JP5714110B2 - 基板製造装置及び基板製造方法 - Google Patents

基板製造装置及び基板製造方法 Download PDF

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Publication number
JP5714110B2
JP5714110B2 JP2013525675A JP2013525675A JP5714110B2 JP 5714110 B2 JP5714110 B2 JP 5714110B2 JP 2013525675 A JP2013525675 A JP 2013525675A JP 2013525675 A JP2013525675 A JP 2013525675A JP 5714110 B2 JP5714110 B2 JP 5714110B2
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substrate
station
thin film
coating station
base substrate
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Japanese (ja)
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JPWO2013015157A1 (ja
Inventor
靖仁 中森
靖仁 中森
礒　圭二
圭二 礒
裕司 岡本
裕司 岡本
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Priority to JP2013525675A priority Critical patent/JP5714110B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013525675A 2011-07-27 2012-07-17 基板製造装置及び基板製造方法 Active JP5714110B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013525675A JP5714110B2 (ja) 2011-07-27 2012-07-17 基板製造装置及び基板製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2011164874 2011-07-27
JP2011164874 2011-07-27
JP2011175170 2011-08-10
JP2011175170 2011-08-10
JP2013525675A JP5714110B2 (ja) 2011-07-27 2012-07-17 基板製造装置及び基板製造方法
PCT/JP2012/068118 WO2013015157A1 (ja) 2011-07-27 2012-07-17 基板製造装置及び基板製造方法

Publications (2)

Publication Number Publication Date
JPWO2013015157A1 JPWO2013015157A1 (ja) 2015-02-23
JP5714110B2 true JP5714110B2 (ja) 2015-05-07

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JP2013525675A Active JP5714110B2 (ja) 2011-07-27 2012-07-17 基板製造装置及び基板製造方法

Country Status (5)

Country Link
JP (1) JP5714110B2 (ko)
KR (3) KR20140024953A (ko)
CN (2) CN103718661A (ko)
TW (1) TWI458408B (ko)
WO (1) WO2013015157A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6112898B2 (ja) * 2013-02-20 2017-04-12 住友重機械工業株式会社 基板製造装置
JP6247950B2 (ja) * 2014-02-12 2017-12-13 矢崎総業株式会社 プライマ塗布方法及びプライマ塗布装置
CN105499069B (zh) * 2014-10-10 2019-03-08 住友重机械工业株式会社 膜形成装置及膜形成方法
JP6605876B2 (ja) * 2015-08-11 2019-11-13 東京応化工業株式会社 レジストパターン形成装置およびレジストパターン形成方法
CN105188277B (zh) * 2015-09-21 2017-12-08 迅得机械（东莞）有限公司 一种板件自动翻转插框装置
KR102535550B1 (ko) * 2015-09-30 2023-05-22 스미토모 긴조쿠 고잔 가부시키가이샤 유기 피막 제조방법, 도전성 기판 제조방법 및 유기 피막 제조장치
JP6652426B2 (ja) * 2016-03-29 2020-02-26 東レエンジニアリング株式会社 連続塗布装置及び連続塗布方法
JP6723648B2 (ja) * 2016-07-27 2020-07-15 住友重機械工業株式会社 位置検出装置及び位置検出方法
CN106067436A (zh) * 2016-08-01 2016-11-02 江苏宇天港玻新材料有限公司 一种基于同步带传送的基片材料输送装置
KR101954917B1 (ko) * 2018-09-12 2019-03-06 (주)에이피텍 카메라 모듈 제작용 양면 트레이를 이용한 카메라 모듈 양면 디스펜싱 시스템
KR102205125B1 (ko) * 2019-09-17 2021-01-19 연세대학교 산학협력단 베젤리스 표시 장치의 배선 인쇄 장치 및 표시 장치
US11878532B2 (en) * 2021-05-11 2024-01-23 Applied Materials, Inc. Inkjet platform for fabrication of optical films and structures

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824230A1 (de) * 1988-07-16 1990-01-25 Spiess Gmbh G Vorrichtung zum transport von werkstuecken
ATE214536T1 (de) * 1996-12-16 2002-03-15 Vantico Ag Verfahren und vorrichtung zur beschichtung von platten
CN1240567A (zh) * 1996-12-16 2000-01-05 希巴特殊化学控股公司 用于向板涂料的方法和装置
JPH11340606A (ja) * 1998-03-27 1999-12-10 Kansai Paint Co Ltd レジスト層の形成方法及びプリント配線基板の製造方法
JP2001185833A (ja) * 1999-12-27 2001-07-06 Ibiden Co Ltd 多層プリント配線板の製造方法及び製造装置
JP4386430B2 (ja) * 2004-04-07 2009-12-16 東京エレクトロン株式会社 塗布膜形成装置
WO2006011548A1 (ja) * 2004-07-30 2006-02-02 Hitachi Chemical Company, Ltd. 感光性フィルム、感光性フィルム積層体及び感光性フィルムロール
ITMI20061960A1 (it) * 2006-10-13 2008-04-14 Cedal Equipment Srl Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato
KR100872565B1 (ko) * 2006-10-25 2008-12-08 삼성전기주식회사 인쇄회로기판 제조방법
EP2073620A1 (de) * 2007-12-18 2009-06-24 Siemens Aktiengesellschaft Substrat-Transportvorrichtung für einen Bestückautomaten
JP5096972B2 (ja) * 2008-03-19 2012-12-12 株式会社ミマキエンジニアリング インクジェットプリンタ、印刷ユニットおよびその印刷方法

Also Published As

Publication number Publication date
CN110099513B (zh) 2022-02-18
TWI458408B (zh) 2014-10-21
CN103718661A (zh) 2014-04-09
TW201322853A (zh) 2013-06-01
WO2013015157A1 (ja) 2013-01-31
JPWO2013015157A1 (ja) 2015-02-23
KR20140024953A (ko) 2014-03-03
CN110099513A (zh) 2019-08-06
KR102061315B1 (ko) 2019-12-31
KR20180033598A (ko) 2018-04-03
KR20160044587A (ko) 2016-04-25

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