JP5956465B2 - 電子部品収納用パッケージおよび電子装置 - Google Patents
電子部品収納用パッケージおよび電子装置 Download PDFInfo
- Publication number
- JP5956465B2 JP5956465B2 JP2013550330A JP2013550330A JP5956465B2 JP 5956465 B2 JP5956465 B2 JP 5956465B2 JP 2013550330 A JP2013550330 A JP 2013550330A JP 2013550330 A JP2013550330 A JP 2013550330A JP 5956465 B2 JP5956465 B2 JP 5956465B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring conductor
- electronic component
- dielectric
- substrate
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
3:基板
3a:誘電体領域
3b:載置領域
5:枠体
5a:第1の部分
5b:突出部
5c:第2の部分
6:誘電体部材
7・・・配線導体
7a・・・第1の配線導体
7b・・・第2の配線導体
9・・・接地導体
11・・・ボンディングワイヤ
13・・・載置基板
19・・・ビア導体
21・・・リード端子
101・・・電子装置
103・・・電子部品
105・・・蓋体
Claims (3)
- 誘電体から成る誘電体領域および上面に電子部品が載置される載置領域を有する基板部と、誘電体から成り、前記誘電体領域および前記載置領域を囲む枠体とから成る容器本体と、
前記枠体直下から前記誘電体領域に配置された、前記電子部品に信号を入出力する第1の配線導体および該第1の配線導体よりも信号伝送距離の長い第2の配線導体と、
前記枠体と一体に形成され、前記枠体から突出した、少なくとも前記第1の配線導体の一部を覆う突出部とを備えていることを特徴とする電子部品収納用パッケージ。 - 前記突出部が、前記第1の配線導体の一部および前記第2の配線導体の一部をそれぞれ覆っており、前記第1の配線導体が覆われている部分の信号伝送距離が、前記第2の配線導体が覆われている部分の信号伝送距離よりも長いことを特徴とする請求項1記載の電子部品収納用パッケージ。
- 請求項1または2記載の電子部品収納用パッケージと、
該電子部品収納用パッケージの前記載置領域に載置されて前記第1の配線導体および前記第2の配線導体に接続された電子部品とを備えた電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013550330A JP5956465B2 (ja) | 2011-12-20 | 2012-12-20 | 電子部品収納用パッケージおよび電子装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011277987 | 2011-12-20 | ||
JP2011277987 | 2011-12-20 | ||
JP2013550330A JP5956465B2 (ja) | 2011-12-20 | 2012-12-20 | 電子部品収納用パッケージおよび電子装置 |
PCT/JP2012/083064 WO2013094684A1 (ja) | 2011-12-20 | 2012-12-20 | 電子部品収納用パッケージおよび電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013094684A1 JPWO2013094684A1 (ja) | 2015-04-27 |
JP5956465B2 true JP5956465B2 (ja) | 2016-07-27 |
Family
ID=48668564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013550330A Active JP5956465B2 (ja) | 2011-12-20 | 2012-12-20 | 電子部品収納用パッケージおよび電子装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9386687B2 (ja) |
JP (1) | JP5956465B2 (ja) |
CN (1) | CN103999209B (ja) |
WO (1) | WO2013094684A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6426539B2 (ja) * | 2015-06-19 | 2018-11-21 | 株式会社フジクラ | 光学装置、及び光学装置の製造方法 |
JP6412900B2 (ja) * | 2016-06-23 | 2018-10-24 | 株式会社東芝 | 高周波半導体用パッケージ |
WO2019097564A1 (ja) * | 2017-11-14 | 2019-05-23 | 日本碍子株式会社 | パッケージおよび半導体装置 |
JP7119119B2 (ja) * | 2018-11-30 | 2022-08-16 | 京セラ株式会社 | 配線基板、電子部品搭載用パッケージおよび電子装置 |
CN112216615B (zh) * | 2019-07-09 | 2023-09-22 | 澜起科技股份有限公司 | 可调信号传输时间的基板封装方法及其结构 |
CN117203756A (zh) * | 2021-04-27 | 2023-12-08 | 京瓷株式会社 | 电子部件安装用封装体及电子装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4035046A (en) * | 1976-01-15 | 1977-07-12 | Amp Incorporated | Miniature electrical connector for parallel panel members |
US4784974A (en) * | 1982-08-05 | 1988-11-15 | Olin Corporation | Method of making a hermetically sealed semiconductor casing |
US5253010A (en) * | 1988-05-13 | 1993-10-12 | Minolta Camera Kabushiki Kaisha | Printed circuit board |
MY104152A (en) * | 1988-08-12 | 1994-02-28 | Mitsui Chemicals Inc | Processes for producing semiconductor devices. |
US5264393A (en) * | 1988-11-25 | 1993-11-23 | Fuji Photo Film Co., Ltd. | Solid state image pickup device and method of manufacturing the same |
US5122861A (en) * | 1988-11-25 | 1992-06-16 | Fuji Photo Film Co., Ltd. | Solid state image pickup device having particular package structure |
US5072284A (en) * | 1988-11-25 | 1991-12-10 | Fuji Photo Film Co., Ltd. | Solid state image pickup device |
JPH03116948A (ja) * | 1989-09-29 | 1991-05-17 | Yoshiki Tanigawa | 超高周波ic用窒化アルミニウムパッケージ |
US5268533A (en) * | 1991-05-03 | 1993-12-07 | Hughes Aircraft Company | Pre-stressed laminated lid for electronic circuit package |
US5375040A (en) * | 1992-09-29 | 1994-12-20 | Eldec Corporation | Modular electronic circuit housing and wiring board |
US5485037A (en) * | 1993-04-12 | 1996-01-16 | Amkor Electronics, Inc. | Semiconductor device having a thermal dissipator and electromagnetic shielding |
US5471011A (en) * | 1994-05-26 | 1995-11-28 | Ak Technology, Inc. | Homogeneous thermoplastic semi-conductor chip carrier package |
JP3378435B2 (ja) * | 1995-09-29 | 2003-02-17 | 株式会社東芝 | 超高周波帯無線通信装置 |
JPH09275145A (ja) | 1996-04-02 | 1997-10-21 | Hitachi Ltd | 半導体装置 |
JPH10104101A (ja) * | 1996-10-02 | 1998-04-24 | Mitsubishi Electric Corp | 半導体圧力センサ |
JP3618046B2 (ja) | 1998-04-27 | 2005-02-09 | 京セラ株式会社 | 高周波回路用パッケージ |
US6294839B1 (en) * | 1999-08-30 | 2001-09-25 | Micron Technology, Inc. | Apparatus and methods of packaging and testing die |
JP2002111324A (ja) * | 2000-09-28 | 2002-04-12 | Toshiba Corp | 信号伝送用回路基板、その製造方法及びそれを用いた電子機器 |
TWI292628B (en) * | 2001-03-29 | 2008-01-11 | Furukawa Electric Co Ltd | Optical fiber module lead frame and optical fiber module |
JP4009169B2 (ja) | 2002-08-13 | 2007-11-14 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
US7147495B2 (en) * | 2004-12-31 | 2006-12-12 | Hon Hai Precision Ind. Co., Ltd. | Electrical card connector |
JP2011066268A (ja) * | 2009-09-18 | 2011-03-31 | Nippon Telegr & Teleph Corp <Ntt> | 電気回路 |
JP2011130395A (ja) | 2009-12-21 | 2011-06-30 | Nec Corp | 信号合成分配回路、電力増幅器および信号合成分配回路の製造方法 |
JP5074553B2 (ja) | 2010-05-14 | 2012-11-14 | 日本電信電話株式会社 | 高周波パッケージ |
JP5029727B2 (ja) * | 2010-06-01 | 2012-09-19 | オムロン株式会社 | 半導体装置及びマイクロフォン |
JP4947191B2 (ja) * | 2010-06-01 | 2012-06-06 | オムロン株式会社 | マイクロフォン |
-
2012
- 2012-12-20 CN CN201280062537.XA patent/CN103999209B/zh active Active
- 2012-12-20 US US14/367,566 patent/US9386687B2/en active Active
- 2012-12-20 JP JP2013550330A patent/JP5956465B2/ja active Active
- 2012-12-20 WO PCT/JP2012/083064 patent/WO2013094684A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN103999209B (zh) | 2016-11-16 |
US9386687B2 (en) | 2016-07-05 |
US20140345929A1 (en) | 2014-11-27 |
WO2013094684A1 (ja) | 2013-06-27 |
JPWO2013094684A1 (ja) | 2015-04-27 |
CN103999209A (zh) | 2014-08-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5956465B2 (ja) | 電子部品収納用パッケージおよび電子装置 | |
JP6243510B2 (ja) | 電子部品収納用パッケージおよび電子装置 | |
CN107534023B (zh) | 半导体元件封装件、半导体装置以及安装构造体 | |
JP5981660B2 (ja) | 電子部品収納用パッケージおよび電子装置 | |
JP6015508B2 (ja) | 高周波モジュール | |
JP4823155B2 (ja) | 電子部品収納用パッケージならびに電子装置および光半導体装置 | |
JP5518260B2 (ja) | 素子収納用パッケージ、半導体装置用部品および半導体装置 | |
JP6633656B2 (ja) | 配線基板、光半導体素子パッケージおよび光半導体装置 | |
WO2013077199A1 (ja) | 電子部品収納用パッケージおよび電子装置 | |
JP2017059680A (ja) | 配線基板、半導体素子パッケージおよび半導体装置 | |
JP6181777B2 (ja) | 素子収納用パッケージおよび実装構造体 | |
JP2016115736A (ja) | 半導体素子パッケージおよび半導体装置 | |
JPWO2020111257A1 (ja) | 配線基板、電子部品搭載用パッケージおよび電子装置 | |
JP5837187B2 (ja) | 半導体素子収納用パッケージ、半導体装置および実装構造体 | |
JP2009010149A (ja) | 接続端子及びこれを用いたパッケージ並びに電子装置 | |
JP7350902B2 (ja) | 絶縁基体、半導体パッケージおよび半導体装置 | |
JP5812671B2 (ja) | 素子収納用パッケージおよびこれを備えた半導体装置 | |
WO2015012405A1 (ja) | 素子収納用パッケージおよび実装構造体 | |
JP6030371B2 (ja) | 素子収納用パッケージおよび実装構造体 | |
JP6075597B2 (ja) | 素子収納用パッケージおよび実装構造体 | |
JP5709427B2 (ja) | 素子収納用パッケージおよびこれを備えた半導体装置 | |
JP2004356391A (ja) | 半導体素子収納用パッケージおよび半導体装置 | |
JP6591912B2 (ja) | 半導体素子パッケージおよび半導体装置 | |
JP6166101B2 (ja) | 光半導体素子収納用パッケージおよびこれを備えた実装構造体 | |
JP6744103B2 (ja) | 半導体素子収納用パッケージおよび半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150908 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151105 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160517 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160616 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5956465 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |