JP6507374B2 - 部品圧着装置及び部品圧着方法 - Google Patents
部品圧着装置及び部品圧着方法 Download PDFInfo
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- JP6507374B2 JP6507374B2 JP2016084871A JP2016084871A JP6507374B2 JP 6507374 B2 JP6507374 B2 JP 6507374B2 JP 2016084871 A JP2016084871 A JP 2016084871A JP 2016084871 A JP2016084871 A JP 2016084871A JP 6507374 B2 JP6507374 B2 JP 6507374B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
- H01R43/048—Crimping apparatus or processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
2 基板
2a 基板側端子部(端子部)
4 部品
12 基板保持テーブル
13 バックアップ部
15 載置テーブル(部品載置部)
17 押付けテーブル(部品押付け部)
18 圧着ヘッド
20a 動作制御部(制御手段)
20b 押付け時間設定部(押付け時間設定手段)
20c 押圧力設定部(押圧力設定手段)
Claims (16)
- 基板を保持する基板保持テーブルと、
前記基板保持テーブルにより保持された前記基板の端子部の下面側を支持するバックアップ部と、
前記端子部に圧着される部品が載置される部品載置部と、
前記部品載置部に載置された前記部品を加熱しながらピックアップする圧着ヘッドと、
前記部品が押し付けられる部品押付け部と、
前記圧着ヘッドが前記部品をピックアップした後、前記部品を前記部品押付け部に所定の押圧力で押し付けてから前記端子部に押圧するように圧着ヘッドの動作を制御する制御手段とを備え、
前記所定の押圧力は前記部品のサイズに応じて設定されることを特徴とする部品圧着装置。 - 前記部品を前記押付け部に押し付けた状態を継続させる押付け時間を前記部品のサイズに応じて設定する押付け時間設定手段を備え、前記制御手段は、前記圧着ヘッドが前記部品を前記押付け時間設定手段により設定された前記押付け時間の間継続して前記部品押付け部に押し付けるように前記圧着ヘッドの動作を制御することを特徴とする請求項1に記載の部品圧着装置。
- 前記圧着ヘッドが前記部品を前記基板に押圧する前記所定の押圧力を前記部品のサイズに応じて設定する押圧力設定手段を備え、前記制御手段は、前記圧着ヘッドが前記押圧力設定手段により設定された前記所定の押圧力で前記部品を前記基板に押圧するように前記圧着ヘッドの動作を制御することを特徴とする請求項1又は2に記載の部品圧着装置。
- 前記部品押付け部は前記部品載置部と前記バックアップ部の間に設けられていることを特徴とする請求項1〜3のいずれかに記載の部品圧着装置。
- 前記部品はフィルム状の部品から成ることを特徴とする請求項1〜4のいずれかに記載の部品圧着装置。
- 前記所定の押圧力は前記部品のサイズが大きいほど大きい値に設定される請求項1〜5のいずれかに記載の部品圧着装置。
- 前記押付け時間は、前記圧着ヘッドによって加熱された前記部品が伸びきる時間を基準にして設定され、前記部品のサイズが大きいときほど長い時間が設定される請求項2に記載の部品圧着装置。
- 前記所定の押圧力は、前記部品が前記基板に押圧されたときに前記部品が前記基板にしっかり圧着される押付け力を基準にして設定され、前記部品のサイズが大きいときほど大きい値が設定される請求項1に記載の部品圧着装置。
- 基板保持テーブルにより基板を保持する基板保持工程と、
前記基板保持テーブルにより保持した前記基板の端子部の下面側をバックアップ部により支持するバックアップ工程と、
部品載置部に載置された部品を圧着ヘッドにより加熱しながらピックアップするピックアップ工程と、
前記部品をピックアップした後、前記圧着ヘッドにより前記部品を部品押付け部に所定の押圧力で押し付ける部品押付け工程と、
前記部品押付け部に前記所定の押圧力で押し付けた前記部品を前記圧着ヘッドにより前記端子部に押圧する押圧工程とを含み、
前記所定の押圧力は前記部品のサイズに応じて設定されることを特徴とする部品圧着方法。 - 前記部品のサイズに応じて前記部品を前記部品押付け部に押し付けた状態を継続させる押付け時間を設定する押付け時間設定工程とを含み、前記部品押付け工程において、前記部品を前記押付け時間設定工程で設定した前記押付け時間の間継続して前記部品押付け部に押し付けることを特徴とする請求項9に記載の部品圧着方法。
- 前記部品を前記基板に押圧する前記所定の押圧力を前記部品のサイズに応じて設定する押圧力設定工程を含み、前記押圧工程において、前記押圧力設定工程で設定した前記所定の押圧力で前記部品を前記圧着ヘッドにより前記基板に押圧することを特徴とする請求項9又は10に記載の部品圧着方法。
- 前記部品押付け部は前記部品載置部と前記バックアップ部の間に設けられていることを特徴とする請求項9〜11のいずれかに記載の部品圧着方法。
- 前記部品はフィルム状の部品から成ることを特徴とする請求項9〜12のいずれかに記載の部品圧着方法。
- 前記所定の押圧力は前記部品のサイズが大きいほど大きい値に設定される請求項9〜13のいずれかに記載の部品圧着方法。
- 前記押付け時間は、前記圧着ヘッドによって加熱された前記部品が伸びきる時間を基準にして設定され、前記部品のサイズが大きいときほど長い時間が設定される請求項10に記載の部品圧着方法。
- 前記所定の押圧力は、前記部品が前記基板に押圧されたときに前記部品が前記基板にしっかり圧着される押付け力を基準にして設定され、前記部品のサイズが大きいときほど大きい値が設定される請求項9に記載の部品圧着方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2016084871A JP6507374B2 (ja) | 2016-04-21 | 2016-04-21 | 部品圧着装置及び部品圧着方法 |
US15/480,435 US10383270B2 (en) | 2016-04-21 | 2017-04-06 | Component crimping device and component crimping method |
CN201710241885.8A CN107305298B (zh) | 2016-04-21 | 2017-04-13 | 部件压接装置以及部件压接方法 |
