HK1222226A1 - 電子零件搬送裝置 - Google Patents

電子零件搬送裝置

Info

Publication number
HK1222226A1
HK1222226A1 HK16110353.2A HK16110353A HK1222226A1 HK 1222226 A1 HK1222226 A1 HK 1222226A1 HK 16110353 A HK16110353 A HK 16110353A HK 1222226 A1 HK1222226 A1 HK 1222226A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
transporting device
component transporting
electronic
transporting
Prior art date
Application number
HK16110353.2A
Other languages
English (en)
Inventor
Takayuki Matoba
Original Assignee
Ueno Seiki Kk (Ueno Seiki Co Ltd )
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Kk (Ueno Seiki Co Ltd ) filed Critical Ueno Seiki Kk (Ueno Seiki Co Ltd )
Publication of HK1222226A1 publication Critical patent/HK1222226A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
HK16110353.2A 2014-11-28 2016-08-31 電子零件搬送裝置 HK1222226A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014241439A JP5865470B1 (ja) 2014-11-28 2014-11-28 電子部品搬送装置
PCT/JP2015/080378 WO2016084541A1 (ja) 2014-11-28 2015-10-28 電子部品搬送装置

Publications (1)

Publication Number Publication Date
HK1222226A1 true HK1222226A1 (zh) 2017-06-23

Family

ID=55346974

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16110353.2A HK1222226A1 (zh) 2014-11-28 2016-08-31 電子零件搬送裝置

Country Status (5)

Country Link
JP (1) JP5865470B1 (zh)
CN (1) CN105874342B (zh)
HK (1) HK1222226A1 (zh)
TW (1) TWI555687B (zh)
WO (1) WO2016084541A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6164624B1 (ja) * 2016-10-18 2017-07-19 上野精機株式会社 電子部品移動装置及び電子部品搬送装置
TWI679422B (zh) * 2016-12-02 2019-12-11 全新方位科技股份有限公司 高載量手臂自動機
DE102017124571B4 (de) 2017-10-20 2020-01-09 Asm Assembly Systems Gmbh & Co. Kg Halte- und Antriebseinrichtung, Werkzeugeinrichtung, Ergänzungswerkzeugeinrichtung von einer modular aufgebauten Bauelement-Handhabungsvorrichtung, Vorrichtung zum Handhaben von Bauelementen sowie Verfahren zum anwendungsspezifischen Konfigurieren einer solchen Vorrichtung
IT201900006834A1 (it) * 2019-05-14 2020-11-14 Nuova Sima Spa Apparato di smistamento per smistare ed impilare piastrelle
JP2021004109A (ja) * 2019-06-25 2021-01-14 上野精機株式会社 電子部品の処理装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448683U (zh) * 1987-09-19 1989-03-27
US5420691A (en) * 1991-03-15 1995-05-30 Matsushita Electric Industrial Co., Ltd. Electric component observation system
JP4769538B2 (ja) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 電子部品用コンタクタ及びコンタクト方法
JP2006284384A (ja) * 2005-03-31 2006-10-19 Fujitsu Ltd 半導体装置の試験装置及び試験方法
JP4941988B2 (ja) * 2007-12-04 2012-05-30 上野精機株式会社 高低温化ユニット及び高低温化テストハンドラ
JP5088167B2 (ja) * 2008-02-22 2012-12-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
JP5441241B2 (ja) * 2008-12-02 2014-03-12 上野精機株式会社 工程処理装置及び工程処理方法並びに工程処理用プログラム
JP2012020822A (ja) * 2010-07-13 2012-02-02 Tokyo Weld Co Ltd ワーク搬送装置
JP5889581B2 (ja) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
JP5423627B2 (ja) * 2010-09-14 2014-02-19 富士通セミコンダクター株式会社 半導体装置の試験装置及び試験方法
JP5711564B2 (ja) * 2011-02-17 2015-05-07 ベックマン コールター， インコーポレイテッド 自動分析機
JP5725543B2 (ja) * 2011-02-17 2015-05-27 上野精機株式会社 電子部品測定装置
WO2013084296A1 (ja) * 2011-12-06 2013-06-13 上野精機株式会社 電子部品搬送装置
WO2014087484A1 (ja) * 2012-12-04 2014-06-12 上野精機株式会社 テストコンタクト及び電子部品搬送装置
US10029298B2 (en) * 2013-03-27 2018-07-24 Nittan Valve Co., Ltd. Bar material transfer method and conveyor

Also Published As

Publication number Publication date
TWI555687B (zh) 2016-11-01
JP2016102723A (ja) 2016-06-02
CN105874342B (zh) 2017-10-24
CN105874342A (zh) 2016-08-17
TW201623127A (zh) 2016-07-01
WO2016084541A1 (ja) 2016-06-02
JP5865470B1 (ja) 2016-02-17

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