JP5704495B2 - マイクロエレクトロニクス組立用のポリマー組成物 - Google Patents
マイクロエレクトロニクス組立用のポリマー組成物 Download PDFInfo
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- JP5704495B2 JP5704495B2 JP2013524129A JP2013524129A JP5704495B2 JP 5704495 B2 JP5704495 B2 JP 5704495B2 JP 2013524129 A JP2013524129 A JP 2013524129A JP 2013524129 A JP2013524129 A JP 2013524129A JP 5704495 B2 JP5704495 B2 JP 5704495B2
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- 229920000642 polymer Polymers 0.000 title claims description 168
- 239000000203 mixture Substances 0.000 title claims description 165
- 238000004377 microelectronic Methods 0.000 title description 14
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 50
- 229920000379 polypropylene carbonate Polymers 0.000 claims description 33
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 26
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 25
- 235000019253 formic acid Nutrition 0.000 claims description 25
- 239000002904 solvent Substances 0.000 claims description 23
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 18
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 18
- 239000002253 acid Substances 0.000 claims description 17
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 16
- 239000000178 monomer Substances 0.000 claims description 16
- 230000004907 flux Effects 0.000 claims description 15
- VGZKCAUAQHHGDK-UHFFFAOYSA-M bis(4-tert-butylphenyl)iodanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 VGZKCAUAQHHGDK-UHFFFAOYSA-M 0.000 claims description 14
- WZZPVFWYFOZMQS-UHFFFAOYSA-N bicyclo[2.2.1]heptane-3,4-diol Chemical compound C1CC2(O)C(O)CC1C2 WZZPVFWYFOZMQS-UHFFFAOYSA-N 0.000 claims description 13
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 claims description 8
- 229920000515 polycarbonate Polymers 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 8
- 230000000707 stereoselective effect Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- YWVYZMVYXAVAKS-UHFFFAOYSA-N pyridin-1-ium;trifluoromethanesulfonate Chemical compound C1=CC=[NH+]C=C1.[O-]S(=O)(=O)C(F)(F)F YWVYZMVYXAVAKS-UHFFFAOYSA-N 0.000 claims description 7
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims description 6
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 claims description 6
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 6
- SJWNMXYJLKDWOG-UHFFFAOYSA-N [2-(4-methoxynaphthalen-1-yl)-2-oxoethyl]-dimethylsulfanium Chemical compound C1=CC=C2C(OC)=CC=C(C(=O)C[S+](C)C)C2=C1 SJWNMXYJLKDWOG-UHFFFAOYSA-N 0.000 claims description 5
- DNFSNYQTQMVTOK-UHFFFAOYSA-N bis(4-tert-butylphenyl)iodanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 DNFSNYQTQMVTOK-UHFFFAOYSA-N 0.000 claims description 4
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 claims description 4
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical group CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 3
- UCFVAGFTLWZIMC-UHFFFAOYSA-M benzyl-(4-methoxyphenyl)-dimethylazanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(OC)=CC=C1[N+](C)(C)CC1=CC=CC=C1 UCFVAGFTLWZIMC-UHFFFAOYSA-M 0.000 claims description 3
