HK1209232A1 - 電子設備 - Google Patents
電子設備Info
- Publication number
- HK1209232A1 HK1209232A1 HK15109623.9A HK15109623A HK1209232A1 HK 1209232 A1 HK1209232 A1 HK 1209232A1 HK 15109623 A HK15109623 A HK 15109623A HK 1209232 A1 HK1209232 A1 HK 1209232A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electronic device
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014029827A JP6207422B2 (ja) | 2014-02-19 | 2014-02-19 | 電子装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1209232A1 true HK1209232A1 (zh) | 2016-03-24 |
Family
ID=53799401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15109623.9A HK1209232A1 (zh) | 2014-02-19 | 2015-09-30 | 電子設備 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9549461B2 (zh) |
JP (1) | JP6207422B2 (zh) |
KR (1) | KR20150098190A (zh) |
CN (1) | CN104851862B (zh) |
HK (1) | HK1209232A1 (zh) |
TW (1) | TW201601261A (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9844135B2 (en) * | 2014-09-08 | 2017-12-12 | Cisco Technology, Inc. | Decoupling capacitive arrangement to manage power integrity |
CN105990260A (zh) * | 2015-02-06 | 2016-10-05 | 展讯通信(上海)有限公司 | 改进型的表面贴装结构 |
KR20180088786A (ko) * | 2015-11-30 | 2018-08-07 | 르네사스 일렉트로닉스 가부시키가이샤 | 전자 장치 |
JP6881726B2 (ja) * | 2016-06-28 | 2021-06-02 | 株式会社Joled | 実装基板 |
CN108463048B (zh) * | 2017-02-21 | 2022-04-15 | 拉碧斯半导体株式会社 | 基板电路装置 |
JP6826467B2 (ja) | 2017-03-10 | 2021-02-03 | ルネサスエレクトロニクス株式会社 | 電子装置 |
US20190006356A1 (en) * | 2017-06-29 | 2019-01-03 | Intel Corporation | Package with embedded capacitors |
JP2019149508A (ja) * | 2018-02-28 | 2019-09-05 | 京セラ株式会社 | 配線基板及び電子装置 |
WO2019244491A1 (ja) * | 2018-06-22 | 2019-12-26 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
CN110941156B (zh) * | 2018-09-25 | 2023-08-25 | 富士胶片商业创新有限公司 | 图像形成装置及基板 |
CN109116485A (zh) * | 2018-11-02 | 2019-01-01 | 青岛海信宽带多媒体技术有限公司 | 一种光接收次模块及光模块 |
TWI708527B (zh) * | 2018-11-23 | 2020-10-21 | 友達光電股份有限公司 | 電路板 |
JP2020150146A (ja) * | 2019-03-14 | 2020-09-17 | キオクシア株式会社 | 半導体装置 |
KR20210017635A (ko) * | 2019-08-09 | 2021-02-17 | 삼성전자주식회사 | 전원공급 보조장치를 구비한 인쇄회로기판, 및 이를 구비한 전자기기 |
JP7362380B2 (ja) | 2019-09-12 | 2023-10-17 | キヤノン株式会社 | 配線基板及び半導体装置 |
JP2021082786A (ja) | 2019-11-22 | 2021-05-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US11495536B2 (en) * | 2020-11-24 | 2022-11-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method for forming thereof |
US11537154B2 (en) | 2020-12-09 | 2022-12-27 | Samsung Electronics Co., Ltd. | Mobile devices and methods controlling power in mobile devices |
US11616019B2 (en) * | 2020-12-21 | 2023-03-28 | Nvidia Corp. | Semiconductor assembly |
CN112885808B (zh) * | 2021-01-21 | 2022-03-08 | 长鑫存储技术有限公司 | 封装基板以及封装结构 |
US11889616B2 (en) * | 2021-03-09 | 2024-01-30 | Mitsubishi Electric Corporation | Circuit board |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5068631A (en) * | 1990-08-09 | 1991-11-26 | At&T Bell Laboratories | Sub power plane to provide EMC filtering for VLSI devices |
JP2001015885A (ja) * | 1999-07-02 | 2001-01-19 | Murata Mfg Co Ltd | 高周波用電子回路及び高周波用電子回路へのチップ三端子コンデンサの実装構造 |
JP4387076B2 (ja) * | 2001-10-18 | 2009-12-16 | 株式会社ルネサステクノロジ | 半導体装置 |
JP3646098B2 (ja) * | 2002-03-27 | 2005-05-11 | コニカミノルタビジネステクノロジーズ株式会社 | 回路基板 |
JP4047351B2 (ja) * | 2005-12-12 | 2008-02-13 | キヤノン株式会社 | 多層プリント回路板 |
US7292450B2 (en) * | 2006-01-31 | 2007-11-06 | Microsoft Corporation | High density surface mount part array layout and assembly technique |
JP2007305642A (ja) * | 2006-05-09 | 2007-11-22 | Murata Mfg Co Ltd | 多層回路基板及び電子装置 |
JP2007317888A (ja) * | 2006-05-25 | 2007-12-06 | Murata Mfg Co Ltd | 電源ライン回路 |
JP5354949B2 (ja) * | 2007-06-19 | 2013-11-27 | キヤノン株式会社 | プリント回路板 |
JP5402830B2 (ja) * | 2010-05-24 | 2014-01-29 | 株式会社村田製作所 | 多層配線基板 |
JP2012064892A (ja) * | 2010-09-17 | 2012-03-29 | Toshiba Corp | 半導体装置 |
-
2014
- 2014-02-19 JP JP2014029827A patent/JP6207422B2/ja active Active
-
2015
- 2015-02-05 KR KR1020150017900A patent/KR20150098190A/ko not_active Application Discontinuation
- 2015-02-16 TW TW104105331A patent/TW201601261A/zh unknown
- 2015-02-16 CN CN201510083331.0A patent/CN104851862B/zh active Active
- 2015-02-18 US US14/625,440 patent/US9549461B2/en active Active
- 2015-09-30 HK HK15109623.9A patent/HK1209232A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20150098190A (ko) | 2015-08-27 |
US9549461B2 (en) | 2017-01-17 |
JP2015154062A (ja) | 2015-08-24 |
CN104851862B (zh) | 2018-09-07 |
JP6207422B2 (ja) | 2017-10-04 |
TW201601261A (zh) | 2016-01-01 |
US20150237731A1 (en) | 2015-08-20 |
CN104851862A (zh) | 2015-08-19 |
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