JP2013540837A5 - - Google Patents

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Publication number
JP2013540837A5
JP2013540837A5 JP2013524129A JP2013524129A JP2013540837A5 JP 2013540837 A5 JP2013540837 A5 JP 2013540837A5 JP 2013524129 A JP2013524129 A JP 2013524129A JP 2013524129 A JP2013524129 A JP 2013524129A JP 2013540837 A5 JP2013540837 A5 JP 2013540837A5
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Japan
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polymer composition
polymer
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composition according
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JP2013524129A
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English (en)
Japanese (ja)
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JP2013540837A (ja
JP5704495B2 (ja
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Priority claimed from PCT/US2011/046732 external-priority patent/WO2012019092A1/en
Publication of JP2013540837A publication Critical patent/JP2013540837A/ja
Publication of JP2013540837A5 publication Critical patent/JP2013540837A5/ja
Application granted granted Critical
Publication of JP5704495B2 publication Critical patent/JP5704495B2/ja
Expired - Fee Related legal-status Critical Current
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JP2013524129A 2010-08-06 2011-08-05 マイクロエレクトロニクス組立用のポリマー組成物 Expired - Fee Related JP5704495B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37148910P 2010-08-06 2010-08-06
US37121110P 2010-08-06 2010-08-06
US61/371,211 2010-08-06
US61/371,489 2010-08-06
PCT/US2011/046732 WO2012019092A1 (en) 2010-08-06 2011-08-05 Polymer composition for microelectronic assembly

Publications (3)

Publication Number Publication Date
JP2013540837A JP2013540837A (ja) 2013-11-07
JP2013540837A5 true JP2013540837A5 (OSRAM) 2014-04-24
JP5704495B2 JP5704495B2 (ja) 2015-04-22

Family

ID=45555212

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013524128A Expired - Fee Related JP5837069B2 (ja) 2010-08-06 2011-08-05 立体特異性多環式2,3−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物
JP2013524129A Expired - Fee Related JP5704495B2 (ja) 2010-08-06 2011-08-05 マイクロエレクトロニクス組立用のポリマー組成物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2013524128A Expired - Fee Related JP5837069B2 (ja) 2010-08-06 2011-08-05 立体特異性多環式2,3−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物

Country Status (6)

Country Link
US (4) US8575297B2 (OSRAM)
EP (2) EP2601238B1 (OSRAM)
JP (2) JP5837069B2 (OSRAM)
KR (2) KR101729065B1 (OSRAM)
CN (2) CN103119082A (OSRAM)
WO (2) WO2012019091A1 (OSRAM)

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CN103119082A (zh) 2010-08-06 2013-05-22 普罗米鲁斯有限责任公司 包括具有由立体有择多环2,3-二醇单体衍生的重复单元的聚碳酸酯的牺牲聚合物组合物
US8535454B2 (en) * 2010-11-23 2013-09-17 Promerus, Llc Polymer composition for microelectronic assembly
KR102148246B1 (ko) * 2012-07-04 2020-08-26 가부시키가이샤 가네카 포지티브형 감광성 조성물, 박막 트랜지스터 및 화합물
WO2014099614A1 (en) * 2012-12-17 2014-06-26 Promerus, Llc Thermally decomposable polymer composition for forming microelectric assemblies
TW201446876A (zh) * 2013-02-28 2014-12-16 Promerus Llc 具有聚環官能側基之高玻璃轉換溫度之光可成像聚碳酸酯類聚合物
JP6612533B2 (ja) * 2015-06-12 2019-11-27 三菱瓦斯化学株式会社 反応現像画像形成法、反応現像画像形成法に用いられる感光性樹脂組成物、および反応現像画像形成方法により製造された基板ならびに構造物
JP6807226B2 (ja) * 2016-12-09 2021-01-06 東京応化工業株式会社 基材上に平坦化膜又はマイクロレンズを形成するために用いられるエネルギー感受性組成物、硬化体の製造方法、硬化体、マイクロレンズの製造方法、及びcmosイメージセンサ
KR101880151B1 (ko) * 2017-07-12 2018-07-20 주식회사 삼양사 폴리노보넨-폴리카보네이트 공중합체 및 그 제조방법
CN111848933B (zh) * 2020-06-28 2022-08-23 吴君宇 一种可降解共聚酯的制备方法
CN114161031A (zh) * 2021-12-30 2022-03-11 广东芯聚能半导体有限公司 助焊剂、助焊膜、预制焊片及其应用
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WO2024042951A1 (ja) * 2022-08-23 2024-02-29 サンアプロ株式会社 酸発生剤、前記酸発生剤を含む硬化性組成物、及びその硬化物
JP2023052255A (ja) * 2022-08-23 2023-04-11 サンアプロ株式会社 酸発生剤、前記酸発生剤を含む硬化性組成物、及びその硬化物
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WO2025203788A1 (ja) * 2024-03-26 2025-10-02 リンテック株式会社 分解性フィルムの使用方法およびレジストパターンの作製方法

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