- JMMSLMMJRMCXPW-UHFFFAOYSA-N OC.OC.C1CC2CCC1C2 Chemical compound OC.OC.C1CC2CCC1C2 JMMSLMMJRMCXPW-UHFFFAOYSA-N 0.000 claims 4
- ZDLCTRXVPGDKOG-UHFFFAOYSA-N bicyclo[2.2.1]heptane;methanol Chemical compound OC.C1CC2CCC1C2 ZDLCTRXVPGDKOG-UHFFFAOYSA-N 0.000 claims 2
- 125000002243 cyclohexanonyl group Chemical group *C1(*)C(=O)C(*)(*)C(*)(*)C(*)(*)C1(*)* 0.000 claims 2
- CEDXAPLFOJGQBH-UHFFFAOYSA-N B(OC1=C(C(=C(C=C1)F)F)F)([O-])[O-].C(C)(C)(C)C1=CC=C(C=C1)[I+]C1=CC=C(C=C1)C(C)(C)C.C(C)(C)(C)C1=CC=C(C=C1)[I+]C1=CC=C(C=C1)C(C)(C)C Chemical compound B(OC1=C(C(=C(C=C1)F)F)F)([O-])[O-].C(C)(C)(C)C1=CC=C(C=C1)[I+]C1=CC=C(C=C1)C(C)(C)C.C(C)(C)(C)C1=CC=C(C=C1)[I+]C1=CC=C(C=C1)C(C)(C)C CEDXAPLFOJGQBH-UHFFFAOYSA-N 0.000 claims 1
- ANEFWEBMQHRDLH-UHFFFAOYSA-N tris(2,3,4,5,6-pentafluorophenyl) borate Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1OB(OC=1C(=C(F)C(F)=C(F)C=1F)F)OC1=C(F)C(F)=C(F)C(F)=C1F ANEFWEBMQHRDLH-UHFFFAOYSA-N 0.000 claims 1
- 238000009472 formulation Methods 0.000 description 55
- 239000000243 solution Substances 0.000 description 51
- 229910000679 solder Inorganic materials 0.000 description 39
- 239000003795 chemical substances by application Substances 0.000 description 31
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 24
- 235000012431 wafers Nutrition 0.000 description 21
- 238000000034 method Methods 0.000 description 19
- -1 but not limited to Chemical class 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 238000011068 loading method Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 238000000354 decomposition reaction Methods 0.000 description 10
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000000197 pyrolysis Methods 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- SIAPCJWMELPYOE-UHFFFAOYSA-N lithium hydride Chemical compound [LiH] SIAPCJWMELPYOE-UHFFFAOYSA-N 0.000 description 4
- 229910000103 lithium hydride Inorganic materials 0.000 description 4
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 239000002775 capsule Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- ONRGBXGMVZEZLY-UHFFFAOYSA-N dimethyl-[(4-methylphenyl)methyl]-phenylazanium Chemical compound C1=CC(C)=CC=C1C[N+](C)(C)C1=CC=CC=C1 ONRGBXGMVZEZLY-UHFFFAOYSA-N 0.000 description 3
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002411 thermogravimetry Methods 0.000 description 3
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 3
- RQCLDPLQNRBFQS-UHFFFAOYSA-N (4-chlorophenyl)methyl-dimethyl-phenylazanium Chemical compound C=1C=CC=CC=1[N+](C)(C)CC1=CC=C(Cl)C=C1 RQCLDPLQNRBFQS-UHFFFAOYSA-N 0.000 description 2
- NQEJEMZJOBCYOD-UHFFFAOYSA-N (4-methoxyphenyl)methyl-dimethyl-phenylazanium Chemical compound C1=CC(OC)=CC=C1C[N+](C)(C)C1=CC=CC=C1 NQEJEMZJOBCYOD-UHFFFAOYSA-N 0.000 description 2
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- HFKJQIJFRMRSKM-UHFFFAOYSA-N [3,5-bis(trifluoromethyl)phenoxy]boronic acid Chemical compound OB(O)OC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 HFKJQIJFRMRSKM-UHFFFAOYSA-N 0.000 description 2
