JP5797286B2 - 多層構成素子 - Google Patents
多層構成素子 Download PDFInfo
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- JP5797286B2 JP5797286B2 JP2014010362A JP2014010362A JP5797286B2 JP 5797286 B2 JP5797286 B2 JP 5797286B2 JP 2014010362 A JP2014010362 A JP 2014010362A JP 2014010362 A JP2014010362 A JP 2014010362A JP 5797286 B2 JP5797286 B2 JP 5797286B2
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- 239000000919 ceramic Substances 0.000 claims description 74
- 230000006378 damage Effects 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 description 24
- 238000003825 pressing Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 18
- 239000012528 membrane Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000032258 transport Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- -1 ceramics Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/604—Pressing at temperatures other than sintering temperatures
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/348—Zirconia, hafnia, zirconates or hafnates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Description
−半製品の膜積層体を形成するためにセラミック膜が圧着される際に適用される、温度および/または圧力および圧力をかける時間
−上述のパラメータに依存する結合効果と関連した、セラミック膜に使用されるバインダの選択
−多層セグメントが圧着される際に適用される、温度および/または圧力および圧力をかける時間
2 セラミック層
3 電極層
4 多層セグメント
5 設定破壊部
6 外部コンタクト
7 大型ブロック
8 空洞部
9 型抜きツール(穴あけ具)
10 空洞部の底側の開口部
11 垂直方向の固定用孔部
12 水平方向の孔部
13 空洞部の上側の開口部
A−A 切断線
Claims (7)
- それぞれが交互に積層されたセラミック層(2)と電極層(3)とを含む複数の多層セグメント(4)と、
前記多層セグメント(4)において、前記セラミック層(2)と平行に延在し、2つの隣接する前記多層セグメント(4)の間に位置する境界領域に設けられ、低減された引っ張り強さを有する設定破壊領域(5)と、を備え、
前記設定破壊領域(5)は、2つの隣接する前記多層セグメント(4)のエッジ側へと入り込み、更に隣接する前記セラミック層(2)内へと延在する、ことを特徴とする多層構成素子(1)。 - 前記電極層(3)が隣接する前記セラミック層(2)の間に配置され、前記設定破壊領域(5)が隣接する前記セラミック層に部分的に含まれる、ことを特徴とする請求項1に記載の多層構成素子(1)。
- 前記電極層(3)は、2つの隣接する前記多層セグメント(4)の2つの隣接する前記セラミック層(2)の間に配置されていない、ことを特徴とする請求項1に記載の多層構成素子(1)。
- 複数の設定破壊領域(5)が、それぞれ一定の距離で前記多層構成素子(1)の高さ全体に分布しており、前記距離はそれぞれ、複数のセラミック層(2)と電極層(3)とを有する、ことを特徴とする請求項1乃至3のいずれか1項に記載の多層構成素子(1)。
- それぞれが複数のセラミック層(2)と電極層(3)とを有する、交互に積層された複数の多層セグメント(4)を有し、前記設定破壊領域(5)が隣接する前記多層セグメント(4)の間に延在し、且つ前記多層セグメント(4)に部分的に含まれる、ことを特徴とする請求項1乃至4のいずれか1項に記載の多層構成素子(1)。
- 前記多層セグメント(4)の間に位置する前記設定破壊領域(5)によって、前記多層セグメント(4)に負荷される機械的応力が前記多層セグメント(4)の内部に入り込む亀裂を生じさせる、ことを特徴とする請求項5に記載の多層構成素子(1)。
- 前記設定破壊領域(5)が、前記多層構成素子(1)全体における前記セラミック層(2)の平均多孔性よりも高い多孔性を有する、ことを特徴とする請求項1乃至6のいずれか1項に記載の多層構成素子(1)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007005341A DE102007005341A1 (de) | 2007-02-02 | 2007-02-02 | Vielschichtbauelement sowie Verfahren zur Herstellung eines Vielschichtbauelements |
DE102007005341.1 | 2007-02-02 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009547697A Division JP5507261B2 (ja) | 2007-02-02 | 2008-01-31 | 多層構成素子の製造方法 |
Publications (2)
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JP2014112701A JP2014112701A (ja) | 2014-06-19 |
JP5797286B2 true JP5797286B2 (ja) | 2015-10-21 |
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JP2009547697A Active JP5507261B2 (ja) | 2007-02-02 | 2008-01-31 | 多層構成素子の製造方法 |
JP2014010362A Expired - Fee Related JP5797286B2 (ja) | 2007-02-02 | 2014-01-23 | 多層構成素子 |
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JP2009547697A Active JP5507261B2 (ja) | 2007-02-02 | 2008-01-31 | 多層構成素子の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20100019625A1 (ja) |
EP (1) | EP2122701B1 (ja) |
JP (2) | JP5507261B2 (ja) |
DE (1) | DE102007005341A1 (ja) |
WO (1) | WO2008092932A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102010063217A1 (de) * | 2010-12-16 | 2012-06-21 | Robert Bosch Gmbh | Elektroden-Trägerfolie, insbesondere zur Herstellung von piezoelektrischen Bauelementen, und Verfahren zur Herstellung eines piezoelektrischen Bauelements |
