JP5753494B2 - 蛍光体変換ｌｅｄ - Google Patents

蛍光体変換ｌｅｄ Download PDF

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JP5753494B2
JP5753494B2 JP2011526096A JP2011526096A JP5753494B2 JP 5753494 B2 JP5753494 B2 JP 5753494B2 JP 2011526096 A JP2011526096 A JP 2011526096A JP 2011526096 A JP2011526096 A JP 2011526096A JP 5753494 B2 JP5753494 B2 JP 5753494B2
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light
die
phosphor
light source
layer
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JP2012516026A (ja
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ウエスト、スコット
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ブリッジラックス インコーポレイテッド
ブリッジラックス インコーポレイテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
JP2011526096A 2008-09-02 2009-08-19 蛍光体変換ｌｅｄ Active JP5753494B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/202,793 2008-09-02
US12/202,793 US7973327B2 (en) 2008-09-02 2008-09-02 Phosphor-converted LED
PCT/US2009/054361 WO2010027672A2 (en) 2008-09-02 2009-08-19 Phosphor-converted led

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014121320A Division JP6010583B2 (ja) 2008-09-02 2014-06-12 蛍光体変換ｌｅｄ

Publications (2)

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JP2012516026A JP2012516026A (ja) 2012-07-12
JP5753494B2 true JP5753494B2 (ja) 2015-07-22

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JP2011526096A Active JP5753494B2 (ja) 2008-09-02 2009-08-19 蛍光体変換ｌｅｄ
JP2014121320A Active JP6010583B2 (ja) 2008-09-02 2014-06-12 蛍光体変換ｌｅｄ
JP2016093163A Pending JP2016167626A (ja) 2008-09-02 2016-05-06 蛍光体変換ｌｅｄ

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JP2014121320A Active JP6010583B2 (ja) 2008-09-02 2014-06-12 蛍光体変換ｌｅｄ
JP2016093163A Pending JP2016167626A (ja) 2008-09-02 2016-05-06 蛍光体変換ｌｅｄ

Country Status (7)