- RDCRVCNPGSYUCY-UHFFFAOYSA-N [4-(hydroxymethyl)-3-bicyclo[2.2.1]heptanyl]methanol Chemical group C1CC2(CO)C(CO)CC1C2 RDCRVCNPGSYUCY-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
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- 229910052802 copper Inorganic materials 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 2
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- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical compound C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 2
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 2
- YFSUTJLHUFNCNZ-UHFFFAOYSA-N perfluorooctane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-N 0.000 description 2
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- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
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- 238000009482 thermal adhesion granulation Methods 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- SEQRCRMHHKUDLL-UHFFFAOYSA-M (4-methoxyphenyl)methyl-dimethyl-phenylazanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(OC)=CC=C1C[N+](C)(C)C1=CC=CC=C1 SEQRCRMHHKUDLL-UHFFFAOYSA-M 0.000 description 1
- QKAIFCSOWIMRJG-UHFFFAOYSA-N (4-methylphenyl)-(4-propan-2-ylphenyl)iodanium Chemical compound C1=CC(C(C)C)=CC=C1[I+]C1=CC=C(C)C=C1 QKAIFCSOWIMRJG-UHFFFAOYSA-N 0.000 description 1
- KZJUHXVCAHXJLR-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,4-nonafluoro-n-(1,1,2,2,3,3,4,4,4-nonafluorobutylsulfonyl)butane-1-sulfonamide Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F KZJUHXVCAHXJLR-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- IFFBKZAYSFHSFE-UHFFFAOYSA-N 1-[(4-methoxyphenyl)methyl]pyridin-1-ium Chemical compound C1=CC(OC)=CC=C1C[N+]1=CC=CC=C1 IFFBKZAYSFHSFE-UHFFFAOYSA-N 0.000 description 1
- BWNPRGWTDRFKGB-UHFFFAOYSA-N 1-ethoxy-2-methylpyridin-1-ium Chemical compound CCO[N+]1=CC=CC=C1C BWNPRGWTDRFKGB-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- YPFJVAAXNOANAU-UHFFFAOYSA-N 2-benzoyloxy-1,1,3,3,3-pentafluoropropane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(C(F)(F)F)OC(=O)C1=CC=CC=C1 YPFJVAAXNOANAU-UHFFFAOYSA-N 0.000 description 1
- WOAGDWWRYOZHDS-UHFFFAOYSA-N 4,4,5,5,6,6-hexafluoro-1,3,2-dithiazinane 1,1,3,3-tetraoxide Chemical compound FC1(F)C(F)(F)S(=O)(=O)NS(=O)(=O)C1(F)F WOAGDWWRYOZHDS-UHFFFAOYSA-N 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- JAFSQQAOPCFETI-UHFFFAOYSA-N 4-phenylbicyclo[2.2.1]heptane Chemical compound C1CC(C2)CCC21C1=CC=CC=C1 JAFSQQAOPCFETI-UHFFFAOYSA-N 0.000 description 1
- DRLHITSFMBYMLU-UHFFFAOYSA-N C(C)(C)(C)C(C1=CC=CC=C1)[N+]1=C(C=CC=C1)C Chemical compound C(C)(C)(C)C(C1=CC=CC=C1)[N+]1=C(C=CC=C1)C DRLHITSFMBYMLU-UHFFFAOYSA-N 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 1
