JP5837689B2 - 光子計数uv−apd - Google Patents
光子計数uv−apd Download PDFInfo
- Publication number
- JP5837689B2 JP5837689B2 JP2014519066A JP2014519066A JP5837689B2 JP 5837689 B2 JP5837689 B2 JP 5837689B2 JP 2014519066 A JP2014519066 A JP 2014519066A JP 2014519066 A JP2014519066 A JP 2014519066A JP 5837689 B2 JP5837689 B2 JP 5837689B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- epitaxial layer
- apd
- doping type
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/225—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/179,378 US8368159B2 (en) | 2011-07-08 | 2011-07-08 | Photon counting UV-APD |
| US13/179,378 | 2011-07-08 | ||
| PCT/US2012/045744 WO2013009615A1 (en) | 2011-07-08 | 2012-07-06 | Photon counting uv-apd |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014518458A JP2014518458A (ja) | 2014-07-28 |
| JP2014518458A5 JP2014518458A5 (enExample) | 2015-04-09 |
| JP5837689B2 true JP5837689B2 (ja) | 2015-12-24 |
Family
ID=46650862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014519066A Active JP5837689B2 (ja) | 2011-07-08 | 2012-07-06 | 光子計数uv−apd |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8368159B2 (enExample) |
| JP (1) | JP5837689B2 (enExample) |
| WO (1) | WO2013009615A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10347670B2 (en) | 2017-03-15 | 2019-07-09 | Kabushiki Kaisha Toshiba | Photodetection element |
| KR102566061B1 (ko) * | 2017-03-22 | 2023-08-11 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 촬상 장치 및 신호 처리 장치 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11121271B2 (en) | 2013-05-22 | 2021-09-14 | W&WSens, Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
| US10446700B2 (en) | 2013-05-22 | 2019-10-15 | W&Wsens Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
| US10700225B2 (en) | 2013-05-22 | 2020-06-30 | W&Wsens Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
| WO2014190189A2 (en) | 2013-05-22 | 2014-11-27 | Shih-Yuan Wang | Microstructure enhanced absorption photosensitive devices |
| US10468543B2 (en) | 2013-05-22 | 2019-11-05 | W&Wsens Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
| CN107078145B (zh) * | 2014-11-18 | 2019-05-07 | 王士原 | 经微结构增强吸收的光敏器件 |
| CN107615495B (zh) * | 2015-05-28 | 2019-05-03 | 日本电信电话株式会社 | 光接收元件和光学集成电路 |
| JP6994882B2 (ja) * | 2017-09-25 | 2022-01-14 | エイブリック株式会社 | 紫外線受光素子及び紫外線受光素子の製造方法 |
| CN109346552B (zh) * | 2018-10-22 | 2020-06-19 | 中国科学院半导体研究所 | 基于弧形扩散区的雪崩光电探测器及其制作方法 |
| JP7008653B2 (ja) * | 2019-02-07 | 2022-01-25 | 株式会社東芝 | 分子検出装置 |
| RU2732694C1 (ru) * | 2019-03-12 | 2020-09-21 | Общество С Ограниченной Ответственностью "Детектор Фотонный Аналоговый" (Ооо "Дефан") | Лавинный фотодетектор (варианты) и способ его изготовления (варианты) |
| RU2732695C1 (ru) * | 2019-03-12 | 2020-09-21 | Общество С Ограниченной Ответственностью "Детектор Фотонный Аналоговый" (Ооо "Дефан") | Лавинный фотодетектор (варианты) и способ его изготовления (варианты) |
| US11372119B2 (en) | 2019-04-02 | 2022-06-28 | Massachusetts Institute Of Technology | Rapid prototyping of single-photon-sensitive silicon avalanche photodiodes |
| JP2020170812A (ja) * | 2019-04-05 | 2020-10-15 | ソニーセミコンダクタソリューションズ株式会社 | アバランシェフォトダイオードセンサおよびセンサ装置 |
| CN110690314B (zh) * | 2019-09-05 | 2023-06-27 | 中国电子科技集团公司第十三研究所 | 吸收层与倍增层为分离结构的紫外探测器及其制备方法 |
| JP2020073889A (ja) * | 2019-12-04 | 2020-05-14 | 株式会社東芝 | 光検出器およびこれを用いたライダー装置 |
