TWI640586B - 硏磨用組成物、硏磨用組成物之製造方法及硏磨用組成物之調製用套組 - Google Patents
硏磨用組成物、硏磨用組成物之製造方法及硏磨用組成物之調製用套組 Download PDFInfo
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- TWI640586B TWI640586B TW103110296A TW103110296A TWI640586B TW I640586 B TWI640586 B TW I640586B TW 103110296 A TW103110296 A TW 103110296A TW 103110296 A TW103110296 A TW 103110296A TW I640586 B TWI640586 B TW I640586B
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- MGIYRDNGCNKGJU-UHFFFAOYSA-N isothiazolinone Chemical compound O=C1C=CSN1 MGIYRDNGCNKGJU-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 150000002668 lysine derivatives Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SRJVJQOOBBVIRS-UHFFFAOYSA-N n-hexylmethanimine Chemical compound CCCCCCN=C SRJVJQOOBBVIRS-UHFFFAOYSA-N 0.000 description 1
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- LQPLDXQVILYOOL-UHFFFAOYSA-I pentasodium;2-[bis[2-[bis(carboxylatomethyl)amino]ethyl]amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC(=O)[O-])CCN(CC([O-])=O)CC([O-])=O LQPLDXQVILYOOL-UHFFFAOYSA-I 0.000 description 1
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
- C08F216/04—Acyclic compounds
- C08F216/06—Polyvinyl alcohol ; Vinyl alcohol
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
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| JP2013-057228 | 2013-03-19 | ||
| JP2013057225 | 2013-03-19 | ||
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| JP2013057226 | 2013-03-19 | ||
| JP2013-057226 | 2013-03-19 | ||
| JP2013057228 | 2013-03-19 | ||
| JP2013-057225 | 2013-03-19 | ||
| JP2013057227 | 2013-03-19 |
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| TW107130386A TWI665275B (zh) | 2013-03-19 | 2014-03-19 | 研磨用組成物及矽晶圓之研磨方法 |
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| EP (2) | EP3967736B1 (enExample) |
| JP (5) | JP5900913B2 (enExample) |
| KR (1) | KR102330030B1 (enExample) |
| CN (1) | CN105051145B (enExample) |
| SG (1) | SG11201507438YA (enExample) |
| TW (2) | TWI640586B (enExample) |
| WO (1) | WO2014148399A1 (enExample) |
Cited By (2)
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|---|---|---|---|---|
| US12466027B2 (en) | 2022-10-14 | 2025-11-11 | Industrial Technology Research Institute | Processing system of suspension abrasive jets |
| US12487613B2 (en) | 2023-07-05 | 2025-12-02 | Industrial Technology Research Institute | Machine for smashing thermosetting materials |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10717899B2 (en) | 2013-03-19 | 2020-07-21 | Fujimi Incorporated | Polishing composition, method for producing polishing composition and polishing composition preparation kit |
| KR102330030B1 (ko) * | 2013-03-19 | 2021-11-24 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트 |
| JP6367113B2 (ja) * | 2014-12-25 | 2018-08-01 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP6655354B2 (ja) * | 2014-12-26 | 2020-02-26 | 花王株式会社 | シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット |
| US10748778B2 (en) * | 2015-02-12 | 2020-08-18 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
| SG11201803364WA (en) * | 2015-10-23 | 2018-05-30 | Nitta Haas Inc | Polishing composition |
| JP6856535B2 (ja) * | 2015-10-23 | 2021-04-07 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| JP6801964B2 (ja) | 2016-01-19 | 2020-12-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びシリコン基板の研磨方法 |
| JP6572830B2 (ja) * | 2016-06-13 | 2019-09-11 | 信越半導体株式会社 | シリコンウェーハの搬送・保管方法 |
| WO2018025656A1 (ja) * | 2016-08-02 | 2018-02-08 | 株式会社フジミインコーポレーテッド | シリコンウェーハ粗研磨用組成物の製造方法、シリコンウェーハ粗研磨用組成物セット、およびシリコンウェーハの研磨方法 |
| WO2018025655A1 (ja) * | 2016-08-02 | 2018-02-08 | 株式会社フジミインコーポレーテッド | シリコンウェーハ粗研磨用組成物の濃縮液 |
| JP7050684B2 (ja) | 2016-08-31 | 2022-04-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨用組成物セット |
| NZ754331A (en) | 2016-12-22 | 2025-09-26 | Illumina Inc | Flow cell package and method for making the same |
