JP5733633B2 - マス形成はんだと半導体チップとをホルダ上に配置する装置 - Google Patents
マス形成はんだと半導体チップとをホルダ上に配置する装置 Download PDFInfo
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- JP5733633B2 JP5733633B2 JP2012021293A JP2012021293A JP5733633B2 JP 5733633 B2 JP5733633 B2 JP 5733633B2 JP 2012021293 A JP2012021293 A JP 2012021293A JP 2012021293 A JP2012021293 A JP 2012021293A JP 5733633 B2 JP5733633 B2 JP 5733633B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
− マスをホルダ上に位置付けるステップと、
− マスをホルダに対して押し付けるように、第1の圧縮力をマス上に加えるステップであって、第1の力の強度は、マス形成はんだを平らにするように選択される所定の第1の値まで上がる、ステップと、
− コンポーネントを、平らにされたマス上に位置付けるステップと、
− コンポーネントを、平らにされたマスおよびホルダに対して押し付けるように、第2の圧縮力をコンポーネントに加えるステップであって、第2の力の強度は、第2の所定値まで上がり、第2の所定値は、第1の所定値より低い、ステップと、
を含むことを特徴とする。
− 第1の圧縮力および/または第2の圧縮力の強度が、強度の値から第1の所定値および/または第2の所定値まで、段階的増加で上がる。
− 加熱ステップ中、ホルダに対するコンポーネントの相対位置が、一定に維持される。
− 加熱ステップ中、このマスの位置にて、レーザビームが、ビームによるホルダの照射期間中、このマスを支えるホルダの第2の面と反対側のホルダの第1の面に向けられ、ホルダに対するコンポーネントの相対位置が、少なくとも照射の期間中、一定に維持される。
− 第1の所定値は、第1の力を加えるステップの後、マスの厚さの下限臨界値により決定される。
− 第2の所定値が臨界値未満であり、それを超えると、コンポーネントはダメージを与えられることになる。
− コンポーネントが半導体チップである。
− 第1の要素を第2の要素上に移動させる手段、
− 第1の要素を第2の要素に対して押し付けるための手段、
さらに、それは、以下を含むことを特徴とする:
− 第1の要素が第2の要素と接触し始めると、接触位置を検出する手段、
− 変位手段のカウンタウェイトを形成する手段、および
− 圧縮手段と、接触位置の検出によりカウンタウェイトを形成する手段とを制御する手段。
− 変位手段が、第1の要素を保持するための吸引タイプの保持手段を含み、
− 変位手段が、保持手段の吸引チューブを通る光ファイバを有する赤外線タイプの温度測定手段を含み、
− 検出手段が、容量性タイプの接触検出器と、圧力センサとから選択され、
− 装置が、マス形成はんだと、半導体チップとから選択される第1の要素を、ホルダを形成する第2の要素上に配置するように設計される。
Claims (5)
- マス形成はんだ(16)と半導体チップ(12)とを、マス形成はんだ(16)の上に半導体チップ(12)が配置されるように、ホルダ(14)上に配置する装置(18)であって、
マス形成はんだ(16)および半導体チップ(12)を保持するための保持手段(24)を有し、マス形成はんだ(16)をホルダ(14)上に、また、半導体チップ(12)をホルダ(14)上に配置されたマス形成はんだ(16)上に移動させる変位手段(20)、
保持手段(24)を介して、マス形成はんだ(16)をホルダ(14)に対して、また、半導体チップ(12)をマス形成はんだ(16)に対して押し付ける圧縮手段(36)を含み、
また、
マス形成はんだ(16)および半導体チップ(12)がそれぞれホルダ(14)およびマス形成はんだ(16)と接触し始めると接触位置を検出するための検出手段(42)、
マス形成はんだ(12)上に及ばされる保持手段(24)の重力および半導体チップ(12)上に及ぼされる保持手段(24)の重力を相殺するための保持手段(24)のカウンタウェイトを形成する手段、
マス形成はんだ(16)とホルダ(14)の接触位置を検出するとカウンタウェイトを形成する手段を活動化し、且つ、マス形成はんだ(16)上の圧縮力(F1)をゼロの初期値から第1の所定値へと上げるように圧縮手段(36)を制御し、また、半導体チップ(12)とマス形成はんだ(16)の接触位置を検出するとカウンタウェイトを形成する手段を活動化し、且つ、半導体チップ(12)上の圧縮力(F2)をゼロの初期値から第2の所定値へと上げるように圧縮手段(36)を制御する、カウンタウェイトを形成する手段と圧縮手段(36)とを制御するための制御手段(44)、
を含み、圧縮手段(36)が、半導体チップ(12)をホルダ(14)上に配置されたマス形成はんだ(16)上に第2の所定値の圧縮力(F2)にて配置した後、制御手段(44)による該圧縮手段(36)の非活動化後も、保持手段(24)とホルダ(14)の相対位置を一定に維持することができるように構成されている、ことを特徴とする、装置。 - 保持手段(24)が、吸引タイプである、請求項1に記載の装置(18)。
- 変位手段が、保持手段(24)の吸引チューブ(26)を通る光ファイバ(54)を有する赤外線タイプの温度測定手段(52)を含む、請求項2に記載の装置(18)。
- 検出手段(42)が、容量性タイプの接触検出器と、圧力検出器とから選択される、請求項1から3のいずれか一項に記載の装置(18)。
- 制御手段(44)が、半導体チップ(12)を配置するときの圧縮力(F2)の第2の所定値が、マス形成はんだ(16)を配置するときの圧縮力(F1)の第1の所定値未満となるように圧縮手段(36)を制御する、請求項1から4のいずれか一項に記載の装置(18)。
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Application Number | Priority Date | Filing Date | Title |
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FR0653731A FR2905883B1 (fr) | 2006-09-14 | 2006-09-14 | Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre |
FR0653731 | 2006-09-14 |
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JP2009527866A Division JP5399247B2 (ja) | 2006-09-14 | 2007-09-11 | コンポーネントをホルダにはんだ付けする方法 |
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JP2012138583A JP2012138583A (ja) | 2012-07-19 |
JP5733633B2 true JP5733633B2 (ja) | 2015-06-10 |
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JP2009527866A Expired - Fee Related JP5399247B2 (ja) | 2006-09-14 | 2007-09-11 | コンポーネントをホルダにはんだ付けする方法 |
JP2012021293A Expired - Fee Related JP5733633B2 (ja) | 2006-09-14 | 2012-02-02 | マス形成はんだと半導体チップとをホルダ上に配置する装置 |
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US (2) | US20100089879A1 (ja) |
EP (1) | EP2064017A2 (ja) |
JP (2) | JP5399247B2 (ja) |
FR (1) | FR2905883B1 (ja) |
WO (1) | WO2008031981A2 (ja) |
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DE10038330C2 (de) * | 2000-08-05 | 2002-07-11 | Bosch Gmbh Robert | Lötverfahren zur Befestigung elektrischer Bauelemente |
US6666368B2 (en) * | 2000-11-10 | 2003-12-23 | Unitive Electronics, Inc. | Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
AT411855B (de) * | 2001-06-26 | 2004-06-25 | Datacon Semiconductor Equip | Einrichtung zum positionieren |
US7296727B2 (en) * | 2001-06-27 | 2007-11-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting electronic components |
US6951125B2 (en) * | 2002-01-31 | 2005-10-04 | Stmicroelectronics, Inc. | System and method for aligning an integrated circuit die on an integrated circuit substrate |
JP3817207B2 (ja) | 2002-08-21 | 2006-09-06 | Tdk株式会社 | 実装処理装置及び該実装処理装置の制御装置 |
JP4038435B2 (ja) * | 2002-10-15 | 2008-01-23 | Juki株式会社 | ダイボンディング装置 |
JP2004303757A (ja) * | 2003-03-28 | 2004-10-28 | Japan Aviation Electronics Industry Ltd | ボンディング装置 |
JP2006324533A (ja) * | 2005-05-20 | 2006-11-30 | Nidec Tosok Corp | ボンディング荷重制御装置 |
-
2006
- 2006-09-14 FR FR0653731A patent/FR2905883B1/fr active Active
-
2007
- 2007-09-11 US US12/310,907 patent/US20100089879A1/en not_active Abandoned
- 2007-09-11 EP EP07823800A patent/EP2064017A2/fr not_active Withdrawn
- 2007-09-11 WO PCT/FR2007/051904 patent/WO2008031981A2/fr active Application Filing
- 2007-09-11 JP JP2009527866A patent/JP5399247B2/ja not_active Expired - Fee Related
-
2012
- 2012-02-02 JP JP2012021293A patent/JP5733633B2/ja not_active Expired - Fee Related
- 2012-11-08 US US13/672,400 patent/US8952288B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20130062326A1 (en) | 2013-03-14 |
US20100089879A1 (en) | 2010-04-15 |
WO2008031981A2 (fr) | 2008-03-20 |
EP2064017A2 (fr) | 2009-06-03 |
JP2012138583A (ja) | 2012-07-19 |
WO2008031981A3 (fr) | 2008-05-08 |
JP2010503982A (ja) | 2010-02-04 |
FR2905883B1 (fr) | 2008-12-05 |
JP5399247B2 (ja) | 2014-01-29 |
FR2905883A1 (fr) | 2008-03-21 |
US8952288B2 (en) | 2015-02-10 |
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