| US11322636B2 (en) * | 2020-02-24 | 2022-05-03 | Globalfoundries U.S. Inc. | Photodiode |
| CN111628033B (zh) * | 2020-05-28 | 2023-10-10 | 湖北京邦科技有限公司 | 光电探测装置的制造方法 |
| GB2609183B (en) * | 2021-05-10 | 2023-05-24 | X Fab Global Services Gmbh | Improved semiconducter light sensor |
| WO2025155931A1 (en) * | 2024-01-17 | 2025-07-24 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Metrological photon counter and metrologically counting photons at room temperature |
Family Cites Families (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212076B2 (enExample) * | 1972-09-20 | 1977-04-04 | ||
| US4127932A (en) | 1976-08-06 | 1978-12-05 | Bell Telephone Laboratories, Incorporated | Method of fabricating silicon photodiodes |
| US4326211A (en) * | 1977-09-01 | 1982-04-20 | U.S. Philips Corporation | N+PP-PP-P+ Avalanche photodiode |
| JPS5616960U (enExample) * | 1979-07-18 | 1981-02-14 | ||
| JPS5669876A (en) * | 1979-11-12 | 1981-06-11 | Mitsubishi Electric Corp | Manufacture of silicon avalanche photo-diode |
| JPS58114470A (ja) * | 1981-12-28 | 1983-07-07 | Fujitsu Ltd | アバランシエフオトダイオ−ド |
| JPS6285477A (ja) * | 1985-10-09 | 1987-04-18 | Hitachi Ltd | 光半導体装置 |
| JPS63215084A (ja) | 1987-03-04 | 1988-09-07 | Toshiba Corp | 半導体受光素子 |
| US5146296A (en) | 1987-12-03 | 1992-09-08 | Xsirius Photonics, Inc. | Devices for detecting and/or imaging single photoelectron |
| GB8817886D0 (en) * | 1988-07-27 | 1988-09-01 | British Telecomm | Avalanche photodiode structure |
| JPH03231476A (ja) | 1990-02-07 | 1991-10-15 | Fujitsu Ltd | アバランシェ・フォトダイオード |
| JPH05234927A (ja) * | 1992-02-20 | 1993-09-10 | Mitsubishi Electric Corp | 半導体デバイスの固相拡散による拡散領域の形成方法 |
| US5923071A (en) * | 1992-06-12 | 1999-07-13 | Seiko Instruments Inc. | Semiconductor device having a semiconductor film of low oxygen concentration |
| JPH0738140A (ja) * | 1993-07-19 | 1995-02-07 | Hamamatsu Photonics Kk | アバランシェホトダイオード |
| JPH07221341A (ja) * | 1993-12-08 | 1995-08-18 | Nikon Corp | 紫外線検出用シリコンアバランシェフォトダイオード |
| JP3091903B2 (ja) * | 1994-08-17 | 2000-09-25 | セイコーインスツルメンツ株式会社 | アバランシェ・フォト・ダイオード及びその製造方法 |
| JP3607385B2 (ja) * | 1995-11-24 | 2005-01-05 | 浜松ホトニクス株式会社 | シリコンアバランシェフォトダイオード |
| KR19980058393A (ko) * | 1996-12-30 | 1998-10-07 | 김영환 | 애벌런치 포토 다이오드 및 그의 제조방법 |
| US6136667A (en) | 1997-10-08 | 2000-10-24 | Lucent Technologies Inc. | Method for bonding two crystalline substrates together |
| US6548878B1 (en) | 1998-02-05 | 2003-04-15 | Integration Associates, Inc. | Method for producing a thin distributed photodiode structure |
| JP3177962B2 (ja) | 1998-05-08 | 2001-06-18 | 日本電気株式会社 | プレーナ型アバランシェフォトダイオード |
| JP2000174325A (ja) | 1998-12-02 | 2000-06-23 | Lucent Technol Inc | 異なる結晶格子を持つ結晶性基板を接着するためのプロセス |
| JP2000252512A (ja) | 1999-02-25 | 2000-09-14 | Siird Center:Kk | Pinフォトダイオード |
| US6690078B1 (en) | 1999-08-05 | 2004-02-10 | Integration Associates, Inc. | Shielded planar dielectrically isolated high speed pin photodiode and method for producing same |
| JP4702977B2 (ja) | 2000-04-28 | 2011-06-15 | 富士通株式会社 | 受光装置 |
| US6294414B1 (en) * | 2000-05-04 | 2001-09-25 | Agere Systems Guardian Corp. | Method of fabricating heterointerface devices having diffused junctions |
| KR100366046B1 (ko) * | 2000-06-29 | 2002-12-27 | 삼성전자 주식회사 | 에벌란치 포토다이오드 제조방법 |
| US6525305B2 (en) | 2000-09-11 | 2003-02-25 | Perkinelmer Canada, Inc. | Large current watchdog circuit for a photodetector |
