KR102330030B1 - 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트 - Google Patents

연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트 Download PDF

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KR102330030B1
KR102330030B1 KR1020157020585A KR20157020585A KR102330030B1 KR 102330030 B1 KR102330030 B1 KR 102330030B1 KR 1020157020585 A KR1020157020585 A KR 1020157020585A KR 20157020585 A KR20157020585 A KR 20157020585A KR 102330030 B1 KR102330030 B1 KR 102330030B1
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water
polishing composition
polishing
soluble polymer
agent
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KR20150133694A (ko
Inventor
고오스케 즈치야
히사노리 단쇼
다이키 이치츠보
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가부시키가이샤 후지미인코퍼레이티드
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F216/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
    • C08F216/04—Acyclic compounds
    • C08F216/06—Polyvinyl alcohol ; Vinyl alcohol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020157020585A 2013-03-19 2014-03-14 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트 Active KR102330030B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2013057227 2013-03-19
JP2013057226 2013-03-19
JPJP-P-2013-057227 2013-03-19
JPJP-P-2013-057228 2013-03-19
JP2013057228 2013-03-19
JPJP-P-2013-057226 2013-03-19
JP2013057225 2013-03-19
JPJP-P-2013-057225 2013-03-19
PCT/JP2014/057008 WO2014148399A1 (ja) 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

Publications (2)

Publication Number Publication Date
KR20150133694A KR20150133694A (ko) 2015-11-30
KR102330030B1 true KR102330030B1 (ko) 2021-11-24

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KR1020157020585A Active KR102330030B1 (ko) 2013-03-19 2014-03-14 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트

Country Status (8)

Country Link
US (1) US10351732B2 (enExample)
EP (2) EP3967736B1 (enExample)
JP (5) JP5900913B2 (enExample)
KR (1) KR102330030B1 (enExample)
CN (1) CN105051145B (enExample)
SG (1) SG11201507438YA (enExample)
TW (2) TWI640586B (enExample)
WO (1) WO2014148399A1 (enExample)

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EP3967736B1 (en) 2013-03-19 2023-10-11 Fujimi Incorporated Polishing composition, method for producing polishing composition, and kit for preparing polishing composition
US10717899B2 (en) 2013-03-19 2020-07-21 Fujimi Incorporated Polishing composition, method for producing polishing composition and polishing composition preparation kit
JP6367113B2 (ja) * 2014-12-25 2018-08-01 花王株式会社 シリコンウェーハ用研磨液組成物
JP6655354B2 (ja) * 2014-12-26 2020-02-26 花王株式会社 シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット
US10748778B2 (en) * 2015-02-12 2020-08-18 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
CN108138032B (zh) * 2015-10-23 2021-02-12 霓达杜邦股份有限公司 研磨用组合物
US10435588B2 (en) * 2015-10-23 2019-10-08 Nitta Haas Incorporated Polishing composition
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KR102744174B1 (ko) * 2016-08-31 2024-12-19 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마용 조성물 세트
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JP7074525B2 (ja) * 2017-03-30 2022-05-24 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
CN108499963A (zh) * 2017-05-18 2018-09-07 苏州权素船舶电子有限公司 一种电子材料研磨清洗方法
KR102685348B1 (ko) 2017-11-06 2024-07-17 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 그의 제조 방법
KR102647949B1 (ko) 2017-11-16 2024-03-14 닛키 쇼쿠바이카세이 가부시키가이샤 실리카 입자의 분산액 및 그 제조 방법
JP6929239B2 (ja) * 2018-03-30 2021-09-01 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP7221479B2 (ja) * 2018-08-31 2023-02-14 日化精工株式会社 ダイシング加工用製剤及び加工処理液
KR102849199B1 (ko) * 2019-03-26 2025-08-22 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
JP7384592B2 (ja) * 2019-08-22 2023-11-21 株式会社三共 遊技機
US11492512B2 (en) * 2019-09-26 2022-11-08 Fujimi Incorporated Polishing composition and polishing method
JP6884898B1 (ja) * 2020-01-22 2021-06-09 日本酢ビ・ポバール株式会社 研磨用組成物
KR20220150963A (ko) * 2020-03-13 2022-11-11 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마 방법
JP7720137B2 (ja) * 2020-09-30 2025-08-07 株式会社フジミインコーポレーテッド ポリビニルアルコール組成物を含む半導体用濡れ剤の製造方法
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TWI841000B (zh) 2022-10-14 2024-05-01 財團法人工業技術研究院 懸浮磨料噴射流的加工方法及加工系統
TWI878955B (zh) 2023-07-05 2025-04-01 財團法人工業技術研究院 廢熱固性材料回收裝置

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Also Published As

Publication number Publication date
JP2019151849A (ja) 2019-09-12
EP2977423A4 (en) 2017-03-22
CN105051145A (zh) 2015-11-11
JP6514653B2 (ja) 2019-05-15
JP2022118024A (ja) 2022-08-12
EP3967736A1 (en) 2022-03-16
TW201900795A (zh) 2019-01-01
EP3967736B1 (en) 2023-10-11
JP6513591B2 (ja) 2019-05-15
WO2014148399A1 (ja) 2014-09-25
TWI640586B (zh) 2018-11-11
CN105051145B (zh) 2018-06-26
TWI665275B (zh) 2019-07-11
JP7246235B2 (ja) 2023-03-27
JP5900913B2 (ja) 2016-04-06
JPWO2014148399A1 (ja) 2017-02-16
US10351732B2 (en) 2019-07-16
JP2016135882A (ja) 2016-07-28
JP2016166343A (ja) 2016-09-15
KR20150133694A (ko) 2015-11-30
SG11201507438YA (en) 2015-10-29
US20160272846A1 (en) 2016-09-22
EP2977423A1 (en) 2016-01-27
EP2977423B1 (en) 2022-09-28
TW201500492A (zh) 2015-01-01

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