Country Link
US (2) US7973327B2 (OSRAM)
EP (1) EP2332187B1 (OSRAM)
JP (3) JP5753494B2 (OSRAM)
KR (2) KR20110051222A (OSRAM)
CN (1) CN102132428B (OSRAM)
TW (1) TWI419376B (OSRAM)
WO (1) WO2010027672A2 (OSRAM)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100327733A1 (en) * 2009-06-25 2010-12-30 Bridgelux, Inc. Multiple layer phosphor bearing film
US20100328923A1 (en) * 2009-06-25 2010-12-30 Bridgelux, Inc. Multiple layer phosphor bearing film
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
US8232117B2 (en) * 2010-04-30 2012-07-31 Koninklijke Philips Electronics N.V. LED wafer with laminated phosphor layer
JP5566785B2 (ja) * 2010-06-22 2014-08-06 日東電工株式会社 複合シート
JP2012009696A (ja) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd 発光装置およびそれを用いたｌｅｄ照明器具
KR101372084B1 (ko) 2010-06-29 2014-03-07 쿨레지 라이팅 인크. 항복형 기판을 갖는 전자 장치
JP2012069577A (ja) * 2010-09-21 2012-04-05 Citizen Electronics Co Ltd 半導体発光装置及びその製造方法
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
EP2633554A1 (en) * 2010-10-27 2013-09-04 Koninklijke Philips Electronics N.V. Laminate support film for fabrication of light emitting devices and method its fabrication
US8373183B2 (en) 2011-02-22 2013-02-12 Hong Kong Applied Science and Technology Research Institute Company Limited LED package for uniform color emission
JP5745319B2 (ja) * 2011-04-14 2015-07-08 日東電工株式会社 蛍光反射シート、および、発光ダイオード装置の製造方法
JP5670249B2 (ja) * 2011-04-14 2015-02-18 日東電工株式会社 発光素子転写シートの製造方法、発光装置の製造方法、発光素子転写シートおよび発光装置
JP5680472B2 (ja) * 2011-04-22 2015-03-04 シチズンホールディングス株式会社 半導体発光装置の製造方法
JP2012243822A (ja) * 2011-05-16 2012-12-10 Citizen Electronics Co Ltd Ｌｅｄ発光装置とその製造方法
WO2012169289A1 (ja) * 2011-06-07 2012-12-13 東レ株式会社 樹脂シート積層体、その製造方法およびそれを用いた蛍光体含有樹脂シート付きｌｅｄチップの製造方法
JP5730680B2 (ja) * 2011-06-17 2015-06-10 シチズン電子株式会社 Ｌｅｄ発光装置とその製造方法
US9035344B2 (en) 2011-09-14 2015-05-19 VerLASE TECHNOLOGIES LLC Phosphors for use with LEDs and other optoelectronic devices
JP2013077679A (ja) * 2011-09-30 2013-04-25 Citizen Electronics Co Ltd 半導体発光装置とその製造方法
US8779694B1 (en) 2011-12-08 2014-07-15 Automated Assembly Corporation LEDs on flexible substrate arrangement
US9379291B2 (en) 2011-12-16 2016-06-28 Koninklijke Philips N.V. Phosphor in water glass for LEDS
CN103187484A (zh) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 发光二极管封装方法
JP5860289B2 (ja) * 2012-01-05 2016-02-16 シチズン電子株式会社 Ｌｅｄ装置の製造方法
US10043952B2 (en) * 2012-03-30 2018-08-07 Lumileds Llc Light emitting device with wavelength converting side coat
US9404627B2 (en) * 2012-04-13 2016-08-02 Koninklijke Philips N.V. Light conversion assembly, a lamp and a luminaire
JP2013232477A (ja) * 2012-04-27 2013-11-14 Toshiba Corp 発光モジュール
US8629466B2 (en) * 2012-05-22 2014-01-14 Hong Kong Applied Science and Technology Research Institute Company Limited Lighting device
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods
US20150171287A1 (en) * 2012-06-28 2015-06-18 Toray Industrieis, Inc. Resin sheet laminate and process for producing semiconductor light-emitting element using same
KR102131747B1 (ko) * 2012-07-20 2020-07-09 루미리즈 홀딩 비.브이. 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 ｌｅｄ
JP5995579B2 (ja) * 2012-07-24 2016-09-21 シチズンホールディングス株式会社 半導体発光装置及びその製造方法
JP6055259B2 (ja) * 2012-10-03 2016-12-27 日東電工株式会社 封止シート被覆半導体素子、その製造方法、半導体装置およびその製造方法
