SG11201507438YA - Polishing composition, method for producing polishing composition and polishing composition preparation kit - Google Patents

Polishing composition, method for producing polishing composition and polishing composition preparation kit

Info

Publication number
SG11201507438YA
SG11201507438YA SG11201507438YA SG11201507438YA SG11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA
Authority
SG
Singapore
Prior art keywords
polishing composition
producing
preparation kit
composition preparation
polishing
Prior art date
Application number
SG11201507438YA
Other languages
English (en)
Inventor
Kohsuke Tsuchiya
Hisanori Tansho
Taiki Ichitsubo
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51580082&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201507438Y(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG11201507438YA publication Critical patent/SG11201507438YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F216/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
    • C08F216/04—Acyclic compounds
    • C08F216/06—Polyvinyl alcohol ; Vinyl alcohol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201507438YA 2013-03-19 2014-03-14 Polishing composition, method for producing polishing composition and polishing composition preparation kit SG11201507438YA (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013057225 2013-03-19
JP2013057226 2013-03-19
JP2013057228 2013-03-19
JP2013057227 2013-03-19
PCT/JP2014/057008 WO2014148399A1 (ja) 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

Publications (1)

Publication Number Publication Date
SG11201507438YA true SG11201507438YA (en) 2015-10-29

Family

ID=51580082

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201507438YA SG11201507438YA (en) 2013-03-19 2014-03-14 Polishing composition, method for producing polishing composition and polishing composition preparation kit

Country Status (8)

Country Link
US (1) US10351732B2 (enExample)
EP (2) EP3967736B1 (enExample)
JP (5) JP5900913B2 (enExample)
KR (1) KR102330030B1 (enExample)
CN (1) CN105051145B (enExample)
SG (1) SG11201507438YA (enExample)
TW (2) TWI640586B (enExample)
WO (1) WO2014148399A1 (enExample)

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* Cited by examiner, † Cited by third party
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US10717899B2 (en) 2013-03-19 2020-07-21 Fujimi Incorporated Polishing composition, method for producing polishing composition and polishing composition preparation kit
KR102330030B1 (ko) * 2013-03-19 2021-11-24 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트
JP6367113B2 (ja) * 2014-12-25 2018-08-01 花王株式会社 シリコンウェーハ用研磨液組成物
JP6655354B2 (ja) * 2014-12-26 2020-02-26 花王株式会社 シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット
US10748778B2 (en) * 2015-02-12 2020-08-18 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
SG11201803364WA (en) * 2015-10-23 2018-05-30 Nitta Haas Inc Polishing composition
JP6856535B2 (ja) * 2015-10-23 2021-04-07 ニッタ・デュポン株式会社 研磨用組成物
JP6801964B2 (ja) 2016-01-19 2020-12-16 株式会社フジミインコーポレーテッド 研磨用組成物及びシリコン基板の研磨方法
JP6572830B2 (ja) * 2016-06-13 2019-09-11 信越半導体株式会社 シリコンウェーハの搬送・保管方法
WO2018025656A1 (ja) * 2016-08-02 2018-02-08 株式会社フジミインコーポレーテッド シリコンウェーハ粗研磨用組成物の製造方法、シリコンウェーハ粗研磨用組成物セット、およびシリコンウェーハの研磨方法
WO2018025655A1 (ja) * 2016-08-02 2018-02-08 株式会社フジミインコーポレーテッド シリコンウェーハ粗研磨用組成物の濃縮液
JP7050684B2 (ja) 2016-08-31 2022-04-08 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物セット
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JP7074525B2 (ja) * 2017-03-30 2022-05-24 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
CN108499963A (zh) * 2017-05-18 2018-09-07 苏州权素船舶电子有限公司 一种电子材料研磨清洗方法
EP3708630A4 (en) 2017-11-06 2021-08-18 Fujimi Incorporated COMPOSITION FOR POLISHING, AND METHOD FOR MANUFACTURING THE SAME
WO2019098257A1 (ja) 2017-11-16 2019-05-23 日揮触媒化成株式会社 シリカ粒子の分散液及びその製造方法
JP6929239B2 (ja) * 2018-03-30 2021-09-01 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP7221479B2 (ja) * 2018-08-31 2023-02-14 日化精工株式会社 ダイシング加工用製剤及び加工処理液
EP3950876A4 (en) * 2019-03-26 2022-11-02 Fujimi Incorporated POLISHING COMPOSITION
JP7384592B2 (ja) * 2019-08-22 2023-11-21 株式会社三共 遊技機
US11492512B2 (en) * 2019-09-26 2022-11-08 Fujimi Incorporated Polishing composition and polishing method
JP6884898B1 (ja) * 2020-01-22 2021-06-09 日本酢ビ・ポバール株式会社 研磨用組成物
KR20220150963A (ko) * 2020-03-13 2022-11-11 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마 방법
JP7720137B2 (ja) * 2020-09-30 2025-08-07 株式会社フジミインコーポレーテッド ポリビニルアルコール組成物を含む半導体用濡れ剤の製造方法
KR20240166015A (ko) * 2022-03-31 2024-11-25 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
TWI841000B (zh) 2022-10-14 2024-05-01 財團法人工業技術研究院 懸浮磨料噴射流的加工方法及加工系統
TWI878955B (zh) 2023-07-05 2025-04-01 財團法人工業技術研究院 廢熱固性材料回收裝置

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KR102330030B1 (ko) 2013-03-19 2021-11-24 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트

Also Published As

Publication number Publication date
KR102330030B1 (ko) 2021-11-24
TW201900795A (zh) 2019-01-01
TWI640586B (zh) 2018-11-11
JP2022118024A (ja) 2022-08-12
EP3967736A1 (en) 2022-03-16
JP7246235B2 (ja) 2023-03-27
JP2019151849A (ja) 2019-09-12
JP6513591B2 (ja) 2019-05-15
US20160272846A1 (en) 2016-09-22
CN105051145B (zh) 2018-06-26
CN105051145A (zh) 2015-11-11
EP2977423A4 (en) 2017-03-22
US10351732B2 (en) 2019-07-16
JP6514653B2 (ja) 2019-05-15
TWI665275B (zh) 2019-07-11
EP3967736B1 (en) 2023-10-11
JP5900913B2 (ja) 2016-04-06
KR20150133694A (ko) 2015-11-30
TW201500492A (zh) 2015-01-01
WO2014148399A1 (ja) 2014-09-25
EP2977423B1 (en) 2022-09-28
JP2016166343A (ja) 2016-09-15
JP2016135882A (ja) 2016-07-28
JPWO2014148399A1 (ja) 2017-02-16
EP2977423A1 (en) 2016-01-27

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