JP5900913B2 - 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット - Google Patents

研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット Download PDF

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Publication number
JP5900913B2
JP5900913B2 JP2015506749A JP2015506749A JP5900913B2 JP 5900913 B2 JP5900913 B2 JP 5900913B2 JP 2015506749 A JP2015506749 A JP 2015506749A JP 2015506749 A JP2015506749 A JP 2015506749A JP 5900913 B2 JP5900913 B2 JP 5900913B2
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Prior art keywords
water
polishing composition
polishing
soluble polymer
agent
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Japanese (ja)
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JPWO2014148399A1 (ja
Inventor
公亮 土屋
公亮 土屋
久典 丹所
久典 丹所
大輝 市坪
大輝 市坪
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Toagosei Co Ltd
Fujimi Inc
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Toagosei Co Ltd
Fujimi Inc
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Application filed by Toagosei Co Ltd, Fujimi Inc filed Critical Toagosei Co Ltd
Priority to JP2015506749A priority Critical patent/JP5900913B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F216/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
    • C08F216/04—Acyclic compounds
    • C08F216/06—Polyvinyl alcohol ; Vinyl alcohol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H10P90/129—

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2015506749A 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット Active JP5900913B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015506749A JP5900913B2 (ja) 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2013057228 2013-03-19
JP2013057227 2013-03-19
JP2013057226 2013-03-19
JP2013057228 2013-03-19
JP2013057225 2013-03-19
JP2013057226 2013-03-19
JP2013057227 2013-03-19
JP2013057225 2013-03-19
JP2015506749A JP5900913B2 (ja) 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
PCT/JP2014/057008 WO2014148399A1 (ja) 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

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JP2016038586A Division JP6513591B2 (ja) 2013-03-19 2016-03-01 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
JP2016038585A Division JP6514653B2 (ja) 2013-03-19 2016-03-01 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

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JP5900913B2 true JP5900913B2 (ja) 2016-04-06
JPWO2014148399A1 JPWO2014148399A1 (ja) 2017-02-16

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JP2015506749A Active JP5900913B2 (ja) 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
JP2016038585A Active JP6514653B2 (ja) 2013-03-19 2016-03-01 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
JP2016038586A Active JP6513591B2 (ja) 2013-03-19 2016-03-01 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
JP2019076438A Active JP7246235B2 (ja) 2013-03-19 2019-04-12 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
JP2022087516A Pending JP2022118024A (ja) 2013-03-19 2022-05-30 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

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JP2016038586A Active JP6513591B2 (ja) 2013-03-19 2016-03-01 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
JP2019076438A Active JP7246235B2 (ja) 2013-03-19 2019-04-12 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
JP2022087516A Pending JP2022118024A (ja) 2013-03-19 2022-05-30 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

Country Status (8)

Country Link
US (1) US10351732B2 (enExample)
EP (2) EP2977423B1 (enExample)
JP (5) JP5900913B2 (enExample)
KR (1) KR102330030B1 (enExample)
CN (1) CN105051145B (enExample)
SG (1) SG11201507438YA (enExample)
TW (2) TWI640586B (enExample)
WO (1) WO2014148399A1 (enExample)

