JP5399247B2 - コンポーネントをホルダにはんだ付けする方法 - Google Patents

コンポーネントをホルダにはんだ付けする方法 Download PDF

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Publication number
JP5399247B2
JP5399247B2 JP2009527866A JP2009527866A JP5399247B2 JP 5399247 B2 JP5399247 B2 JP 5399247B2 JP 2009527866 A JP2009527866 A JP 2009527866A JP 2009527866 A JP2009527866 A JP 2009527866A JP 5399247 B2 JP5399247 B2 JP 5399247B2
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holder
component
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Japanese (ja)
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JP2010503982A (ja
Inventor
モレル，ジヤン−ミシエル
ビベ，ロラン
メデイナ，マテユー
デイメリ，サンドラ
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バレオ エレクトロニク エ システメ デ リアイソン
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Ceramic Products (AREA)
JP2009527866A 2006-09-14 2007-09-11 コンポーネントをホルダにはんだ付けする方法 Expired - Fee Related JP5399247B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0653731 2006-09-14
FR0653731A FR2905883B1 (fr) 2006-09-14 2006-09-14 Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
PCT/FR2007/051904 WO2008031981A2 (fr) 2006-09-14 2007-09-11 Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012021293A Division JP5733633B2 (ja) 2006-09-14 2012-02-02 マス形成はんだと半導体チップとをホルダ上に配置する装置

Publications (2)

Publication Number Publication Date
JP2010503982A JP2010503982A (ja) 2010-02-04
JP5399247B2 true JP5399247B2 (ja) 2014-01-29

Family

ID=37909780

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009527866A Expired - Fee Related JP5399247B2 (ja) 2006-09-14 2007-09-11 コンポーネントをホルダにはんだ付けする方法
JP2012021293A Expired - Fee Related JP5733633B2 (ja) 2006-09-14 2012-02-02 マス形成はんだと半導体チップとをホルダ上に配置する装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012021293A Expired - Fee Related JP5733633B2 (ja) 2006-09-14 2012-02-02 マス形成はんだと半導体チップとをホルダ上に配置する装置

Country Status (5)

Country Link
US (2) US20100089879A1 (fr)
EP (1) EP2064017A2 (fr)
JP (2) JP5399247B2 (fr)
FR (1) FR2905883B1 (fr)
WO (1) WO2008031981A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2937216B1 (fr) 2008-10-10 2010-12-31 Valeo Etudes Electroniques Procede et dispositif d'assemblage d'une pastille sur un substrat par apport d'une masse formant brasure.
CH708932B1 (en) * 2013-12-09 2017-04-13 Besi Switzerland Ag Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
DE102014110915A1 (de) * 2014-07-31 2016-02-04 Thyssenkrupp Ag Niederhalter, Schweißvorrichtung und Verfahren zum Überprüfen des Vorhandenseins und/oder der Qualität einer Fügeverbindung
US10104772B2 (en) 2014-08-19 2018-10-16 International Business Machines Incorporated Metallized particle interconnect with solder components
FR3036301B1 (fr) 2015-05-21 2017-10-20 Valeo Equip Electr Moteur Procede de soudure avec apport de matiere et module electronique de puissance realise par ce procede
US10939600B2 (en) * 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
CN111511122B (zh) * 2020-05-19 2022-11-29 中国电子科技集团公司第二十九研究所 一种底部无引脚封装器件的装夹焊膏涂覆装置及方法
DE102022116028A1 (de) 2022-06-28 2023-12-28 Pac Tech - Packaging Technologies Gmbh Vorrichtung und Verfahren zur Herstellung einer Kontaktverbindung

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JPS6420630A (en) * 1987-07-15 1989-01-24 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS6420630U (fr) 1987-07-28 1989-02-01
JPH02134831A (ja) * 1988-11-16 1990-05-23 Fujikura Ltd ダイボンド法
JPH055388U (ja) * 1991-07-15 1993-01-26 山形カシオ株式会社 部品搭載装置
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5673844A (en) * 1995-12-29 1997-10-07 Gte Laboratories Incorporated Gas pressure adjustable diebonding apparatus and method
US5615012A (en) 1996-03-04 1997-03-25 Motorola, Inc. Method for detecting obstructed nozzles
KR100445275B1 (ko) 1996-05-27 2004-10-14 스미토모덴키고교가부시키가이샤 공구팁및그공구팁을구비한접합공구및그접합공구의제어방법
JP3520702B2 (ja) * 1996-12-24 2004-04-19 澁谷工業株式会社 光照射用ボンディングヘッド
KR100426839B1 (ko) * 1997-07-23 2004-04-13 인피니언 테크놀로지스 아게 칩-기판 접속부를 제조하는 장치 및 방법
US6131795A (en) * 1997-11-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Thermal compression bonding method of electronic part with solder bump
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DE10038330C2 (de) 2000-08-05 2002-07-11 Bosch Gmbh Robert Lötverfahren zur Befestigung elektrischer Bauelemente
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JP3817207B2 (ja) 2002-08-21 2006-09-06 Ｔｄｋ株式会社 実装処理装置及び該実装処理装置の制御装置
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JP2006324533A (ja) * 2005-05-20 2006-11-30 Nidec Tosok Corp ボンディング荷重制御装置

Also Published As

Publication number Publication date
JP5733633B2 (ja) 2015-06-10
JP2010503982A (ja) 2010-02-04
JP2012138583A (ja) 2012-07-19
WO2008031981A3 (fr) 2008-05-08
FR2905883B1 (fr) 2008-12-05
US8952288B2 (en) 2015-02-10
US20100089879A1 (en) 2010-04-15
EP2064017A2 (fr) 2009-06-03
WO2008031981A2 (fr) 2008-03-20
US20130062326A1 (en) 2013-03-14
FR2905883A1 (fr) 2008-03-21

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