- 229920002392 Novomer Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ARRVEVDPMPZLIG-UHFFFAOYSA-N [2-(6-benzoyl-9-ethylcarbazol-3-yl)-2-oxoethyl]-dimethylsulfanium Chemical compound C=1C=C2N(CC)C3=CC=C(C(=O)C[S+](C)C)C=C3C2=CC=1C(=O)C1=CC=CC=C1 ARRVEVDPMPZLIG-UHFFFAOYSA-N 0.000 description 1
- UVSSPWOKVSKHCU-UHFFFAOYSA-N [2-(trifluoromethyl)phenoxy]boronic acid Chemical compound OB(O)OC1=CC=CC=C1C(F)(F)F UVSSPWOKVSKHCU-UHFFFAOYSA-N 0.000 description 1
- YSVZGWAJIHWNQK-UHFFFAOYSA-N [3-(hydroxymethyl)-2-bicyclo[2.2.1]heptanyl]methanol Chemical compound C1CC2C(CO)C(CO)C1C2 YSVZGWAJIHWNQK-UHFFFAOYSA-N 0.000 description 1
- NIDYTZMQQGFIJI-UHFFFAOYSA-N [C-](S(=O)(=O)C(F)(F)F)(S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F.COC1=CC=C(C[N+](C2=CC=CC=C2)(C)C)C=C1 Chemical compound [C-](S(=O)(=O)C(F)(F)F)(S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F.COC1=CC=C(C[N+](C2=CC=CC=C2)(C)C)C=C1 NIDYTZMQQGFIJI-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000007630 basic procedure Methods 0.000 description 1
- ZTOKDDPUURVWCU-UHFFFAOYSA-N benzyl-dimethyl-(2-methylphenyl)azanium Chemical compound CC1=CC=CC=C1[N+](C)(C)CC1=CC=CC=C1 ZTOKDDPUURVWCU-UHFFFAOYSA-N 0.000 description 1
- UWHLWPMCMGXPJX-UHFFFAOYSA-M benzyl-dimethyl-(2-methylphenyl)azanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CC1=CC=CC=C1[N+](C)(C)CC1=CC=CC=C1 UWHLWPMCMGXPJX-UHFFFAOYSA-M 0.000 description 1
- FFZVILRAPIUNAA-UHFFFAOYSA-N benzyl-dimethyl-phenylazanium Chemical compound C=1C=CC=CC=1[N+](C)(C)CC1=CC=CC=C1 FFZVILRAPIUNAA-UHFFFAOYSA-N 0.000 description 1
- NAKOUCADTHHYEN-UHFFFAOYSA-M benzyl-dimethyl-phenylazanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C=1C=CC=CC=1[N+](C)(C)CC1=CC=CC=C1 NAKOUCADTHHYEN-UHFFFAOYSA-M 0.000 description 1
- PSQQBRMTEHGUFT-UHFFFAOYSA-M bis(4-tert-butylphenyl)iodanium;1,1,3,3,3-pentafluoropropane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)CC(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 PSQQBRMTEHGUFT-UHFFFAOYSA-M 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 150000005676 cyclic carbonates Chemical class 0.000 description 1
- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-O dimethyl(phenyl)azanium Chemical compound C[NH+](C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-O 0.000 description 1
- AGKQQPGFPRYFRP-UHFFFAOYSA-N dimethyl-(2-naphthalen-1-yl-2-oxoethyl)sulfanium Chemical compound C1=CC=C2C(C(=O)C[S+](C)C)=CC=CC2=C1 AGKQQPGFPRYFRP-UHFFFAOYSA-N 0.000 description 1
- ZOBIQZZKCFPQAR-UHFFFAOYSA-N dimethyl-(2-oxo-2-phenanthren-2-ylethyl)sulfanium Chemical compound C1=CC=C2C3=CC=C(C(=O)C[S+](C)C)C=C3C=CC2=C1 ZOBIQZZKCFPQAR-UHFFFAOYSA-N 0.000 description 1
- HYTMQRJGQSKUAU-UHFFFAOYSA-M dimethyl-[(4-methylphenyl)methyl]-phenylazanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C)=CC=C1C[N+](C)(C)C1=CC=CC=C1 HYTMQRJGQSKUAU-UHFFFAOYSA-M 0.000 description 1
- MEDVRQOQUBWLSI-UHFFFAOYSA-N dimethyl-[(4-nitrophenyl)methyl]-phenylazanium Chemical compound C=1C=CC=CC=1[N+](C)(C)CC1=CC=C([N+]([O-])=O)C=C1 MEDVRQOQUBWLSI-UHFFFAOYSA-N 0.000 description 1