DE102011079658A1 (de) * | 2011-07-22 | 2013-01-24 | Robert Bosch Gmbh | Verfahren zur Herstellung eines keramischen Mehrlagenbauelements und keramisches Mehrlagenbauelement |
CN102820543B (zh) * | 2012-06-29 | 2015-04-29 | 深圳光启高等理工研究院 | 大型超材料板材的制造方法及大口径超材料天线罩的制造方法 |
DE102016101247A1 (de) * | 2015-11-02 | 2017-05-04 | Epcos Ag | Sensorelement und Verfahren zur Herstellung eines Sensorelements |
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JPS60231460A (ja) * | 1984-04-14 | 1985-11-18 | 日石三菱株式会社 | セラミツクス製品の製造方法 |
JPH0732273B2 (ja) * | 1986-05-22 | 1995-04-10 | 日本電気株式会社 | 電歪効果素子 |
US4932119A (en) * | 1989-03-28 | 1990-06-12 | Litton Systems, Inc. | Method of making standard electrodisplacive transducers for deformable mirrors |
JP2504277B2 (ja) * | 1990-04-19 | 1996-06-05 | 株式会社村田製作所 | 積層型セラミック電子部品用セラミックグリ―ンシ―トの製造方法および装置 |
JP3241129B2 (ja) | 1992-11-20 | 2001-12-25 | 太平洋セメント株式会社 | 振動波モータ用の積層型圧電素子及びその製造方法 |
JPH08306979A (ja) * | 1995-05-11 | 1996-11-22 | Tdk Corp | 積層型圧電体装置 |
DE19615694C1 (de) * | 1996-04-19 | 1997-07-03 | Siemens Ag | Monolithischer Vielschicht-Piezoaktor und Verfahren zur Herstellung |
US6261927B1 (en) * | 1999-04-30 | 2001-07-17 | International Business Machines Corporation | Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
JP4042431B2 (ja) * | 2001-04-27 | 2008-02-06 | 株式会社デンソー | セラミック積層体の製造方法 |
US7468112B2 (en) * | 2001-04-18 | 2008-12-23 | Denso Corporation | Method of producing a ceramic laminate |
JP4035988B2 (ja) | 2001-12-06 | 2008-01-23 | 株式会社デンソー | セラミック積層体及びその製造方法 |
JP3891009B2 (ja) | 2002-03-06 | 2007-03-07 | 株式会社デンソー | セラミック積層体の製造方法 |
DE10234787C1 (de) | 2002-06-07 | 2003-10-30 | Pi Ceramic Gmbh Keramische Tec | Verfahren zur Herstellung eines monolithischen Vielschichtaktors, monolithischer Vielschichtaktor aus einem piezokeramischen oder elektrostriktiven Material |
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DE102004031402A1 (de) * | 2004-06-29 | 2006-02-09 | Siemens Ag | Piezoelektrisches Bauteil mit Sollbruchstelle, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils |
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DE102005026717B4 (de) * | 2005-06-09 | 2016-09-15 | Epcos Ag | Piezoelektrisches Vielschichtbauelement |
JP2007019420A (ja) * | 2005-07-11 | 2007-01-25 | Tdk Corp | 積層型圧電素子 |
WO2007012485A1 (de) * | 2005-07-26 | 2007-02-01 | Siemens Aktiengesellschaft | Monolithischer piezoaktor mit änderung der elektrodenstruktur im übergangsbereich sowie verwendung des piezoaktors |
DE102005050340A1 (de) * | 2005-07-26 | 2007-02-22 | Siemens Ag | Piezoaktor und Verfahren zur Herstellung desselben |
DE602005011970D1 (de) * | 2005-09-16 | 2009-02-05 | Delphi Tech Inc | Piezoelektrischer Aktor |
-
2007
- 2007-02-02 DE DE102007005341A patent/DE102007005341A1/de not_active Withdrawn
-
2008
- 2008-01-31 WO PCT/EP2008/051220 patent/WO2008092932A1/de active Application Filing
- 2008-01-31 EP EP08708531A patent/EP2122701B1/de not_active Not-in-force
- 2008-01-31 JP JP2009547697A patent/JP5507261B2/ja active Active
-
2009
- 2009-08-03 US US12/534,610 patent/US20100019625A1/en not_active Abandoned
-
2011
- 2011-07-29 US US13/194,830 patent/US9728706B2/en not_active Expired - Fee Related
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2014
- 2014-01-23 JP JP2014010362A patent/JP5797286B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100019625A1 (en) | 2010-01-28 |
EP2122701B1 (de) | 2012-10-10 |
DE102007005341A1 (de) | 2008-08-07 |
JP2010518596A (ja) | 2010-05-27 |
WO2008092932A1 (de) | 2008-08-07 |
EP2122701A1 (de) | 2009-11-25 |
US9728706B2 (en) | 2017-08-08 |
US20110277913A1 (en) | 2011-11-17 |
JP5507261B2 (ja) | 2014-05-28 |
JP2014112701A (ja) | 2014-06-19 |
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