| JP4376516B2 (ja) | 2000-10-19 | 2009-12-02 | クォンタム セミコンダクター リミテッド ライアビリティ カンパニー | Cmosと一体化されたヘテロ接合ホトダイオードの製造方法 |
| US6774448B1 (en) * | 2000-11-30 | 2004-08-10 | Optical Communication Products, Inc. | High speed detectors having integrated electrical components |
| US6583482B2 (en) * | 2000-12-06 | 2003-06-24 | Alexandre Pauchard | Hetero-interface avalance photodetector |
| JP4938221B2 (ja) * | 2002-02-01 | 2012-05-23 | ピコメトリックス インコーポレイテッド | プレーナ・アバランシェ・フォトダイオード |
| US6894322B2 (en) * | 2002-02-11 | 2005-05-17 | Jds Uniphase Corporation | Back illuminated photodiodes |
| WO2003097552A1 (en) | 2002-04-30 | 2003-11-27 | Agency For Science Technology And Research | A method of wafer/substrate bonding |
| GB0216075D0 (en) | 2002-07-11 | 2002-08-21 | Qinetiq Ltd | Photodetector circuits |
| US6838741B2 (en) * | 2002-12-10 | 2005-01-04 | General Electtric Company | Avalanche photodiode for use in harsh environments |
| JP2005093610A (ja) * | 2003-09-16 | 2005-04-07 | Sumitomo Electric Ind Ltd | 光受信器 |
| KR100555526B1 (ko) * | 2003-11-12 | 2006-03-03 | 삼성전자주식회사 | 포토 다이오드 및 그 제조방법 |
| KR100630679B1 (ko) * | 2003-12-17 | 2006-10-02 | 삼성전자주식회사 | 포토 다이오드 및 이의 제조 방법 |
| US7160753B2 (en) * | 2004-03-16 | 2007-01-09 | Voxtel, Inc. | Silicon-on-insulator active pixel sensors |
| RU2290721C2 (ru) | 2004-05-05 | 2006-12-27 | Борис Анатольевич Долгошеин | Кремниевый фотоэлектронный умножитель (варианты) и ячейка для кремниевого фотоэлектронного умножителя |
| US20080012087A1 (en) | 2006-04-19 | 2008-01-17 | Henri Dautet | Bonded wafer avalanche photodiode and method for manufacturing same |
| JP5015494B2 (ja) * | 2006-05-22 | 2012-08-29 | 住友電工デバイス・イノベーション株式会社 | 半導体受光素子 |
| JP2007317768A (ja) * | 2006-05-24 | 2007-12-06 | Matsushita Electric Ind Co Ltd | 光半導体装置およびその製造方法 |
| TWI443817B (zh) * | 2006-07-03 | 2014-07-01 | 濱松赫德尼古斯股份有限公司 | Photodiode array |
| US7741657B2 (en) | 2006-07-17 | 2010-06-22 | Intel Corporation | Inverted planar avalanche photodiode |
| US8044436B2 (en) * | 2007-03-07 | 2011-10-25 | Princeton Lightwave, Inc. | Avalanche photodiode having controlled breakdown voltage |
| US7863647B1 (en) * | 2007-03-19 | 2011-01-04 | Northrop Grumman Systems Corporation | SiC avalanche photodiode with improved edge termination |
| US7834379B2 (en) * | 2007-07-18 | 2010-11-16 | Jds Uniphase Corporation | Avalanche photodiode with edge breakdown suppression |
| DE102007037020B3 (de) | 2007-08-06 | 2008-08-21 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Avalanche-Photodiode |
| US7795064B2 (en) * | 2007-11-14 | 2010-09-14 | Jds Uniphase Corporation | Front-illuminated avalanche photodiode |
| KR100928204B1 (ko) * | 2007-12-11 | 2009-11-25 | 한국전자통신연구원 | 실리콘 에피층을 이용한 cmos 기반의 평판형 애벌란시포토다이오드 및 그 제조 방법 |
| JP2009218457A (ja) * | 2008-03-12 | 2009-09-24 | Panasonic Corp | 光半導体装置 |
| US20100108893A1 (en) | 2008-11-04 | 2010-05-06 | Array Optronix, Inc. | Devices and Methods for Ultra Thin Photodiode Arrays on Bonded Supports |
| IT1392366B1 (it) | 2008-12-17 | 2012-02-28 | St Microelectronics Rousset | Fotodiodo operante in modalita' geiger con resistore di soppressione integrato e controllabile, schiera di fotodiodi e relativo procedimento di fabbricazione |
| JP2010147158A (ja) * | 2008-12-17 | 2010-07-01 | Mitsubishi Electric Corp | 半導体受光素子および半導体受光素子の製造方法 |
| JP5185208B2 (ja) * | 2009-02-24 | 2013-04-17 | 浜松ホトニクス株式会社 | フォトダイオード及びフォトダイオードアレイ |
| JP2010278045A (ja) * | 2009-05-26 | 2010-12-09 | Panasonic Corp | 光半導体装置 |
