WO2008031981A3 - Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre - Google Patents

Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre Download PDF

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Publication number
WO2008031981A3
WO2008031981A3 PCT/FR2007/051904 FR2007051904W WO2008031981A3 WO 2008031981 A3 WO2008031981 A3 WO 2008031981A3 FR 2007051904 W FR2007051904 W FR 2007051904W WO 2008031981 A3 WO2008031981 A3 WO 2008031981A3
Authority
WO
WIPO (PCT)
Prior art keywords
mass
support
arranging
bonding
elements
Prior art date
Application number
PCT/FR2007/051904
Other languages
English (en)
Other versions
WO2008031981A2 (fr
Inventor
Jean-Michel Morelle
Laurent Vivet
Mathieu Medina
Sandra Dimelli
Original Assignee
Valeo Electronique Sys Liaison
Jean-Michel Morelle
Laurent Vivet
Mathieu Medina
Sandra Dimelli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique Sys Liaison, Jean-Michel Morelle, Laurent Vivet, Mathieu Medina, Sandra Dimelli filed Critical Valeo Electronique Sys Liaison
Priority to US12/310,907 priority Critical patent/US20100089879A1/en
Priority to EP07823800A priority patent/EP2064017A2/fr
Priority to JP2009527866A priority patent/JP5399247B2/ja
Publication of WO2008031981A2 publication Critical patent/WO2008031981A2/fr
Publication of WO2008031981A3 publication Critical patent/WO2008031981A3/fr
Priority to US13/672,400 priority patent/US8952288B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

Ce procédé comprend une étape de chauffage d'une masse (16) formant brasure. Conformément à l'invention, avant l'étape de chauffage, il comprend des étapes d'agencement sur le support (14) de la masse (16) et de l'organe (12). En particulier, il comprend une étape de mise en place de la masse (16) sur le support (14) et une étape d'application sur la masse (16) d'une première force (F1) de compression de la masse (16) contre le support (14), l'intensité de la première force (F1) augmentant jusqu'à une première valeur prédéfinie choisie de manière à aplanir la masse (16). Ensuite, le procédé comprend une étape de mise en place de l'organe (12) sur la masse aplanie (16) et une étape d'application sur l'organe (12) d'une deuxième force (F2) de compression de l'organe (12) contre la masse aplanie (16) et le support (14), l'intensité de la deuxième force (F2) augmentant jusqu'à une deuxième valeur prédéfinie, la deuxième valeur prédéfinie étant inférieure à la première valeur prédéfinie.
PCT/FR2007/051904 2006-09-14 2007-09-11 Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre WO2008031981A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/310,907 US20100089879A1 (en) 2006-09-14 2007-09-11 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
EP07823800A EP2064017A2 (fr) 2006-09-14 2007-09-11 Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
JP2009527866A JP5399247B2 (ja) 2006-09-14 2007-09-11 コンポーネントをホルダにはんだ付けする方法
US13/672,400 US8952288B2 (en) 2006-09-14 2012-11-08 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0653731A FR2905883B1 (fr) 2006-09-14 2006-09-14 Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
FR0653731 2006-09-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/310,907 A-371-Of-International US20100089879A1 (en) 2006-09-14 2007-09-11 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
US13/672,400 Continuation US8952288B2 (en) 2006-09-14 2012-11-08 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other

Publications (2)

Publication Number Publication Date
WO2008031981A2 WO2008031981A2 (fr) 2008-03-20
WO2008031981A3 true WO2008031981A3 (fr) 2008-05-08

Family

ID=37909780

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/051904 WO2008031981A2 (fr) 2006-09-14 2007-09-11 Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre

Country Status (5)

Country Link
US (2) US20100089879A1 (fr)
EP (1) EP2064017A2 (fr)
JP (2) JP5399247B2 (fr)
FR (1) FR2905883B1 (fr)
WO (1) WO2008031981A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2937216B1 (fr) 2008-10-10 2010-12-31 Valeo Etudes Electroniques Procede et dispositif d'assemblage d'une pastille sur un substrat par apport d'une masse formant brasure.
CH708932B1 (en) * 2013-12-09 2017-04-13 Besi Switzerland Ag Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
DE102014110915A1 (de) * 2014-07-31 2016-02-04 Thyssenkrupp Ag Niederhalter, Schweißvorrichtung und Verfahren zum Überprüfen des Vorhandenseins und/oder der Qualität einer Fügeverbindung
US10104772B2 (en) 2014-08-19 2018-10-16 International Business Machines Incorporated Metallized particle interconnect with solder components
FR3036301B1 (fr) 2015-05-21 2017-10-20 Valeo Equip Electr Moteur Procede de soudure avec apport de matiere et module electronique de puissance realise par ce procede
US10939600B2 (en) * 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
CN111511122B (zh) * 2020-05-19 2022-11-29 中国电子科技集团公司第二十九研究所 一种底部无引脚封装器件的装夹焊膏涂覆装置及方法
DE102022116028A1 (de) 2022-06-28 2023-12-28 Pac Tech - Packaging Technologies Gmbh Vorrichtung und Verfahren zur Herstellung einer Kontaktverbindung

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US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5673844A (en) * 1995-12-29 1997-10-07 Gte Laboratories Incorporated Gas pressure adjustable diebonding apparatus and method
US6471110B1 (en) * 1999-09-10 2002-10-29 Esec Trading Sa Method and apparatus for mounting semiconductor chips
WO2003001572A2 (fr) * 2001-06-26 2003-01-03 Datacon Semiconductor Equipment Gmbh Systeme de positionnement

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5673844A (en) * 1995-12-29 1997-10-07 Gte Laboratories Incorporated Gas pressure adjustable diebonding apparatus and method
US6471110B1 (en) * 1999-09-10 2002-10-29 Esec Trading Sa Method and apparatus for mounting semiconductor chips
WO2003001572A2 (fr) * 2001-06-26 2003-01-03 Datacon Semiconductor Equipment Gmbh Systeme de positionnement

Also Published As

Publication number Publication date
US20130062326A1 (en) 2013-03-14
JP5733633B2 (ja) 2015-06-10
US20100089879A1 (en) 2010-04-15
WO2008031981A2 (fr) 2008-03-20
EP2064017A2 (fr) 2009-06-03
JP2012138583A (ja) 2012-07-19
JP2010503982A (ja) 2010-02-04
FR2905883B1 (fr) 2008-12-05
JP5399247B2 (ja) 2014-01-29
FR2905883A1 (fr) 2008-03-21
US8952288B2 (en) 2015-02-10

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