JP5807554B2 - 剥離装置、及び電子デバイスの製造方法 - Google Patents

剥離装置、及び電子デバイスの製造方法 Download PDF

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Publication number
JP5807554B2
JP5807554B2 JP2012009347A JP2012009347A JP5807554B2 JP 5807554 B2 JP5807554 B2 JP 5807554B2 JP 2012009347 A JP2012009347 A JP 2012009347A JP 2012009347 A JP2012009347 A JP 2012009347A JP 5807554 B2 JP5807554 B2 JP 5807554B2
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knife
reinforcing plate
unit
imaging
plate
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JP2013147325A (ja
Inventor
圭 滝内
圭 滝内
泰則 伊藤
泰則 伊藤
彰久 石野
彰久 石野
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AGC Inc
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Asahi Glass Co Ltd
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Priority to JP2012009347A priority Critical patent/JP5807554B2/ja
Priority to CN201310018432.0A priority patent/CN103219263B/zh
Priority to KR1020130006016A priority patent/KR101960103B1/ko
Priority to TW102102127A priority patent/TWI566306B/zh
Publication of JP2013147325A publication Critical patent/JP2013147325A/ja
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  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Quality & Reliability (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2012009347A 2012-01-19 2012-01-19 剥離装置、及び電子デバイスの製造方法 Active JP5807554B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012009347A JP5807554B2 (ja) 2012-01-19 2012-01-19 剥離装置、及び電子デバイスの製造方法
CN201310018432.0A CN103219263B (zh) 2012-01-19 2013-01-18 剥离装置和电子设备的制造方法
KR1020130006016A KR101960103B1 (ko) 2012-01-19 2013-01-18 박리 장치 및 전자 디바이스의 제조 방법
TW102102127A TWI566306B (zh) 2012-01-19 2013-01-18 A peeling device and a method for manufacturing the electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012009347A JP5807554B2 (ja) 2012-01-19 2012-01-19 剥離装置、及び電子デバイスの製造方法

Publications (2)

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JP2013147325A JP2013147325A (ja) 2013-08-01
JP5807554B2 true JP5807554B2 (ja) 2015-11-10

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JP2012009347A Active JP5807554B2 (ja) 2012-01-19 2012-01-19 剥離装置、及び電子デバイスの製造方法

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JP (1) JP5807554B2 (ko)
KR (1) KR101960103B1 (ko)
CN (1) CN103219263B (ko)
TW (1) TWI566306B (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618131B (zh) * 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
CN105377732B (zh) * 2013-09-17 2017-05-31 日本电气硝子株式会社 玻璃膜剥离装置
JP2015145306A (ja) * 2014-02-04 2015-08-13 旭硝子株式会社 積層体の剥離開始部作成方法及び剥離開始部作成装置並びに電子デバイスの製造方法
JP6075567B2 (ja) * 2014-04-30 2017-02-08 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6402499B2 (ja) * 2014-06-12 2018-10-10 凸版印刷株式会社 剥離きっかけ作製装置及び方法
JP6354945B2 (ja) * 2014-07-11 2018-07-11 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6269954B2 (ja) * 2014-07-11 2018-01-31 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
KR20170075719A (ko) * 2014-10-29 2017-07-03 아사히 가라스 가부시키가이샤 기판의 흡착 장치 및 기판의 접합 장치 및 접합 방법 그리고 전자 디바이스의 제조 방법
KR102437466B1 (ko) 2014-12-26 2022-08-30 에이지씨 가부시키가이샤 적층체의 박리 개시부 형성 방법, 및 박리 개시부 형성 장치 그리고 전자 디바이스의 제조 방법
JP6345611B2 (ja) * 2015-02-04 2018-06-20 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム、および情報記憶媒体
JP6436389B2 (ja) * 2015-02-18 2018-12-12 Ａｇｃ株式会社 剥離開始部作成装置、及び剥離開始部作成方法並びに電子デバイスの製造方法
JP6450620B2 (ja) * 2015-03-26 2019-01-09 東京応化工業株式会社 基板剥離装置および基板剥離方法
CN105047589B (zh) * 2015-07-08 2018-05-29 浙江中纳晶微电子科技有限公司 晶圆解键合装置
JP6519951B2 (ja) 2015-07-24 2019-05-29 日本電気硝子株式会社 ガラスフィルムの製造方法、及びガラスフィルムを含む電子デバイスの製造方法
JP6064015B2 (ja) * 2015-10-14 2017-01-18 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP6235751B1 (ja) * 2017-07-20 2017-11-22 株式会社 ベアック 補強板貼付装置
CN108155086A (zh) * 2017-12-13 2018-06-12 武汉华星光电半导体显示技术有限公司 一种分离玻璃基板与柔性oled显示面板的方法及设备
CN110690158B (zh) * 2019-09-25 2022-03-22 云谷（固安）科技有限公司 剥离装置及剥离方法
KR102220348B1 (ko) * 2019-11-26 2021-02-25 세메스 주식회사 웨이퍼 분리 장치
CN111613555A (zh) * 2020-05-22 2020-09-01 深圳市华星光电半导体显示技术有限公司 分离装置和分离方法
CN112297586B (zh) * 2020-10-14 2023-07-28 河北光兴半导体技术有限公司 显示面板用的层叠玻璃组件的分离方法
JP7266344B1 (ja) 2022-10-11 2023-04-28 不二越機械工業株式会社 剥離装置及び剥離方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163973B2 (ja) * 1996-03-26 2001-05-08 日本電気株式会社 半導体ウエハ・チャック装置及び半導体ウエハの剥離方法
JP2002022919A (ja) * 2000-07-04 2002-01-23 Toppan Printing Co Ltd カラーフィルタの製造方法
JP2004247721A (ja) * 2003-01-23 2004-09-02 Toray Ind Inc 電子回路基板の製造方法および製造装置
CN100579333C (zh) * 2003-01-23 2010-01-06 东丽株式会社 电路基板用部件、电路基板的制造方法及电路基板的制造装置
JP4668052B2 (ja) * 2005-12-06 2011-04-13 東京応化工業株式会社 剥離装置
JP4854442B2 (ja) * 2006-09-21 2012-01-18 倉敷紡績株式会社 薄切片試料作製方法及び装置
US8025842B2 (en) * 2006-09-21 2011-09-27 Kurashiki Boseki Kabushiki Kaisha Apparatus and method for preparing sliced specimen
JP2008306119A (ja) * 2007-06-11 2008-12-18 Lintec Corp 分離装置及び分離方法
KR101311652B1 (ko) * 2009-02-06 2013-09-25 아사히 가라스 가부시키가이샤 전자 디바이스의 제조 방법 및 이것에 이용하는 박리 장치
EP2230683B1 (de) * 2009-03-18 2016-03-16 EV Group GmbH Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger
EP2290679B1 (de) * 2009-09-01 2016-05-04 EV Group GmbH Vorrichtung und Verfahren zum Ablösen eines Produktsubstrats (z.B. eines Halbleiterwafers) von einem Trägersubstrat durch Verformung eines auf einem Filmrahmen montierten flexiblen Films

Also Published As

Publication number Publication date
CN103219263A (zh) 2013-07-24
JP2013147325A (ja) 2013-08-01
KR20130085385A (ko) 2013-07-29
TWI566306B (zh) 2017-01-11
KR101960103B1 (ko) 2019-03-19
CN103219263B (zh) 2017-04-26
TW201334090A (zh) 2013-08-16

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