JP5877954B2 - 非接触浮上搬送機能を有する基板処理装置 - Google Patents

非接触浮上搬送機能を有する基板処理装置 Download PDF

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Publication number
JP5877954B2
JP5877954B2 JP2011048647A JP2011048647A JP5877954B2 JP 5877954 B2 JP5877954 B2 JP 5877954B2 JP 2011048647 A JP2011048647 A JP 2011048647A JP 2011048647 A JP2011048647 A JP 2011048647A JP 5877954 B2 JP5877954 B2 JP 5877954B2
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Japan
Prior art keywords
substrate
water
unit
contact
levitation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011048647A
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English (en)
Japanese (ja)
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JP2012186325A (ja
Inventor
小林　芳樹
小林　　芳樹
泰照 尾崎
泰照 尾崎
Original Assignee
株式会社ゼビオス
株式会社ダン科学
株式会社三明
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Application filed by 株式会社ゼビオス, 株式会社ダン科学, 株式会社三明 filed Critical 株式会社ゼビオス
Priority to JP2011048647A priority Critical patent/JP5877954B2/ja
Priority to TW100145876A priority patent/TWI457266B/zh
Priority to KR1020120013634A priority patent/KR101335885B1/ko
Publication of JP2012186325A publication Critical patent/JP2012186325A/ja
Application granted granted Critical
Publication of JP5877954B2 publication Critical patent/JP5877954B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G39/00—Rollers, e.g. drive rollers, or arrangements thereof incorporated in roller-ways or other types of mechanical conveyors 
    • B65G39/02—Adaptations of individual rollers and supports therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011048647A 2011-03-07 2011-03-07 非接触浮上搬送機能を有する基板処理装置 Expired - Fee Related JP5877954B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011048647A JP5877954B2 (ja) 2011-03-07 2011-03-07 非接触浮上搬送機能を有する基板処理装置
TW100145876A TWI457266B (zh) 2011-03-07 2011-12-13 And a substrate processing device having a non-contact floating conveyance function
KR1020120013634A KR101335885B1 (ko) 2011-03-07 2012-02-10 비접촉 부상 반송 기능을 가지는 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011048647A JP5877954B2 (ja) 2011-03-07 2011-03-07 非接触浮上搬送機能を有する基板処理装置

Publications (2)

Publication Number Publication Date
JP2012186325A JP2012186325A (ja) 2012-09-27
JP5877954B2 true JP5877954B2 (ja) 2016-03-08

Family

ID=47016118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011048647A Expired - Fee Related JP5877954B2 (ja) 2011-03-07 2011-03-07 非接触浮上搬送機能を有する基板処理装置

Country Status (3)

Country Link
JP (1) JP5877954B2 (ko)
KR (1) KR101335885B1 (ko)
TW (1) TWI457266B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6188123B2 (ja) * 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法
JP6226641B2 (ja) * 2013-08-26 2017-11-08 株式会社ダン科学 エッジ搬送機能を有する基板処理装置
KR101520744B1 (ko) * 2013-11-04 2015-05-15 코닝정밀소재 주식회사 비접촉 진동 억제장치 및 대상물 가공방법
TWI570806B (zh) 2013-11-11 2017-02-11 東京威力科創股份有限公司 使用紫外線處理之金屬硬遮罩的加強型移除用系統及方法
TWI575641B (zh) * 2016-06-02 2017-03-21 盟立自動化股份有限公司 溼式製程設備
TWI603421B (zh) * 2016-07-04 2017-10-21 盟立自動化股份有限公司 溼式製程設備
JP6853520B2 (ja) * 2018-09-20 2021-03-31 株式会社Ｎｓｃ 浮上搬送装置
CN110670070A (zh) * 2019-11-19 2020-01-10 江苏上达电子有限公司 一种液浮喷盘的设计方法
KR102359377B1 (ko) * 2020-03-18 2022-02-08 주식회사 세정로봇 웨이퍼 습식 거치장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2656980B2 (ja) * 1989-06-27 1997-09-24 シャープ株式会社 ガラス基板洗浄方法
JPH09246224A (ja) * 1996-03-07 1997-09-19 Sony Corp ウエハの洗浄方法
JP3450138B2 (ja) * 1996-11-26 2003-09-22 大日本スクリーン製造株式会社 基板処理装置
JP3519675B2 (ja) * 2000-08-03 2004-04-19 株式会社 シーズ 基板処理装置
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
JP2004342886A (ja) * 2003-05-16 2004-12-02 Sharp Corp 基板処理装置および基板処理方法
KR101024644B1 (ko) * 2004-01-30 2011-03-25 엘지디스플레이 주식회사 유체를 이용한 유리 기판 반송 장치
JP2006176255A (ja) * 2004-12-21 2006-07-06 Murata Mach Ltd 搬送システム
TWI316503B (en) * 2005-01-26 2009-11-01 Sfa Engineering Corp Substrate transferring apparatus
JP4621051B2 (ja) * 2005-03-29 2011-01-26 シャープ株式会社 基板の洗浄装置
JP2007175653A (ja) * 2005-12-28 2007-07-12 Sharp Corp 洗浄装置及びそれを用いた表示装置の製造方法
JP4594241B2 (ja) * 2006-01-06 2010-12-08 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びコンピュータプログラム
JP4392692B2 (ja) * 2006-12-01 2010-01-06 日本エアーテック株式会社 半導体ウエハー及び液晶ガラスエアー浮上搬送装置
JP4753313B2 (ja) * 2006-12-27 2011-08-24 東京エレクトロン株式会社 基板処理装置
JP2009061388A (ja) * 2007-09-06 2009-03-26 Zebiosu:Kk 高圧高速制御噴射ガン
KR100922521B1 (ko) * 2007-10-11 2009-10-20 세메스 주식회사 브러시 어셈블리 및 이를 갖는 기판 세정 장치
US8231157B2 (en) * 2008-08-28 2012-07-31 Corning Incorporated Non-contact manipulating devices and methods

Also Published As

Publication number Publication date
TWI457266B (zh) 2014-10-21
KR101335885B1 (ko) 2013-12-02
JP2012186325A (ja) 2012-09-27
KR20120101990A (ko) 2012-09-17
TW201236956A (en) 2012-09-16

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