JP6215525B2 (ja) * 2012-10-23 2017-10-18 スタンレー電気株式会社 半導体発光装置
US9054235B2 (en) 2013-01-22 2015-06-09 Micron Technology, Inc. Solid-state transducer devices with optically-transmissive carrier substrates and related systems, methods, and devices
KR102103881B1 (ko) * 2013-03-07 2020-04-23 포항공과대학교 산학협력단 Uv led칩을 이용하는 백색 발광소자
DE102013103600A1 (de) * 2013-04-10 2014-10-30 Osram Opto Semiconductors Gmbh Modul mit wenigstens zwei Halbleiterchips
CN103258940B (zh) * 2013-05-15 2017-10-24 中国科学院福建物质结构研究所 一种全固态白光发光二极管的封装方法
EP3118903B1 (en) * 2013-07-18 2023-06-21 Lumileds LLC Dicing a wafer of light emitting devices
CN104733594B (zh) * 2013-12-24 2017-09-19 展晶科技(深圳)有限公司 Led封装体
JP6331389B2 (ja) * 2013-12-27 2018-05-30 日亜化学工業株式会社 発光装置
DE102014100772B4 (de) * 2014-01-23 2022-11-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen und optoelektronisches Halbleiterbauelement
US9997676B2 (en) 2014-05-14 2018-06-12 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
US10439111B2 (en) 2014-05-14 2019-10-08 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
KR102145208B1 (ko) 2014-06-10 2020-08-19 삼성전자주식회사 발광소자 패키지 제조방법
TWI557952B (zh) 2014-06-12 2016-11-11 新世紀光電股份有限公司 發光元件
DE102014112883A1 (de) 2014-09-08 2016-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
DE102014117892A1 (de) * 2014-12-04 2016-06-09 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement sowie optoelektronisches Bauteil
CN105720164B (zh) * 2014-12-05 2019-10-11 江西省晶能半导体有限公司 一种白光led的制备方法
US9666564B2 (en) * 2014-12-16 2017-05-30 PlayNitride Inc. Light emitting device
US10269776B2 (en) 2014-12-16 2019-04-23 PlayNitride Inc. Light emitting device
JP6920995B2 (ja) * 2015-02-23 2021-08-18 ルミレッズ ホールディング ベーフェー 向上した色均一性を有する光源アッセンブリ
JP2015099940A (ja) * 2015-02-23 2015-05-28 日亜化学工業株式会社 発光装置
JP5996022B2 (ja) * 2015-03-13 2016-09-21 シチズン電子株式会社 発光装置
CN105990498A (zh) * 2015-03-18 2016-10-05 新世纪光电股份有限公司 芯片封装结构及其制造方法
KR102385941B1 (ko) * 2015-06-15 2022-04-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
JP2015164234A (ja) * 2015-06-17 2015-09-10 シチズン電子株式会社 Ｌｅｄ発光装置とその製造方法
CN108386732B (zh) * 2015-07-06 2019-09-10 扬州艾笛森光电有限公司 发光模块以及具有此发光模块的头灯
JP6327220B2 (ja) * 2015-08-31 2018-05-23 日亜化学工業株式会社 発光装置
CN106549092A (zh) 2015-09-18 2017-03-29 新世纪光电股份有限公司 发光装置及其制造方法
CN105655261A (zh) * 2016-03-11 2016-06-08 导装光电科技（深圳）有限公司 倒装白光芯片的制备工艺
CN106058020A (zh) * 2016-07-08 2016-10-26 深圳市兆驰节能照明股份有限公司 碗状结构芯片级封装发光装置及其制造方法
CN107968142A (zh) 2016-10-19 2018-04-27 新世纪光电股份有限公司 发光装置及其制造方法
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
US10317614B1 (en) 2017-03-14 2019-06-11 Automatad Assembly Corporation SSL lighting apparatus
CN106932951B (zh) * 2017-04-14 2018-11-23 深圳市华星光电技术有限公司 Led灯源及其制造方法、背光模组
CN109994458B (zh) 2017-11-05 2022-07-01 新世纪光电股份有限公司 发光装置
TWI778167B (zh) 2017-11-05 2022-09-21 新世紀光電股份有限公司 發光裝置及其製作方法
KR20190052600A (ko) * 2017-11-08 2019-05-16 주식회사 대성엔지니어링 Led 제조시스템 및 led 제조방법
US20200105990A1 (en) * 2018-09-27 2020-04-02 Wuhan China Star Optoelectronics Technology Co., Ltd. Surface light source, method for manufacturing the same, and display device using the surface light source
CN111106228A (zh) * 2018-10-26 2020-05-05 江西省晶能半导体有限公司 Led灯珠制备方法
EP3656254A1 (en) * 2018-11-26 2020-05-27 L&P Swiss Holding GmbH Pocket spring core
JP7323763B2 (ja) * 2018-12-27 2023-08-09 日亜化学工業株式会社 発光装置及び発光装置の製造方法
