一方の前記折り曲げ当接部と、他方の前記端子に対応する他方の前記折り曲げ当接部は、異なる高さに形成されており、
前記一対の端子は、前記ナット収容開口を挟む位置において前記樹脂筐体から突出し、前記ナット収容開口上において互いに重複するようにそれぞれ折り曲げられており、前記締結孔が前記ナット収容開口と対向することを特徴とする半導体装置。 - 一対の前記端子は、前記樹脂筐体の前記側面から互いに離間する方向に向かって突出しており、一対の前記側面に沿ってそれぞれ折り曲げられている前記端子が、前記ナット収容開口上において互いに重複するようにそれぞれ更に折り曲げられており、前記締結孔が前記ナット収容開口と対向することを特徴とする請求項1に記載の半導体装置。
- 一対の前記端子の重複部分は、略平行であることを特徴とする請求項1又は2に記載の半導体装置。
- 一対の前記折り曲げ当接部の何れか一方は、前記端子面の縁部に形成された突起部であることを特徴とする請求項1乃至3のいずれかに記載の半導体装置。
- 前記折り曲げ当接部の一方は、前記端子面の縁部であり、
前記折り曲げ当接部の他方は、前記端子面の縁部に形成された突起部であることを特徴とする請求項1乃至3のいずれかに記載の半導体装置。 - 前記端子面の前記縁部は、前記端子面の上端から前記側面に形成された溝状の壁と、前記壁の下端から前記側面の間に形成された面とからなる一対の段差部を備え、
一対の前記端子は、前記段差部の前記面から筐体外に突出しており、前記側面に沿って折り曲げられている前記端子が、前記溝状の前記壁内に配置されていることを特徴する請求項4又は5に記載の半導体装置。 - 一対の前記折り曲げ当接部は、前記端子面の前記縁部に形成された異なる高さの一対の突起部であることを特徴とする請求項1乃至3に記載の半導体装置。
特徴とする請求項4乃至6のいずれかに記載の半導体装置。 - 前記樹脂筐体は、トランスファーモールド法を用いて形成されることを特徴とする請求項1乃至7のいずれかに記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020051584A JP6797505B1 (ja) | 2020-03-23 | 2020-03-23 | 半導体装置 |
CN202080011632.1A CN113728427B (zh) | 2020-03-23 | 2020-11-20 | 半导体装置 |
PCT/JP2020/043338 WO2021192409A1 (ja) | 2020-03-23 | 2020-11-20 | 半導体装置 |
US17/413,962 US11935820B2 (en) | 2020-03-23 | 2020-11-20 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020051584A JP6797505B1 (ja) | 2020-03-23 | 2020-03-23 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6797505B1 JP6797505B1 (ja) | 2020-12-09 |
JP2021150606A true JP2021150606A (ja) | 2021-09-27 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020051584A Active JP6797505B1 (ja) | 2020-03-23 | 2020-03-23 | 半導体装置 |
Country Status (4)
Country | Link |
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US (1) | US11935820B2 (ja) |
JP (1) | JP6797505B1 (ja) |
CN (1) | CN113728427B (ja) |
WO (1) | WO2021192409A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07114254B2 (ja) | 1991-11-13 | 1995-12-06 | 株式会社三社電機製作所 | インテリジェントパワーモジュール |
JPH06120390A (ja) | 1992-10-05 | 1994-04-28 | Fuji Electric Co Ltd | 樹脂封止形半導体装置の端子構造 |
JP3481735B2 (ja) * | 1995-07-26 | 2003-12-22 | 株式会社東芝 | 半導体装置 |
JPH0969603A (ja) * | 1995-09-01 | 1997-03-11 | Mitsubishi Electric Corp | 電力用半導体装置、その外装ケースとその製造方法 |
JP4092071B2 (ja) * | 2000-11-30 | 2008-05-28 | 三菱電機株式会社 | 半導体パワーモジュール |
JP4540884B2 (ja) * | 2001-06-19 | 2010-09-08 | 三菱電機株式会社 | 半導体装置 |
JP5767921B2 (ja) * | 2011-09-15 | 2015-08-26 | 新電元工業株式会社 | 半導体装置 |
JP2015173138A (ja) * | 2012-07-19 | 2015-10-01 | 富士電機株式会社 | 半導体モジュールの端子製造方法 |
JP2016157826A (ja) * | 2015-02-25 | 2016-09-01 | カルソニックカンセイ株式会社 | パワーモジュール構造およびその製造方法 |
DE112015006738B4 (de) | 2015-07-27 | 2024-05-08 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
-
2020
- 2020-03-23 JP JP2020051584A patent/JP6797505B1/ja active Active
- 2020-11-20 US US17/413,962 patent/US11935820B2/en active Active
- 2020-11-20 WO PCT/JP2020/043338 patent/WO2021192409A1/ja active Application Filing
- 2020-11-20 CN CN202080011632.1A patent/CN113728427B/zh active Active
Also Published As
Publication number | Publication date |
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WO2021192409A1 (ja) | 2021-09-30 |
JP6797505B1 (ja) | 2020-12-09 |
US11935820B2 (en) | 2024-03-19 |
CN113728427A (zh) | 2021-11-30 |
CN113728427B (zh) | 2023-11-21 |
US20220181226A1 (en) | 2022-06-09 |
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