CN105143380B - 粘合带及晶片加工用胶带 - Google Patents

粘合带及晶片加工用胶带 Download PDF

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Publication number
CN105143380B
CN105143380B CN201480016641.4A CN201480016641A CN105143380B CN 105143380 B CN105143380 B CN 105143380B CN 201480016641 A CN201480016641 A CN 201480016641A CN 105143380 B CN105143380 B CN 105143380B
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CN
China
Prior art keywords
chip
wafer
adhesive tape
adhesive
wafer processing
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CN201480016641.4A
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English (en)
Chinese (zh)
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CN105143380A (zh
Inventor
佐野透
杉山二朗
矢吹朗
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication of CN105143380A publication Critical patent/CN105143380A/zh
Application granted granted Critical
Publication of CN105143380B publication Critical patent/CN105143380B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
CN201480016641.4A 2013-03-28 2014-03-27 粘合带及晶片加工用胶带 Active CN105143380B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013068299 2013-03-28
JP2013-068299 2013-03-28
PCT/JP2014/058772 WO2014157471A1 (ja) 2013-03-28 2014-03-27 粘着テープおよびウエハ加工用テープ

Publications (2)

Publication Number Publication Date
CN105143380A CN105143380A (zh) 2015-12-09
CN105143380B true CN105143380B (zh) 2019-05-17

Family

ID=51624433

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480016641.4A Active CN105143380B (zh) 2013-03-28 2014-03-27 粘合带及晶片加工用胶带

Country Status (5)

Country Link
JP (1) JP5731080B2 (ko)
KR (1) KR101616680B1 (ko)
CN (1) CN105143380B (ko)
TW (1) TWI510591B (ko)
WO (1) WO2014157471A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
WO2016152919A1 (ja) * 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
JP6456766B2 (ja) * 2015-05-08 2019-01-23 株式会社ディスコ ウエーハの加工方法
JP6422462B2 (ja) * 2016-03-31 2018-11-14 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6783552B2 (ja) * 2016-05-20 2020-11-11 デクセリアルズ株式会社 接着テープ構造体
TWI638870B (zh) * 2016-10-06 2018-10-21 奇美實業股份有限公司 用以形成作為皮秒雷射加工之保護層的溶液與其製造方法
WO2018101090A1 (ja) * 2016-11-29 2018-06-07 リンテック株式会社 両面粘着シートおよび半導体装置の製造方法
JP6814672B2 (ja) * 2017-03-23 2021-01-20 株式会社ディスコ 加工方法
WO2019135430A1 (ko) * 2018-01-08 2019-07-11 (주)엠티아이 웨이퍼 가공용 보호 코팅제 조성물 및 이를 포함하는 보호 코팅제
KR102482193B1 (ko) 2018-01-30 2022-12-27 삼성전기주식회사 듀얼모드 동작을 위한 제어 버퍼 회로 및 고주파 스위치
JP7092526B2 (ja) * 2018-03-14 2022-06-28 マクセル株式会社 バックグラインド用粘着テープ
JP7281873B2 (ja) 2018-05-14 2023-05-26 株式会社ディスコ ウェーハの加工方法
JP7130323B2 (ja) 2018-05-14 2022-09-05 株式会社ディスコ ウェーハの加工方法
JP7269095B2 (ja) * 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
JP7060548B2 (ja) * 2019-05-29 2022-04-26 古河電気工業株式会社 ガラス加工用テープ
CN114210597B (zh) * 2022-02-22 2022-04-26 深圳市正和兴电子有限公司 一种半导体器件的导电胶推荐方法、系统和可读存储介质

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1806326A (zh) * 2004-03-15 2006-07-19 日立化成工业株式会社 切割用芯片粘贴薄膜
CN1906737A (zh) * 2004-08-03 2007-01-31 古河电气工业株式会社 晶片加工用带
JP2007073930A (ja) * 2005-08-11 2007-03-22 Furukawa Electric Co Ltd:The ウエハ加工用テープ
CN1993809A (zh) * 2004-08-03 2007-07-04 古河电气工业株式会社 半导体器件制造方法及晶片加工带
JP2007305679A (ja) * 2006-05-09 2007-11-22 Furukawa Electric Co Ltd:The レーザーダイシング用ダイシングダイボンドシート

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4409014B2 (ja) * 1999-11-30 2010-02-03 リンテック株式会社 半導体装置の製造方法
JP4947564B2 (ja) * 2000-01-21 2012-06-06 日東電工株式会社 半導体ウエハ加工用粘着シート
JP4087144B2 (ja) * 2001-04-23 2008-05-21 古河電気工業株式会社 レーザーダイシング用粘着テープ
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP4566527B2 (ja) * 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
TWI333672B (en) * 2005-03-29 2010-11-21 Furukawa Electric Co Ltd Wafer-dicing adhesive tape and method of producing chips using the same
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP5259121B2 (ja) * 2007-05-23 2013-08-07 シャープ株式会社 レーザー加工方法を用いた半導体装置の製造方法
JP4934620B2 (ja) * 2008-03-25 2012-05-16 古河電気工業株式会社 ウエハ加工用テープ
EP2151860A2 (en) * 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5323779B2 (ja) * 2010-07-26 2013-10-23 古河電気工業株式会社 ウエハ加工用テープ
CN102373017A (zh) * 2010-08-19 2012-03-14 古河电气工业株式会社 晶片加工用胶带

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1806326A (zh) * 2004-03-15 2006-07-19 日立化成工业株式会社 切割用芯片粘贴薄膜
CN1906737A (zh) * 2004-08-03 2007-01-31 古河电气工业株式会社 晶片加工用带
CN1993809A (zh) * 2004-08-03 2007-07-04 古河电气工业株式会社 半导体器件制造方法及晶片加工带
JP2007073930A (ja) * 2005-08-11 2007-03-22 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2007305679A (ja) * 2006-05-09 2007-11-22 Furukawa Electric Co Ltd:The レーザーダイシング用ダイシングダイボンドシート

Also Published As

Publication number Publication date
KR101616680B1 (ko) 2016-04-28
WO2014157471A1 (ja) 2014-10-02
KR20150110823A (ko) 2015-10-02
JP5731080B2 (ja) 2015-06-10
JPWO2014157471A1 (ja) 2017-02-16
TWI510591B (zh) 2015-12-01
CN105143380A (zh) 2015-12-09
TW201446928A (zh) 2014-12-16

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