| JP7185533B2 (ja) * | 2017-02-20 | 2022-12-07 | 株式会社フジミインコーポレーテッド | シリコン基板中間研磨用組成物およびシリコン基板研磨用組成物セット |
| JP7074525B2 (ja) * | 2017-03-30 | 2022-05-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| CN108499963A (zh) * | 2017-05-18 | 2018-09-07 | 苏州权素船舶电子有限公司 | 一种电子材料研磨清洗方法 |
| EP3708630A4 (en) | 2017-11-06 | 2021-08-18 | Fujimi Incorporated | COMPOSITION FOR POLISHING, AND METHOD FOR MANUFACTURING THE SAME |
| WO2019098257A1 (ja) | 2017-11-16 | 2019-05-23 | 日揮触媒化成株式会社 | シリカ粒子の分散液及びその製造方法 |
| JP6929239B2 (ja) * | 2018-03-30 | 2021-09-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP7221479B2 (ja) * | 2018-08-31 | 2023-02-14 | 日化精工株式会社 | ダイシング加工用製剤及び加工処理液 |
| EP3950876A4 (en) * | 2019-03-26 | 2022-11-02 | Fujimi Incorporated | POLISHING COMPOSITION |
| JP7384592B2 (ja) * | 2019-08-22 | 2023-11-21 | 株式会社三共 | 遊技機 |
| US11492512B2 (en) * | 2019-09-26 | 2022-11-08 | Fujimi Incorporated | Polishing composition and polishing method |
| JP6884898B1 (ja) * | 2020-01-22 | 2021-06-09 | 日本酢ビ・ポバール株式会社 | 研磨用組成物 |
| KR20220150963A (ko) * | 2020-03-13 | 2022-11-11 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 연마 방법 |
| JP7720137B2 (ja) * | 2020-09-30 | 2025-08-07 | 株式会社フジミインコーポレーテッド | ポリビニルアルコール組成物を含む半導体用濡れ剤の製造方法 |
| KR20240166015A (ko) * | 2022-03-31 | 2024-11-25 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
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| JP6077209B2 (ja) * | 2011-11-25 | 2017-02-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN108831830B (zh) | 2012-02-21 | 2024-05-17 | 株式会社力森诺科 | 研磨剂、研磨剂组和基体的研磨方法 |
| JP5822356B2 (ja) | 2012-04-17 | 2015-11-24 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| KR102123906B1 (ko) | 2012-05-25 | 2020-06-17 | 닛산 가가쿠 가부시키가이샤 | 웨이퍼용 연마액 조성물 |
| JP5927059B2 (ja) * | 2012-06-19 | 2016-05-25 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた基板の製造方法 |
| JP5897200B2 (ja) | 2013-02-13 | 2016-03-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物製造方法および研磨物製造方法 |
| KR102330030B1 (ko) | 2013-03-19 | 2021-11-24 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트 |
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2014
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- 2014-03-14 SG SG11201507438YA patent/SG11201507438YA/en unknown
- 2014-03-19 TW TW103110296A patent/TWI640586B/zh active
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2016
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2019
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200944583A (en) * | 2008-02-18 | 2009-11-01 | Jsr Corp | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US12466027B2 (en) | 2022-10-14 | 2025-11-11 | Industrial Technology Research Institute | Processing system of suspension abrasive jets |
| US12487613B2 (en) | 2023-07-05 | 2025-12-02 | Industrial Technology Research Institute | Machine for smashing thermosetting materials |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102330030B1 (ko) | 2021-11-24 |
| TW201900795A (zh) | 2019-01-01 |
| JP2022118024A (ja) | 2022-08-12 |
| EP3967736A1 (en) | 2022-03-16 |
| JP7246235B2 (ja) | 2023-03-27 |
| JP2019151849A (ja) | 2019-09-12 |
| JP6513591B2 (ja) | 2019-05-15 |
| US20160272846A1 (en) | 2016-09-22 |
| CN105051145B (zh) | 2018-06-26 |
| CN105051145A (zh) | 2015-11-11 |
| EP2977423A4 (en) | 2017-03-22 |
| US10351732B2 (en) | 2019-07-16 |
| JP6514653B2 (ja) | 2019-05-15 |
| TWI665275B (zh) | 2019-07-11 |
| EP3967736B1 (en) | 2023-10-11 |
| JP5900913B2 (ja) | 2016-04-06 |
| KR20150133694A (ko) | 2015-11-30 |
| TW201500492A (zh) | 2015-01-01 |
| SG11201507438YA (en) | 2015-10-29 |
| WO2014148399A1 (ja) | 2014-09-25 |
| EP2977423B1 (en) | 2022-09-28 |
| JP2016166343A (ja) | 2016-09-15 |
| JP2016135882A (ja) | 2016-07-28 |
| JPWO2014148399A1 (ja) | 2017-02-16 |
| EP2977423A1 (en) | 2016-01-27 |
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