JP5934139B2 - 樹脂封止装置及び樹脂封止方法 - Google Patents

樹脂封止装置及び樹脂封止方法 Download PDF

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JP5934139B2
JP5934139B2 JP2013088410A JP2013088410A JP5934139B2 JP 5934139 B2 JP5934139 B2 JP 5934139B2 JP 2013088410 A JP2013088410 A JP 2013088410A JP 2013088410 A JP2013088410 A JP 2013088410A JP 5934139 B2 JP5934139 B2 JP 5934139B2
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mold
resin
release film
cavity
mold surface
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Japanese (ja)
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JP2014212246A (ja
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高瀬　慎二
慎二 高瀬
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Towa Corp
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Towa Corp
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Priority to JP2013088410A priority Critical patent/JP5934139B2/ja
Priority to KR1020140021166A priority patent/KR101643451B1/ko
Priority to CN201410082060.2A priority patent/CN104112679B/zh
Priority to TW103108890A priority patent/TW201448133A/zh
Publication of JP2014212246A publication Critical patent/JP2014212246A/ja
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Application Number Priority Date Filing Date Title
JP2013088410A JP5934139B2 (ja) 2013-04-19 2013-04-19 樹脂封止装置及び樹脂封止方法
KR1020140021166A KR101643451B1 (ko) 2013-04-19 2014-02-24 수지 밀봉 장치 및 수지 밀봉 방법
CN201410082060.2A CN104112679B (zh) 2013-04-19 2014-03-07 树脂封装装置及树脂封装方法
TW103108890A TW201448133A (zh) 2013-04-19 2014-03-13 樹脂密封裝置及樹脂密封方法

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JP2013088410A JP5934139B2 (ja) 2013-04-19 2013-04-19 樹脂封止装置及び樹脂封止方法

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JP2014212246A JP2014212246A (ja) 2014-11-13
JP5934139B2 true JP5934139B2 (ja) 2016-06-15

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JP (1) JP5934139B2 (zh)
KR (1) KR101643451B1 (zh)
CN (1) CN104112679B (zh)
TW (1) TW201448133A (zh)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
JP6560498B2 (ja) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法
JP6430342B2 (ja) * 2015-08-11 2018-11-28 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法並びに成形型
JP6598642B2 (ja) * 2015-11-09 2019-10-30 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
TWI575620B (zh) * 2016-03-10 2017-03-21 南茂科技股份有限公司 指紋辨識晶片封裝結構的製作方法及製作設備
CN108987292B (zh) * 2017-06-05 2022-07-08 日月光半导体制造股份有限公司 封装模具和半导体封装制程
KR101986645B1 (ko) * 2017-07-19 2019-07-03 동아정밀(주) 트랜스퍼 몰드의 압축코어장치
CN108058352A (zh) * 2017-12-30 2018-05-22 宁国市欧泰橡塑制品有限公司 一种护线套注压成型设备
JP6655150B1 (ja) * 2018-10-19 2020-02-26 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法
JP7160770B2 (ja) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置
JP6845903B1 (ja) * 2019-09-18 2021-03-24 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP6837530B1 (ja) * 2019-10-17 2021-03-03 Ｔｏｗａ株式会社 樹脂成形方法及び樹脂成形装置
JP7360368B2 (ja) * 2020-08-18 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7360369B2 (ja) * 2020-08-28 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7430125B2 (ja) * 2020-08-28 2024-02-09 Ｔｏｗａ株式会社 成形型、樹脂成形装置、及び樹脂成形品の製造方法
JP7341105B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341106B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
KR102456172B1 (ko) * 2020-10-15 2022-10-19 토와한국 주식회사 금형 모듈을 포함하는 반도체 소자 몰딩 장치
JP2024014263A (ja) * 2022-07-22 2024-02-01 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、及び樹脂成形品の製造方法
CN116666229A (zh) * 2023-08-02 2023-08-29 西安畅榜电子科技有限公司 一种芯片框及其加工方法

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Publication number Priority date Publication date Assignee Title
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
JPH09193177A (ja) * 1996-01-17 1997-07-29 Apic Yamada Kk 樹脂モールド方法及びこれに用いるリリースフィルム
US6439869B1 (en) * 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
TWI327756B (en) * 2002-11-29 2010-07-21 Apic Yamada Corp Resin molding machine
KR20120028639A (ko) * 2010-09-15 2012-03-23 한미반도체 주식회사 트랜스퍼 몰딩장치
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置

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Publication number Publication date
KR20140125716A (ko) 2014-10-29
KR101643451B1 (ko) 2016-07-27
TW201448133A (zh) 2014-12-16
JP2014212246A (ja) 2014-11-13
CN104112679A (zh) 2014-10-22
TWI563611B (zh) 2016-12-21
CN104112679B (zh) 2017-10-13

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