JP5645371B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5645371B2 JP5645371B2 JP2009118306A JP2009118306A JP5645371B2 JP 5645371 B2 JP5645371 B2 JP 5645371B2 JP 2009118306 A JP2009118306 A JP 2009118306A JP 2009118306 A JP2009118306 A JP 2009118306A JP 5645371 B2 JP5645371 B2 JP 5645371B2
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Description
11 チップ
12 接着剤
13 パッケージ基板
14 ダイパッド
15 半田ボール
16 スロット
17、17−11、17−12、17−13、17−21、17−22 ボンディングフィンガー
18 ボンディングワイヤ
19 配線パターン
20 モールド
21 ボンディングフィンガー領域
22 外部接続端子領域
23 配線領域
Claims (16)
- 中央部の一部分が切り抜かれて形成されたスロットと、基板底面側に外部接続端子と前記外部接続端子に接続されたボンディングフィンガーとを有するパッケージ基板と、前記パッケージ基板の上面側に実装されたチップと、を備え、
前記ボンディングフィンガーは、前記スロットの辺に沿って配置され、前記ボンディングフィンガーの端部領域における第1の配列は前記スロットの辺から近い距離に配置された第1行目の配列であり、前記ボンディングフィンガーの中心部領域における第2の配列は、少なくとも前記第1行目の配列と比較して前記スロットの辺から遠く離れた位置に配置された第2行目の配列を有することを特徴とする半導体装置。 - 前記第2の配列は、前記第1行目の配列と、前記第2行目の配列とが交互に千鳥配置されたことを特徴とする請求項1に記載の半導体装置。
- 前記第1行目の配列と前記第2行目の配列との境界におけるボンディングフィンガー間隔は、前記第1行目及び前記第2行目の配列におけるそれぞれのボンディングフィンガー間隔よりも狭いことを特徴とする請求項1または2に記載の半導体装置。
- 前記スロットを介して前記チップのダイパッドと前記ボンディングフィンガーとがボンディングワイヤを用いて接続されたことを特徴とする請求項1乃至3のいずれかに記載の半導体装置。
- 前記外部接続端子は半田ボールであることを特徴とする請求項1乃至4のいずれかに記載の半導体装置。
- 中央部の一部分が切り抜かれて形成されたスロットと、基板底面側に外部接続端子と前記スロットの1辺に沿った基板上にボンディングフィンガーと、を備え、
前記ボンディングフィンガーは前記外部接続端子に接続され、前記ボンディングフィンガーの端部領域における第1の配列は前記スロットの辺から近い距離に配置された第1行目の配列であり、前記ボンディングフィンガーの中心部領域における第2の配列は、少なくとも前記第1行目の配列と比較して前記スロットの辺から遠く離れた位置に配置された第2行目の配列を有することを特徴とするパッケージ基板。 - 前記パッケージ基板の上面側にチップを搭載するためのチップ搭載面を有することを特徴とする請求項6に記載のパッケージ基板。
- 前記第2の配列は、前記第1行目の配列と、前記第2行目の配列とが交互に千鳥配置されたことを特徴とする請求項6または7に記載のパッケージ基板。
- 前記第1行目の配列と前記第2行目の配列との境界におけるボンディングフィンガー間隔は、前記第1行目及び前記第2行目の配列におけるそれぞれのボンディングフィンガー間隔よりも狭いことを特徴とする請求項6乃至8のいずれかに記載のパッケージ基板。
- 前記外部接続端子は半田ボールであることを特徴とする請求項6乃至9のいずれかに記載のパッケージ基板。
- ダイパッドを備える半導体チップと、
中央部の一部分が切り抜かれて形成されたスロットと、前記半導体チップのダイパッドと接続されるボンディングフィンガーとを有し、前記半導体チップを上面側に搭載するパッケージ基板と、前記パッケージ基板の底面側に形成された外部接続端子と、を備え、
前記ボンディングフィンガーは、前記スロットに沿って配置されるとともに、中央部領域である第1の領域と、前記第1の領域の両端である第2の領域と、第3の領域とに分割配置され、前記第1の領域の前記ボンディングフィンガーは前記スロットの辺から遠い位置に直線状に配列され、前記第2と第3の領域のボンディングフィンガーは、前記第1の領域のボンディングフィンガーの配列と比較して前記スロットの辺から近い位置に直線状に配列されていることを特徴とする半導体装置。 - 前記第1の領域には、前記第2と第3の領域のボンディンフフィンガーと同じく、前記スロットの辺から近い位置に直線状に配列されたボンディングフィンガーをさらに備えていることを特徴とする請求項11に記載の半導体装置。
- 前記第1の領域のボンディングフィンガーは、前記スロットの辺から近い位置に配列されたボンディングフィンガーと、前記スロットの辺から遠い位置に配列されたボンディングフィンガーとが千鳥配置されていることを特徴とする請求項12に記載の半導体装置。
