JP5745707B2 - 半導体デバイス検査装置及び半導体デバイス検査方法 - Google Patents

半導体デバイス検査装置及び半導体デバイス検査方法 Download PDF

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JP5745707B2
JP5745707B2 JP2014559748A JP2014559748A JP5745707B2 JP 5745707 B2 JP5745707 B2 JP 5745707B2 JP 2014559748 A JP2014559748 A JP 2014559748A JP 2014559748 A JP2014559748 A JP 2014559748A JP 5745707 B2 JP5745707 B2 JP 5745707B2
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frequency
semiconductor device
spectrum analyzer
light
phase
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JPWO2014119676A1 (ja
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共則 中村
共則 中村
充哲 西沢
充哲 西沢
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Hamamatsu Photonics KK
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
    • G01R23/16—Spectrum analysis; Fourier analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2653—Contactless testing using electron beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G01R31/307—Contactless testing using electron beams of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
JP2014559748A 2013-02-01 2014-01-30 半導体デバイス検査装置及び半導体デバイス検査方法 Active JP5745707B2 (ja)

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JP2014559748A JP5745707B2 (ja) 2013-02-01 2014-01-30 半導体デバイス検査装置及び半導体デバイス検査方法

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JP2013018683 2013-02-01
JP2013018683 2013-02-01
JP2014559748A JP5745707B2 (ja) 2013-02-01 2014-01-30 半導体デバイス検査装置及び半導体デバイス検査方法
PCT/JP2014/052146 WO2014119676A1 (ja) 2013-02-01 2014-01-30 半導体デバイス検査装置及び半導体デバイス検査方法

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JP2014559747A Active JP5744353B2 (ja) 2013-02-01 2014-01-30 半導体デバイス検査装置及び半導体デバイス検査方法
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JP2015094299A Active JP6389797B2 (ja) 2013-02-01 2015-05-01 半導体デバイス検査装置及び半導体デバイス検査方法

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US (4) US9618563B2 (enExample)
JP (3) JP5745707B2 (enExample)
KR (5) KR20170069292A (enExample)
SG (3) SG11201505836WA (enExample)
WO (2) WO2014119675A1 (enExample)

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Also Published As

Publication number Publication date
US9562944B2 (en) 2017-02-07
KR20160135845A (ko) 2016-11-28
KR101764560B1 (ko) 2017-08-02
SG10201604835TA (en) 2016-07-28
US20160334459A1 (en) 2016-11-17
US9618563B2 (en) 2017-04-11
US10191104B2 (en) 2019-01-29
KR20150103686A (ko) 2015-09-11
US20150377959A1 (en) 2015-12-31
US20150369755A1 (en) 2015-12-24
SG11201505836WA (en) 2015-09-29
JP5744353B2 (ja) 2015-07-08
KR101679527B1 (ko) 2016-11-24
JP2015145883A (ja) 2015-08-13
US20170176521A1 (en) 2017-06-22
KR20150112954A (ko) 2015-10-07
KR20170104637A (ko) 2017-09-15
KR101923846B1 (ko) 2018-11-29
KR20170069292A (ko) 2017-06-20
KR101777031B1 (ko) 2017-09-08
JP6389797B2 (ja) 2018-09-12
SG11201505833XA (en) 2015-08-28
WO2014119675A1 (ja) 2014-08-07
JPWO2014119675A1 (ja) 2017-01-26
WO2014119676A1 (ja) 2014-08-07
JPWO2014119676A1 (ja) 2017-01-26
US10101383B2 (en) 2018-10-16

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