US10720551B1 (en) * 2019-01-03 2020-07-21 Ford Global Technologies, Llc Vehicle lamps
US10655823B1 (en) 2019-02-04 2020-05-19 Automated Assembly Corporation SSL lighting apparatus
JP7299537B2 (ja) * 2020-03-18 2023-06-28 日亜化学工業株式会社 発光装置
JP7119283B2 (ja) 2020-03-30 2022-08-17 日亜化学工業株式会社 発光装置の製造方法
JP7091598B2 (ja) 2020-05-20 2022-06-28 日亜化学工業株式会社 発光装置の製造方法
JP7580206B2 (ja) * 2020-05-25 2024-11-11 スタンレー電気株式会社 半導体発光装置
US10995931B1 (en) 2020-08-06 2021-05-04 Automated Assembly Corporation SSL lighting apparatus
JP7071680B2 (ja) * 2021-01-12 2022-05-19 日亜化学工業株式会社 発光装置
JP7455396B2 (ja) * 2021-07-20 2024-03-26 フェニックス電機株式会社 広帯域発光装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312600A (ja) * 1992-11-20 1994-11-08 Saki World:Kk 発光装飾器具
JP2000031548A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面実装型発光ダイオードおよびその製造方法
JP2000150969A (ja) * 1998-11-16 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
JP3627592B2 (ja) * 1999-10-08 2005-03-09 日亜化学工業株式会社 発光装置の製造方法
JP3802724B2 (ja) * 2000-01-31 2006-07-26 ローム株式会社 発光表示装置およびその製法
JP2001308392A (ja) * 2000-04-26 2001-11-02 Sony Corp 発光ダイオード及び画像表示装置
JP3685018B2 (ja) * 2000-05-09 2005-08-17 日亜化学工業株式会社 発光素子とその製造方法
JP2002280601A (ja) * 2000-06-08 2002-09-27 Showa Denko Kk 半導体発光素子
JP3991612B2 (ja) * 2001-04-09 2007-10-17 日亜化学工業株式会社 発光素子
JP2002313826A (ja) * 2001-04-17 2002-10-25 Shinko Electric Ind Co Ltd 半導体装置の樹脂封止装置及び半導体装置の樹脂封止方法
JP4020092B2 (ja) * 2004-03-16 2007-12-12 住友電気工業株式会社 半導体発光装置
JP4516337B2 (ja) * 2004-03-25 2010-08-04 シチズン電子株式会社 半導体発光装置
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
JP4698986B2 (ja) * 2004-08-23 2011-06-08 岡谷電機産業株式会社 発光ダイオード及びその製造方法
JP3936365B2 (ja) * 2004-09-14 2007-06-27 ソニーケミカル＆インフォメーションデバイス株式会社 機能素子実装モジュール及びその製造方法
JP2006314082A (ja) * 2005-04-04 2006-11-16 Nippon Sheet Glass Co Ltd 発光ユニット、該発光ユニットを用いた照明装置及び画像読取装置
JP2007019096A (ja) * 2005-07-05 2007-01-25 Toyoda Gosei Co Ltd 発光装置及びその製造方法
KR20070033801A (ko) * 2005-09-22 2007-03-27 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
GB2432967A (en) * 2005-11-30 2007-06-06 Unity Opto Technology Co Ltd White light LED with fluorescent powder containing wavelength converting plate
TW200725940A (en) * 2005-12-29 2007-07-01 Anteya Technology Corp LED package structure
US7795625B2 (en) * 2006-01-16 2010-09-14 Panasonic Corporation Semiconductor light-emitting device
RU2407110C2 (ru) * 2006-01-24 2010-12-20 Конинклейке Филипс Электроникс Н.В. Светоизлучающее устройство
US8062925B2 (en) * 2006-05-16 2011-11-22 Koninklijke Philips Electronics N.V. Process for preparing a semiconductor light-emitting device for mounting
CN101953230B (zh) * 2008-02-21 2013-03-27 日东电工株式会社 具有半透明陶瓷板的发光装置

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EP2332187A4 (en) 2013-05-29
US20110171762A1 (en) 2011-07-14
EP2332187B1 (en) 2016-08-10
TW201027797A (en) 2010-07-16
JP6010583B2 (ja) 2016-10-19
US20100051984A1 (en) 2010-03-04
KR20150038604A (ko) 2015-04-08
EP2332187A2 (en) 2011-06-15
WO2010027672A2 (en) 2010-03-11
JP2014212329A (ja) 2014-11-13
US8048695B2 (en) 2011-11-01
US7973327B2 (en) 2011-07-05
CN102132428B (zh) 2015-07-08
JP2012516026A (ja) 2012-07-12
JP2016167626A (ja) 2016-09-15
KR20110051222A (ko) 2011-05-17
WO2010027672A3 (en) 2010-05-20
CN102132428A (zh) 2011-07-20

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