- YPKVNLNDBXTBRN-UHFFFAOYSA-N dimethyl-[2-oxo-2-(4-phenylsulfanylphenyl)ethyl]sulfanium Chemical compound C1=CC(C(=O)C[S+](C)C)=CC=C1SC1=CC=CC=C1 YPKVNLNDBXTBRN-UHFFFAOYSA-N 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGOPGODQLGJZGL-UHFFFAOYSA-N lithium;butane Chemical compound [Li+].CC[CH-]C WGOPGODQLGJZGL-UHFFFAOYSA-N 0.000 description 1
- ZRGFOSSXVCLOIJ-UHFFFAOYSA-N methyl(diphenacyl)sulfanium Chemical compound C=1C=CC=CC=1C(=O)C[S+](C)CC(=O)C1=CC=CC=C1 ZRGFOSSXVCLOIJ-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-O methylsulfide anion Chemical compound [SH2+]C LSDPWZHWYPCBBB-UHFFFAOYSA-O 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- ACCDBHBOYZJSDT-UHFFFAOYSA-N n-(4-bromophenyl)-2-fluoroacetamide Chemical compound FCC(=O)NC1=CC=C(Br)C=C1 ACCDBHBOYZJSDT-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- KTNLYTNKBOKXRW-UHFFFAOYSA-N phenyliodanium Chemical compound [IH+]C1=CC=CC=C1 KTNLYTNKBOKXRW-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000012667 polymer degradation Methods 0.000 description 1
- 238000000710 polymer precipitation Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VRQDPNKOUPEWOC-UHFFFAOYSA-N spiro[bicyclo[2.2.2]octane-3,3'-piperidine] Chemical compound C1CCNCC21C(CC1)CCC1C2 VRQDPNKOUPEWOC-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000006488 t-butyl benzyl group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- IWBWUYDWYFYWIO-UHFFFAOYSA-N triphenacylsulfanium Chemical compound C=1C=CC=CC=1C(=O)C[S+](CC(=O)C=1C=CC=CC=1)CC(=O)C1=CC=CC=C1 IWBWUYDWYFYWIO-UHFFFAOYSA-N 0.000 description 1
- IXWPATJZVFGFNP-UHFFFAOYSA-N tris[2-(4-methoxyphenyl)-2-oxoethyl]sulfanium Chemical compound C1=CC(OC)=CC=C1C(=O)C[S+](CC(=O)C=1C=CC(OC)=CC=1)CC(=O)C1=CC=C(OC)C=C1 IXWPATJZVFGFNP-UHFFFAOYSA-N 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/02—Aliphatic polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/02—Aliphatic polycarbonates
- C08G64/0208—Aliphatic polycarbonates saturated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0033—Additives activating the degradation of the macromolecular compound
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polyesters Or Polycarbonates (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Polyethers (AREA)
Applications Claiming Priority (5)
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| US37121110P | 2010-08-06 | 2010-08-06 | |
| US37148910P | 2010-08-06 | 2010-08-06 | |
| US61/371,489 | 2010-08-06 | ||
| US61/371,211 | 2010-08-06 | ||
| PCT/US2011/046732 WO2012019092A1 (en) | 2010-08-06 | 2011-08-05 | Polymer composition for microelectronic assembly |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013540837A JP2013540837A (ja) | 2013-11-07 |
| JP2013540837A5 JP2013540837A5 (OSRAM) | 2014-04-24 |
| JP5704495B2 true JP5704495B2 (ja) | 2015-04-22 |
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| JP2013524128A Expired - Fee Related JP5837069B2 (ja) | 2010-08-06 | 2011-08-05 | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
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| JP (2) | JP5704495B2 (OSRAM) |
