JP5865470B1 - 電子部品搬送装置 - Google Patents

電子部品搬送装置 Download PDF

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Publication number
JP5865470B1
JP5865470B1 JP2014241439A JP2014241439A JP5865470B1 JP 5865470 B1 JP5865470 B1 JP 5865470B1 JP 2014241439 A JP2014241439 A JP 2014241439A JP 2014241439 A JP2014241439 A JP 2014241439A JP 5865470 B1 JP5865470 B1 JP 5865470B1
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Japan
Prior art keywords
electronic component
stage
chuck
contact
unit
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JP2014241439A
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English (en)
Japanese (ja)
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JP2016102723A (ja
Inventor
隆行 的場
隆行 的場
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Ueno Seiki Co Ltd
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Ueno Seiki Co Ltd
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Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Priority to JP2014241439A priority Critical patent/JP5865470B1/ja
Priority to PCT/JP2015/080378 priority patent/WO2016084541A1/ja
Priority to CN201580002287.4A priority patent/CN105874342B/zh
Priority to TW104136671A priority patent/TWI555687B/zh
Application granted granted Critical
Publication of JP5865470B1 publication Critical patent/JP5865470B1/ja
Publication of JP2016102723A publication Critical patent/JP2016102723A/ja
Priority to HK16110353.2A priority patent/HK1222226A1/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)
JP2014241439A 2014-11-28 2014-11-28 電子部品搬送装置 Active JP5865470B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014241439A JP5865470B1 (ja) 2014-11-28 2014-11-28 電子部品搬送装置
PCT/JP2015/080378 WO2016084541A1 (ja) 2014-11-28 2015-10-28 電子部品搬送装置
CN201580002287.4A CN105874342B (zh) 2014-11-28 2015-10-28 电子零件搬送装置
TW104136671A TWI555687B (zh) 2014-11-28 2015-11-06 Electronic component handling device
HK16110353.2A HK1222226A1 (zh) 2014-11-28 2016-08-31 電子零件搬送裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014241439A JP5865470B1 (ja) 2014-11-28 2014-11-28 電子部品搬送装置

Publications (2)

Publication Number Publication Date
JP5865470B1 true JP5865470B1 (ja) 2016-02-17
JP2016102723A JP2016102723A (ja) 2016-06-02

Family

ID=55346974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014241439A Active JP5865470B1 (ja) 2014-11-28 2014-11-28 電子部品搬送装置

Country Status (5)

Country Link
JP (1) JP5865470B1 (zh)
CN (1) CN105874342B (zh)
HK (1) HK1222226A1 (zh)
TW (1) TWI555687B (zh)
WO (1) WO2016084541A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6164624B1 (ja) * 2016-10-18 2017-07-19 上野精機株式会社 電子部品移動装置及び電子部品搬送装置
TWI679422B (zh) * 2016-12-02 2019-12-11 全新方位科技股份有限公司 高載量手臂自動機
DE102017124571B4 (de) * 2017-10-20 2020-01-09 Asm Assembly Systems Gmbh & Co. Kg Halte- und Antriebseinrichtung, Werkzeugeinrichtung, Ergänzungswerkzeugeinrichtung von einer modular aufgebauten Bauelement-Handhabungsvorrichtung, Vorrichtung zum Handhaben von Bauelementen sowie Verfahren zum anwendungsspezifischen Konfigurieren einer solchen Vorrichtung
IT201900006834A1 (it) * 2019-05-14 2020-11-14 Nuova Sima Spa Apparato di smistamento per smistare ed impilare piastrelle
JP2021004109A (ja) * 2019-06-25 2021-01-14 上野精機株式会社 電子部品の処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448683U (zh) * 1987-09-19 1989-03-27
JP2009139157A (ja) * 2007-12-04 2009-06-25 Ueno Seiki Kk 高低温化ユニット及び高低温化テストハンドラ
JP2012173003A (ja) * 2011-02-17 2012-09-10 Ueno Seiki Kk 電子部品測定装置
WO2013084296A1 (ja) * 2011-12-06 2013-06-13 上野精機株式会社 電子部品搬送装置
WO2014087484A1 (ja) * 2012-12-04 2014-06-12 上野精機株式会社 テストコンタクト及び電子部品搬送装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420691A (en) * 1991-03-15 1995-05-30 Matsushita Electric Industrial Co., Ltd. Electric component observation system
JP4769538B2 (ja) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 電子部品用コンタクタ及びコンタクト方法
JP2006284384A (ja) * 2005-03-31 2006-10-19 Fujitsu Ltd 半導体装置の試験装置及び試験方法
JP5088167B2 (ja) * 2008-02-22 2012-12-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
JP5441241B2 (ja) * 2008-12-02 2014-03-12 上野精機株式会社 工程処理装置及び工程処理方法並びに工程処理用プログラム
JP2012020822A (ja) * 2010-07-13 2012-02-02 Tokyo Weld Co Ltd ワーク搬送装置
JP5889581B2 (ja) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
JP5423627B2 (ja) * 2010-09-14 2014-02-19 富士通セミコンダクター株式会社 半導体装置の試験装置及び試験方法
JP5711564B2 (ja) * 2011-02-17 2015-05-07 ベックマン コールター， インコーポレイテッド 自動分析機
US10029298B2 (en) * 2013-03-27 2018-07-24 Nittan Valve Co., Ltd. Bar material transfer method and conveyor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448683U (zh) * 1987-09-19 1989-03-27
JP2009139157A (ja) * 2007-12-04 2009-06-25 Ueno Seiki Kk 高低温化ユニット及び高低温化テストハンドラ
JP2012173003A (ja) * 2011-02-17 2012-09-10 Ueno Seiki Kk 電子部品測定装置
WO2013084296A1 (ja) * 2011-12-06 2013-06-13 上野精機株式会社 電子部品搬送装置
WO2014087484A1 (ja) * 2012-12-04 2014-06-12 上野精機株式会社 テストコンタクト及び電子部品搬送装置

Also Published As

Publication number Publication date
TW201623127A (zh) 2016-07-01
HK1222226A1 (zh) 2017-06-23
JP2016102723A (ja) 2016-06-02
CN105874342B (zh) 2017-10-24
WO2016084541A1 (ja) 2016-06-02
TWI555687B (zh) 2016-11-01
CN105874342A (zh) 2016-08-17

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