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US10717899B2 (en) 2013-03-19 2020-07-21 Fujimi Incorporated Polishing composition, method for producing polishing composition and polishing composition preparation kit
CN105051145B (zh) 2013-03-19 2018-06-26 福吉米株式会社 研磨用组合物、研磨用组合物制造方法及研磨用组合物制备用试剂盒
JP6367113B2 (ja) * 2014-12-25 2018-08-01 花王株式会社 シリコンウェーハ用研磨液組成物
JP6655354B2 (ja) * 2014-12-26 2020-02-26 花王株式会社 シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット
US10748778B2 (en) * 2015-02-12 2020-08-18 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
WO2017069202A1 (ja) * 2015-10-23 2017-04-27 ニッタ・ハース株式会社 研磨用組成物
WO2017069253A1 (ja) * 2015-10-23 2017-04-27 ニッタ・ハース株式会社 研磨用組成物
JP6801964B2 (ja) 2016-01-19 2020-12-16 株式会社フジミインコーポレーテッド 研磨用組成物及びシリコン基板の研磨方法
JP6572830B2 (ja) * 2016-06-13 2019-09-11 信越半導体株式会社 シリコンウェーハの搬送・保管方法
WO2018025655A1 (ja) * 2016-08-02 2018-02-08 株式会社フジミインコーポレーテッド シリコンウェーハ粗研磨用組成物の濃縮液
WO2018025656A1 (ja) * 2016-08-02 2018-02-08 株式会社フジミインコーポレーテッド シリコンウェーハ粗研磨用組成物の製造方法、シリコンウェーハ粗研磨用組成物セット、およびシリコンウェーハの研磨方法
KR102744174B1 (ko) 2016-08-31 2024-12-19 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마용 조성물 세트
NZ754331A (en) * 2016-12-22 2025-09-26 Illumina Inc Flow cell package and method for making the same
WO2018150945A1 (ja) * 2017-02-20 2018-08-23 株式会社フジミインコーポレーテッド シリコン基板中間研磨用組成物およびシリコン基板研磨用組成物セット
JP7074525B2 (ja) * 2017-03-30 2022-05-24 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
CN108499963A (zh) * 2017-05-18 2018-09-07 苏州权素船舶电子有限公司 一种电子材料研磨清洗方法
JP7303111B2 (ja) 2017-11-06 2023-07-04 株式会社フジミインコーポレーテッド 研磨用組成物およびその製造方法
US11427730B2 (en) 2017-11-16 2022-08-30 Jgc Catalysts And Chemicals Ltd. Dispersion liquid of silica particles and production method therefor
JP6929239B2 (ja) * 2018-03-30 2021-09-01 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP7221479B2 (ja) * 2018-08-31 2023-02-14 日化精工株式会社 ダイシング加工用製剤及び加工処理液
EP3950876A4 (en) * 2019-03-26 2022-11-02 Fujimi Incorporated POLISHING COMPOSITION
JP7384592B2 (ja) * 2019-08-22 2023-11-21 株式会社三共 遊技機
US11492512B2 (en) * 2019-09-26 2022-11-08 Fujimi Incorporated Polishing composition and polishing method
JP6884898B1 (ja) * 2020-01-22 2021-06-09 日本酢ビ・ポバール株式会社 研磨用組成物
EP4120322A4 (en) * 2020-03-13 2024-03-27 Fujimi Incorporated POLISHING COMPOSITION AND POLISHING METHOD
JP7720137B2 (ja) * 2020-09-30 2025-08-07 株式会社フジミインコーポレーテッド ポリビニルアルコール組成物を含む半導体用濡れ剤の製造方法
US20250207030A1 (en) * 2022-03-31 2025-06-26 Fujimi Incorporated Polishing composition
TWI841000B (zh) 2022-10-14 2024-05-01 財團法人工業技術研究院 懸浮磨料噴射流的加工方法及加工系統
TWI878955B (zh) 2023-07-05 2025-04-01 財團法人工業技術研究院 廢熱固性材料回收裝置

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CN105051145A (zh) 2015-11-11
EP3967736A1 (en) 2022-03-16
EP2977423A1 (en) 2016-01-27
TW201500492A (zh) 2015-01-01
KR20150133694A (ko) 2015-11-30
TWI640586B (zh) 2018-11-11
JP2016135882A (ja) 2016-07-28
WO2014148399A1 (ja) 2014-09-25
TWI665275B (zh) 2019-07-11
JP2022118024A (ja) 2022-08-12
JP2016166343A (ja) 2016-09-15
EP2977423A4 (en) 2017-03-22
JP2019151849A (ja) 2019-09-12
US10351732B2 (en) 2019-07-16
US20160272846A1 (en) 2016-09-22
JP7246235B2 (ja) 2023-03-27
TW201900795A (zh) 2019-01-01
EP2977423B1 (en) 2022-09-28
EP3967736B1 (en) 2023-10-11
KR102330030B1 (ko) 2021-11-24
JPWO2014148399A1 (ja) 2017-02-16
SG11201507438YA (en) 2015-10-29
JP6513591B2 (ja) 2019-05-15
JP6514653B2 (ja) 2019-05-15
CN105051145B (zh) 2018-06-26

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