| KR (2) | KR101729065B1 (OSRAM) |
| CN (2) | CN103154081B (OSRAM) |
| WO (2) | WO2012019091A1 (OSRAM) |
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| JP5704495B2 (ja) | 2010-08-06 | 2015-04-22 | 住友ベークライト株式会社 | マイクロエレクトロニクス組立用のポリマー組成物 |
| US8535454B2 (en) * | 2010-11-23 | 2013-09-17 | Promerus, Llc | Polymer composition for microelectronic assembly |
| US9494861B2 (en) | 2012-07-04 | 2016-11-15 | Kaneka Corporation | Positive photosensitive composition, thin film transistor, and compound |
| US9505948B2 (en) | 2012-12-17 | 2016-11-29 | Promerus, Llc | Thermally decomposable polymer compositions for forming microelectronic assemblies |
| TW201446876A (zh) * | 2013-02-28 | 2014-12-16 | Promerus Llc | 具有聚環官能側基之高玻璃轉換溫度之光可成像聚碳酸酯類聚合物 |
| JP6612533B2 (ja) * | 2015-06-12 | 2019-11-27 | 三菱瓦斯化学株式会社 | 反応現像画像形成法、反応現像画像形成法に用いられる感光性樹脂組成物、および反応現像画像形成方法により製造された基板ならびに構造物 |
| JP6807226B2 (ja) * | 2016-12-09 | 2021-01-06 | 東京応化工業株式会社 | 基材上に平坦化膜又はマイクロレンズを形成するために用いられるエネルギー感受性組成物、硬化体の製造方法、硬化体、マイクロレンズの製造方法、及びｃｍｏｓイメージセンサ |
| KR101880151B1 (ko) * | 2017-07-12 | 2018-07-20 | 주식회사 삼양사 | 폴리노보넨-폴리카보네이트 공중합체 및 그 제조방법 |
| CN111848933B (zh) * | 2020-06-28 | 2022-08-23 | 吴君宇 | 一种可降解共聚酯的制备方法 |
| CN114161031A (zh) * | 2021-12-30 | 2022-03-11 | 广东芯聚能半导体有限公司 | 助焊剂、助焊膜、预制焊片及其应用 |
| JP2023135288A (ja) * | 2022-03-15 | 2023-09-28 | 旭化成株式会社 | メチレン鎖を含む脂環式ポリカーボネート樹脂 |
| JP2023052255A (ja) * | 2022-08-23 | 2023-04-11 | サンアプロ株式会社 | 酸発生剤、前記酸発生剤を含む硬化性組成物、及びその硬化物 |
| JPWO2024042951A1 (OSRAM) * | 2022-08-23 | 2024-02-29 | ||
| WO2025203788A1 (ja) * | 2024-03-26 | 2025-10-02 | リンテック株式会社 | 分解性フィルムの使用方法およびレジストパターンの作製方法 |
| CN121039569A (zh) * | 2024-03-26 | 2025-11-28 | 琳得科株式会社 | 分解性膜的使用方法及抗蚀图案的制作方法 |
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| DE68924887T4 (de) * | 1988-09-02 | 1996-08-29 | Kuraray Co | Polycarbonat- oder Polyestercarbonatharze. |
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- 2011-08-05 EP EP11745659.0A patent/EP2601238B1/en not_active Not-in-force
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Also Published As
| Publication number | Publication date |
|---|---|
| US8575248B2 (en) | 2013-11-05 |
| WO2012019091A1 (en) | 2012-02-09 |
| CN103154081A (zh) | 2013-06-12 |
| US8729215B2 (en) | 2014-05-20 |
| JP5837069B2 (ja) | 2015-12-24 |
| EP2601238A1 (en) | 2013-06-12 |
| EP2601238B1 (en) | 2015-10-07 |
| US20140024799A1 (en) | 2014-01-23 |
| KR20130139234A (ko) | 2013-12-20 |
| KR20130138192A (ko) | 2013-12-18 |
| US20140024750A1 (en) | 2014-01-23 |
| CN103154081B (zh) | 2015-11-25 |
| US20120031556A1 (en) | 2012-02-09 |
| JP2013535562A (ja) | 2013-09-12 |
| WO2012019092A1 (en) | 2012-02-09 |
| JP2013540837A (ja) | 2013-11-07 |
| US8729166B2 (en) | 2014-05-20 |
| US8575297B2 (en) | 2013-11-05 |
| KR101729065B1 (ko) | 2017-04-21 |
| CN103119082A (zh) | 2013-05-22 |
| US20120034387A1 (en) | 2012-02-09 |
| KR101650893B1 (ko) | 2016-08-25 |
| EP2601239A1 (en) | 2013-06-12 |
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