| US7948006B2 (en) * | 2009-06-01 | 2011-05-24 | Jds Uniphase Corporation | Photodiode with high ESD threshold |
| WO2011071483A1 (en) | 2009-12-07 | 2011-06-16 | Array Optronix, Inc. | Back-illuminated si photomultipliers: structure and fabrication methods |
| KR20110068041A (ko) * | 2009-12-15 | 2011-06-22 | 한국전자통신연구원 | 마이크로 렌즈가 집적된 아발란치 광 검출기 |
| IT1399690B1 (it) * | 2010-03-30 | 2013-04-26 | St Microelectronics Srl | Fotodiodo a valanga operante in modalita' geiger ad elevato rapporto segnale rumore e relativo procedimento di fabbricazione |
-
2011
- 2011-07-08 US US13/179,378 patent/US8368159B2/en active Active
-
2012
- 2012-07-06 WO PCT/US2012/045744 patent/WO2013009615A1/en not_active Ceased
- 2012-07-06 JP JP2014519066A patent/JP5837689B2/ja active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10347670B2 (en) | 2017-03-15 | 2019-07-09 | Kabushiki Kaisha Toshiba | Photodetection element |
| KR102566061B1 (ko) * | 2017-03-22 | 2023-08-11 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 촬상 장치 및 신호 처리 장치 |
| US12136641B2 (en) | 2017-03-22 | 2024-11-05 | Sony Semiconductor Solutions Corporation | Imaging device and signal processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| US8368159B2 (en) | 2013-02-05 |
| JP2014518458A (ja) | 2014-07-28 |
| US20130009265A1 (en) | 2013-01-10 |
| WO2013009615A1 (en) | 2013-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5837689B2 (ja) | 光子計数uv−apd | |
| US6720595B2 (en) | Three-dimensional island pixel photo-sensor | |
| US7525170B2 (en) | Pillar P-i-n semiconductor diodes | |
| CN113540266B (zh) | 雪崩光电二极管 | |
| EP2592661B1 (en) | Lateral avalanche photodiode device and method of production | |
| CN109690792A (zh) | Spad光电二极管 | |
| JP2018156984A (ja) | 光検出素子 | |
| EP3518292B1 (en) | Method for manufacturing a photodiode detector | |
| US12324250B2 (en) | Single-photon avalanche photodiode | |
| JP2017005276A (ja) | シングルフォトンアバランシェダイオード | |
| CN115176346B (zh) | 单光子雪崩二极管器件 | |
| JP7665577B2 (ja) | 半導体基板内にゲルマニウム領域を配置した半導体装置 | |
| CN111628034B (zh) | 光电探测装置的制造方法 | |
| JP7637466B2 (ja) | 直交層構造を有するフォトダイオード | |
| KR100977199B1 (ko) | 증가된 청색광 감도를 가지는 광감지 소자 및 그 제조 방법 | |
| CN111628033B (zh) | 光电探测装置的制造方法 | |
| US9202829B2 (en) | Light sensors with infrared photocurrent suppression | |
| CN117174717A (zh) | 堆叠式spad传感器装置 | |
| US10439092B2 (en) | Infrared ray detection element and method for manufacturing infrared ray detection element | |
| KR20220062014A (ko) | 검출 매개변수를 개선한 후면 조명 광학 센서의 제조 방법 | |
| CN107086253B (zh) | 半导体器件的制造方法 | |
| CN119698085A (zh) | 一种单光子雪崩光电二极管及其制备方法 | |
| KR101707897B1 (ko) | 실리콘 광 증배 소자 | |
| CN117393634A (zh) | 一种雪崩二极管及其制备方法 | |
| WO2010083372A1 (en) | High quantum efficiency optical detectors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150220 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150220 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20150220 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20150326 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150410 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150709 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150806 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151014 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151105 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5837689 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |