JP5731080B2 - 粘着テープおよびウエハ加工用テープ - Google Patents

粘着テープおよびウエハ加工用テープ Download PDF

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Publication number
JP5731080B2
JP5731080B2 JP2014546000A JP2014546000A JP5731080B2 JP 5731080 B2 JP5731080 B2 JP 5731080B2 JP 2014546000 A JP2014546000 A JP 2014546000A JP 2014546000 A JP2014546000 A JP 2014546000A JP 5731080 B2 JP5731080 B2 JP 5731080B2
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JP
Japan
Prior art keywords
wafer
adhesive layer
tape
wafer processing
processing tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014546000A
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English (en)
Japanese (ja)
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JPWO2014157471A1 (ja
Inventor
佐野　透
透 佐野
二朗 杉山
二朗 杉山
朗 矢吹
朗 矢吹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2014546000A priority Critical patent/JP5731080B2/ja
Application granted granted Critical
Publication of JP5731080B2 publication Critical patent/JP5731080B2/ja
Publication of JPWO2014157471A1 publication Critical patent/JPWO2014157471A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2014546000A 2013-03-28 2014-03-27 粘着テープおよびウエハ加工用テープ Active JP5731080B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014546000A JP5731080B2 (ja) 2013-03-28 2014-03-27 粘着テープおよびウエハ加工用テープ

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013068299 2013-03-28
JP2013068299 2013-03-28
PCT/JP2014/058772 WO2014157471A1 (ja) 2013-03-28 2014-03-27 粘着テープおよびウエハ加工用テープ
JP2014546000A JP5731080B2 (ja) 2013-03-28 2014-03-27 粘着テープおよびウエハ加工用テープ

Publications (2)

Publication Number Publication Date
JP5731080B2 true JP5731080B2 (ja) 2015-06-10
JPWO2014157471A1 JPWO2014157471A1 (ja) 2017-02-16

Family

ID=51624433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014546000A Active JP5731080B2 (ja) 2013-03-28 2014-03-27 粘着テープおよびウエハ加工用テープ

Country Status (5)

Country Link
JP (1) JP5731080B2 (ko)
KR (1) KR101616680B1 (ko)
CN (1) CN105143380B (ko)
TW (1) TWI510591B (ko)
WO (1) WO2014157471A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
CN107408501B (zh) * 2015-03-24 2018-08-24 古河电气工业株式会社 半导体加工用带
JP6456766B2 (ja) * 2015-05-08 2019-01-23 株式会社ディスコ ウエーハの加工方法
JP6422462B2 (ja) * 2016-03-31 2018-11-14 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6783552B2 (ja) * 2016-05-20 2020-11-11 デクセリアルズ株式会社 接着テープ構造体
TWI638870B (zh) * 2016-10-06 2018-10-21 奇美實業股份有限公司 用以形成作為皮秒雷射加工之保護層的溶液與其製造方法
WO2018101090A1 (ja) * 2016-11-29 2018-06-07 リンテック株式会社 両面粘着シートおよび半導体装置の製造方法
JP6814672B2 (ja) * 2017-03-23 2021-01-20 株式会社ディスコ 加工方法
WO2019135430A1 (ko) * 2018-01-08 2019-07-11 (주)엠티아이 웨이퍼 가공용 보호 코팅제 조성물 및 이를 포함하는 보호 코팅제
KR102482193B1 (ko) 2018-01-30 2022-12-27 삼성전기주식회사 듀얼모드 동작을 위한 제어 버퍼 회로 및 고주파 스위치
KR20200127171A (ko) * 2018-03-07 2020-11-10 린텍 가부시키가이샤 익스팬드 방법, 반도체 장치의 제조 방법, 및 점착 시트
JP7092526B2 (ja) * 2018-03-14 2022-06-28 マクセル株式会社 バックグラインド用粘着テープ
JP7130323B2 (ja) 2018-05-14 2022-09-05 株式会社ディスコ ウェーハの加工方法
JP7281873B2 (ja) 2018-05-14 2023-05-26 株式会社ディスコ ウェーハの加工方法
JP7060548B2 (ja) * 2019-05-29 2022-04-26 古河電気工業株式会社 ガラス加工用テープ
JP7269095B2 (ja) * 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
CN114210597B (zh) * 2022-02-22 2022-04-26 深圳市正和兴电子有限公司 一种半导体器件的导电胶推荐方法、系统和可读存储介质

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156027A (ja) * 1999-11-30 2001-06-08 Lintec Corp 半導体装置の製造方法
JP2001200215A (ja) * 2000-01-21 2001-07-24 Nitto Denko Corp 半導体ウエハ加工用粘着シート
JP2003034780A (ja) * 2001-04-23 2003-02-07 Furukawa Electric Co Ltd:The レーザーダイシング用粘着テープ
JP2005053998A (ja) * 2003-08-08 2005-03-03 Nitto Denko Corp 再剥離型粘着シート
WO2006104151A1 (ja) * 2005-03-29 2006-10-05 The Furukawa Electric Co., Ltd. ウエハダイシング用粘着テープおよびそれを用いたチップの製造方法
JP2007073930A (ja) * 2005-08-11 2007-03-22 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2007305679A (ja) * 2006-05-09 2007-11-22 Furukawa Electric Co Ltd:The レーザーダイシング用ダイシングダイボンドシート
JP2008290102A (ja) * 2007-05-23 2008-12-04 Sharp Corp レーザー加工方法、および、それを用いた半導体装置の製造方法
JP2009231700A (ja) * 2008-03-25 2009-10-08 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2011176331A (ja) * 2008-08-04 2011-09-08 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2012028598A (ja) * 2010-07-26 2012-02-09 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
MY138566A (en) * 2004-03-15 2009-06-30 Hitachi Chemical Co Ltd Dicing/die bonding sheet
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4776189B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 ウエハ加工用テープ
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
CN102373017A (zh) * 2010-08-19 2012-03-14 古河电气工业株式会社 晶片加工用胶带

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156027A (ja) * 1999-11-30 2001-06-08 Lintec Corp 半導体装置の製造方法
JP2001200215A (ja) * 2000-01-21 2001-07-24 Nitto Denko Corp 半導体ウエハ加工用粘着シート
JP2003034780A (ja) * 2001-04-23 2003-02-07 Furukawa Electric Co Ltd:The レーザーダイシング用粘着テープ
JP2005053998A (ja) * 2003-08-08 2005-03-03 Nitto Denko Corp 再剥離型粘着シート
WO2006104151A1 (ja) * 2005-03-29 2006-10-05 The Furukawa Electric Co., Ltd. ウエハダイシング用粘着テープおよびそれを用いたチップの製造方法
JP2007073930A (ja) * 2005-08-11 2007-03-22 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2007305679A (ja) * 2006-05-09 2007-11-22 Furukawa Electric Co Ltd:The レーザーダイシング用ダイシングダイボンドシート
JP2008290102A (ja) * 2007-05-23 2008-12-04 Sharp Corp レーザー加工方法、および、それを用いた半導体装置の製造方法
JP2009231700A (ja) * 2008-03-25 2009-10-08 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2011176331A (ja) * 2008-08-04 2011-09-08 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2012028598A (ja) * 2010-07-26 2012-02-09 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Also Published As

Publication number Publication date
CN105143380B (zh) 2019-05-17
JPWO2014157471A1 (ja) 2017-02-16
TW201446928A (zh) 2014-12-16
CN105143380A (zh) 2015-12-09
KR20150110823A (ko) 2015-10-02
TWI510591B (zh) 2015-12-01
WO2014157471A1 (ja) 2014-10-02
KR101616680B1 (ko) 2016-04-28

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