- 前記外部接続端子は、前記外部接続端子と前記ボンディングフィンガーは前記パッケージ基板の同一面に設けられていることを特徴とする請求項11に記載の半導体装置。
- 前記外部接続端子と前記ボンディングフィンガーが設けられている前記パッケージ基板の反対面に前記半導体チップが搭載されていることを特徴とする請求項14に記載の半導体装置。
- 前記ダイパッドと前記ボンディングフィンガーとは、前記スロットを介してボンディングワイヤにより接続されていることを特徴とする請求項11に記載の半導体装置。
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US14/034,254 US8796077B2 (en) | 2009-05-15 | 2013-09-23 | Semiconductor device |
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JP5645371B2 (ja) * | 2009-05-15 | 2014-12-24 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
KR20160000953A (ko) | 2014-06-25 | 2016-01-06 | 삼성전자주식회사 | 기판 및 반도체 패키지의 제조방법 |
JP2017168702A (ja) * | 2016-03-17 | 2017-09-21 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
JP7362380B2 (ja) | 2019-09-12 | 2023-10-17 | キヤノン株式会社 | 配線基板及び半導体装置 |
KR20210129546A (ko) * | 2020-04-20 | 2021-10-28 | 에스케이하이닉스 주식회사 | 서로 엇갈리게 배열되는 본드 핑거를 구비하는 패키지 기판을 포함하는 반도체 패키지 |
US11296034B2 (en) * | 2020-06-18 | 2022-04-05 | Advanced Semiconductor Engineering, Inc. | Substrate and semiconductor package comprising an interposer element with a slot and method of manufacturing the same |
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JP2891665B2 (ja) * | 1996-03-22 | 1999-05-17 | 株式会社日立製作所 | 半導体集積回路装置およびその製造方法 |
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US6465891B2 (en) * | 2001-01-19 | 2002-10-15 | Siliconware Precision Industries Co., Ltd. | Integrated-circuit package with a quick-to-count finger layout design on substrate |
JP3415128B1 (ja) * | 2001-12-07 | 2003-06-09 | 沖電気工業株式会社 | 半導体装置 |
JP4291209B2 (ja) * | 2004-05-20 | 2009-07-08 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
KR20060074143A (ko) * | 2004-12-27 | 2006-07-03 | 주식회사 하이닉스반도체 | Fbga 패키지 |
JP2006013553A (ja) * | 2005-09-22 | 2006-01-12 | Renesas Technology Corp | 半導体集積回路装置 |
JP4942020B2 (ja) * | 2006-05-12 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7884481B2 (en) * | 2007-08-02 | 2011-02-08 | Mediatek Inc. | Semiconductor chip package and method for designing the same |
JP5645371B2 (ja) * | 2009-05-15 | 2014-12-24 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
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US8796077B2 (en) | 2014-08-05 |
US8569898B2 (en) | 2013-10-29 |
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