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JP2016084871A JP6507374B2 (ja) | 2016-04-21 | 2016-04-21 | 部品圧着装置及び部品圧着方法 |
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JP2017195287A JP2017195287A (ja) | 2017-10-26 |
JP6507374B2 true JP6507374B2 (ja) | 2019-05-08 |
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US (1) | US10383270B2 (ja) |
JP (1) | JP6507374B2 (ja) |
CN (1) | CN107305298B (ja) |
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CN108429106B (zh) * | 2018-06-27 | 2019-07-16 | 国网冀北电力有限公司技能培训中心 | 液压式导线压接装置 |
CN112563845B (zh) * | 2020-12-14 | 2022-09-27 | 湖南凯通电子有限公司 | 一种tph片的端子插入设备 |
CN113900291B (zh) * | 2021-08-17 | 2022-08-16 | 江苏特丽亮镀膜科技有限公司 | 一种用于acf胶膜联结结构的制作设备及其制作工艺 |
CN114824853B (zh) * | 2022-06-27 | 2022-10-28 | 深圳众城卓越科技有限公司 | 用于pcb功率板导大电流接线的压接组件及其压接方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264256A (ja) * | 1995-03-27 | 1996-10-11 | Yazaki Corp | 端子と電線の接続方法および接続用電極 |
JP3293512B2 (ja) * | 1997-03-10 | 2002-06-17 | 松下電器産業株式会社 | コネクタの熱圧着方法 |
JP2000275598A (ja) * | 1999-03-24 | 2000-10-06 | Samukon:Kk | 液晶セル熱圧着装置 |
TW559963B (en) * | 2001-06-08 | 2003-11-01 | Shibaura Mechatronics Corp | Pressuring apparatus of electronic device and its method |
JP3943416B2 (ja) * | 2002-03-07 | 2007-07-11 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP3997838B2 (ja) * | 2002-05-28 | 2007-10-24 | 株式会社日立ハイテクノロジーズ | ドライバic圧着装置および圧着方法 |
JP2005005304A (ja) * | 2003-06-09 | 2005-01-06 | Seiko Epson Corp | 半導体製造装置および半導体装置の製造方法 |
JP3833669B2 (ja) * | 2004-04-08 | 2006-10-18 | シャープ株式会社 | 半導体装置および半導体装置の製造方法 |
TW200638812A (en) | 2004-11-18 | 2006-11-01 | Matsushita Electric Ind Co Ltd | Wiring board, method for manufacturing same and semiconductor device |
JP4539454B2 (ja) * | 2005-06-20 | 2010-09-08 | パナソニック株式会社 | 電子部品の熱圧着ツールおよび電子部品の実装装置ならびに実装方法 |
TWI440105B (zh) * | 2006-05-09 | 2014-06-01 | Panasonic Corp | 電子零件安裝頭、電子零件安裝裝置及電子零件安裝方法 |
JP4779945B2 (ja) * | 2006-11-20 | 2011-09-28 | パナソニック株式会社 | シート送り装置及び方法 |
CN101227802A (zh) * | 2007-01-19 | 2008-07-23 | 纳瑞精密设备有限公司 | 使用紫外线的图案电极接合结构以及接合图案电极的方法 |
CN101435922A (zh) * | 2007-11-13 | 2009-05-20 | 上海广电Nec液晶显示器有限公司 | 液晶显示器电路基板结构及使用其制造液晶显示器的方法 |
KR20100092477A (ko) * | 2007-12-04 | 2010-08-20 | 파나소닉 주식회사 | 부품 압착 장치 및 방법 |
CN201478514U (zh) * | 2009-07-09 | 2010-05-19 | 英业达股份有限公司 | 电连接器结构 |
JP5297980B2 (ja) * | 2009-11-04 | 2013-09-25 | パナソニック株式会社 | 部品圧着装置、および、部品圧着方法 |
JP2011171317A (ja) * | 2010-02-16 | 2011-09-01 | Panasonic Corp | フレキシブル配線基板の実装方法 |
JP5852244B2 (ja) * | 2012-07-30 | 2016-02-03 | 芝浦メカトロニクス株式会社 | 基板貼合装置及び基板貼合方法 |
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- 2017-04-13 CN CN201710241885.8A patent/CN107305298B/zh active Active
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Publication number | Publication date |
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CN107305298B (zh) | 2021-06-15 |
JP2017195287A (ja) | 2017-10-26 |
US10383270B2 (en) | 2019-08-13 |
CN107305298A (zh) | 2017-10-31 |
US20170311492A1 (en) | 2017-10-26 |
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