JP5746919B2 - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
JP5746919B2
JP5746919B2 JP2011130536A JP2011130536A JP5746919B2 JP 5746919 B2 JP5746919 B2 JP 5746919B2 JP 2011130536 A JP2011130536 A JP 2011130536A JP 2011130536 A JP2011130536 A JP 2011130536A JP 5746919 B2 JP5746919 B2 JP 5746919B2
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Japan
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frame
adhesive
semiconductor package
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cap member
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JP2011130536A
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English (en)
Japanese (ja)
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JP2013004534A5 (https=
JP2013004534A (ja
Inventor
正之 布施
正之 布施
悟志 松澤
悟志 松澤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2011130536A priority Critical patent/JP5746919B2/ja
Priority to US13/486,220 priority patent/US8829632B2/en
Priority to CN201210194646.9A priority patent/CN102891152B/zh
Publication of JP2013004534A publication Critical patent/JP2013004534A/ja
Publication of JP2013004534A5 publication Critical patent/JP2013004534A5/ja
Application granted granted Critical
Publication of JP5746919B2 publication Critical patent/JP5746919B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Solid State Image Pick-Up Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2011130536A 2011-06-10 2011-06-10 半導体パッケージ Active JP5746919B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011130536A JP5746919B2 (ja) 2011-06-10 2011-06-10 半導体パッケージ
US13/486,220 US8829632B2 (en) 2011-06-10 2012-06-01 Semiconductor package
CN201210194646.9A CN102891152B (zh) 2011-06-10 2012-06-05 半导体封装体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011130536A JP5746919B2 (ja) 2011-06-10 2011-06-10 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2013004534A JP2013004534A (ja) 2013-01-07
JP2013004534A5 JP2013004534A5 (https=) 2014-06-26
JP5746919B2 true JP5746919B2 (ja) 2015-07-08

Family

ID=47292448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011130536A Active JP5746919B2 (ja) 2011-06-10 2011-06-10 半導体パッケージ

Country Status (3)

Country Link
US (1) US8829632B2 (https=)
JP (1) JP5746919B2 (https=)
CN (1) CN102891152B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960324B2 (ja) 1995-01-30 1999-10-06 俊輔 横須賀 敷地内排水端末処理装置

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130114352A (ko) * 2012-04-09 2013-10-18 삼성전자주식회사 반도체 패키지 및 그 제조 방법
EP3001466B1 (en) * 2013-05-23 2019-07-03 LG Innotek Co., Ltd. Light-emitting module
JP2015032653A (ja) 2013-08-01 2015-02-16 株式会社東芝 固体撮像装置
US9018753B2 (en) * 2013-08-02 2015-04-28 Stmicroelectronics Pte Ltd Electronic modules
JP6100195B2 (ja) * 2014-04-09 2017-03-22 富士フイルム株式会社 撮像装置
KR102221598B1 (ko) * 2014-06-16 2021-03-02 엘지이노텍 주식회사 발광 소자 패키지
JP6274058B2 (ja) * 2014-09-22 2018-02-07 株式会社デンソー 電子装置、及び電子装置を備えた電子構造体
CN105511206A (zh) * 2014-09-26 2016-04-20 宁波舜宇光电信息有限公司 一种影像模组及其感光芯片封装结构及方法
JP6477421B2 (ja) * 2015-10-29 2019-03-06 三菱電機株式会社 半導体装置
US10049896B2 (en) 2015-12-09 2018-08-14 International Business Machines Corporation Lid attach optimization to limit electronic package warpage
US9947603B2 (en) 2015-12-09 2018-04-17 International Business Machines Corporation Lid attach optimization to limit electronic package warpage
CN109510932B (zh) * 2016-02-18 2021-05-04 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
US9781324B2 (en) * 2016-02-18 2017-10-03 Ningbo Sunny Opotech Co., Ltd. Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US10477088B2 (en) 2016-04-21 2019-11-12 Ningbo Sunny Opotech Co., Ltd. Camera module and array camera module based on integral packaging technology
US9754983B1 (en) * 2016-07-14 2017-09-05 Semiconductor Components Industries, Llc Chip scale package and related methods
JP7048573B2 (ja) * 2016-08-01 2022-04-07 ▲寧▼波舜宇光▲電▼信息有限公司 カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法
KR20190029171A (ko) * 2017-09-12 2019-03-20 삼성전자주식회사 이미지 센서 모듈
JP6971826B2 (ja) * 2017-12-18 2021-11-24 新光電気工業株式会社 固体撮像装置及びその製造方法
JP7184599B2 (ja) * 2018-11-06 2022-12-06 ローム株式会社 半導体発光装置
US11515220B2 (en) * 2019-12-04 2022-11-29 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and methods of manufacturing the same
CN112054064A (zh) * 2020-09-07 2020-12-08 深圳市灵明光子科技有限公司 芯片级封装结构、光电装置及芯片级封装方法
CN214381086U (zh) * 2021-01-22 2021-10-08 南昌欧菲光电技术有限公司 感光芯片及封装结构、摄像模组和电子设备
CN115312549A (zh) * 2021-05-05 2022-11-08 胜丽国际股份有限公司 传感器封装结构
JP7381905B2 (ja) * 2021-06-15 2023-11-16 日亜化学工業株式会社 発光装置、及び、発光装置の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62262445A (ja) 1986-05-09 1987-11-14 Matsushita Electronics Corp 固体撮像装置
JPH0470752A (ja) 1990-07-12 1992-03-05 Asahi Chem Ind Co Ltd 新規な光重合性組成物
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2002368235A (ja) * 2001-03-21 2002-12-20 Canon Inc 半導体装置及びその製造方法
US6949808B2 (en) * 2001-11-30 2005-09-27 Matsushita Electric Industrial Co., Ltd. Solid-state imaging apparatus and manufacturing method thereof
JP3876792B2 (ja) 2002-08-07 2007-02-07 日本電信電話株式会社 ユーザプレゼンス情報によるメディア選択方法及びメディア選択システム及びメディア選択プログラム及びコンピュータ読み取り可能な記録媒体
JP2006245118A (ja) * 2005-03-01 2006-09-14 Konica Minolta Opto Inc 撮像装置及び撮像装置の製造方法
WO2006101270A1 (en) 2005-03-25 2006-09-28 Fujifilm Corporation Solid state imaging device and manufacturing method thereof
JP4673721B2 (ja) 2005-10-21 2011-04-20 富士通セミコンダクター株式会社 撮像装置及びその製造方法
KR101100790B1 (ko) * 2006-09-15 2012-01-02 후지쯔 세미컨덕터 가부시키가이샤 반도체 장치 및 그 제조 방법
JP5515223B2 (ja) * 2008-02-12 2014-06-11 ソニー株式会社 半導体装置
JP5165437B2 (ja) * 2008-03-27 2013-03-21 シャープ株式会社 固体撮像装置、および電子機器
JP2010141123A (ja) 2008-12-11 2010-06-24 Shinko Electric Ind Co Ltd 電子部品装置
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
JP5658466B2 (ja) * 2010-02-05 2015-01-28 キヤノン株式会社 固体撮像装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960324B2 (ja) 1995-01-30 1999-10-06 俊輔 横須賀 敷地内排水端末処理装置

Also Published As

Publication number Publication date
US8829632B2 (en) 2014-09-09
CN102891152A (zh) 2013-01-23
US20120313203A1 (en) 2012-12-13
CN102891152B (zh) 2016-12-21
JP2013004534A (ja) 2013-01-07

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