JP5602553B2 - 表面処理装置 - Google Patents

表面処理装置 Download PDF

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Publication number
JP5602553B2
JP5602553B2 JP2010209743A JP2010209743A JP5602553B2 JP 5602553 B2 JP5602553 B2 JP 5602553B2 JP 2010209743 A JP2010209743 A JP 2010209743A JP 2010209743 A JP2010209743 A JP 2010209743A JP 5602553 B2 JP5602553 B2 JP 5602553B2
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JP
Japan
Prior art keywords
jig
workpiece
tank
vibration
surface treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010209743A
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English (en)
Japanese (ja)
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JP2012062555A (ja
Inventor
朝裕 野田
重幸 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Almex Pe Inc
Original Assignee
Almex Pe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Pe Inc filed Critical Almex Pe Inc
Priority to JP2010209743A priority Critical patent/JP5602553B2/ja
Priority to CN201610071850.XA priority patent/CN105442027A/zh
Priority to CN2011101815222A priority patent/CN102409387A/zh
Priority to KR1020110077172A priority patent/KR101295249B1/ko
Publication of JP2012062555A publication Critical patent/JP2012062555A/ja
Application granted granted Critical
Publication of JP5602553B2 publication Critical patent/JP5602553B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2010209743A 2010-09-17 2010-09-17 表面処理装置 Active JP5602553B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010209743A JP5602553B2 (ja) 2010-09-17 2010-09-17 表面処理装置
CN201610071850.XA CN105442027A (zh) 2010-09-17 2011-06-30 表面处理装置
CN2011101815222A CN102409387A (zh) 2010-09-17 2011-06-30 表面处理装置
KR1020110077172A KR101295249B1 (ko) 2010-09-17 2011-08-03 표면처리장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010209743A JP5602553B2 (ja) 2010-09-17 2010-09-17 表面処理装置

Publications (2)

Publication Number Publication Date
JP2012062555A JP2012062555A (ja) 2012-03-29
JP5602553B2 true JP5602553B2 (ja) 2014-10-08

Family

ID=45911718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010209743A Active JP5602553B2 (ja) 2010-09-17 2010-09-17 表面処理装置

Country Status (3)

Country Link
JP (1) JP5602553B2 (ko)
KR (1) KR101295249B1 (ko)
CN (2) CN105442027A (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101366999B1 (ko) * 2012-05-07 2014-02-25 삼성전기주식회사 기판의 에어 탈포장치
CN104451801A (zh) * 2014-11-15 2015-03-25 扬州禾基塑业有限公司 一种电镀后处理装置
KR101683144B1 (ko) 2014-12-23 2016-12-06 주식회사 투게더 데이터 전송 방법
CN104988566B (zh) * 2015-06-26 2018-03-16 昆山博通机械设备有限公司 具整流功能的智能自驱动移载挂架
CN109804108B (zh) * 2016-09-29 2021-07-23 Almex Pe 株式会社 工件保持夹具和表面处理装置
CN113930834A (zh) * 2017-05-30 2022-01-14 Almex Pe 株式会社 表面处理装置和搬送治具
KR102024835B1 (ko) * 2017-07-28 2019-09-25 주식회사 티케이씨 기판 지지용 클램프 행거
JP6909524B2 (ja) * 2018-11-20 2021-07-28 株式会社アルメックステクノロジーズ 治具搬送部材並びに表面処理装置及び方法
CN111910240B (zh) * 2019-05-10 2023-11-10 湖南鸿展自动化设备有限公司 一种线路板电镀装置
KR102034465B1 (ko) * 2019-07-26 2019-10-21 이희범 도금 장치
CN110484961A (zh) * 2019-08-30 2019-11-22 苏州铭电机械科技有限公司 一种fpc电镀系统
KR102380767B1 (ko) * 2022-01-12 2022-04-01 (주)네오피엠씨 도금용 행거의 클램핑 이송장치

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS563690A (en) * 1979-06-20 1981-01-14 Ibiden Co Ltd High speed through-hole plating method
JPS62154797A (ja) * 1985-12-27 1987-07-09 株式会社　プランテツクス プリント基板製造装置
CN86207138U (zh) * 1986-09-30 1987-09-02 机械工业部济南铸造锻压机械研究所 连续抛丸清理机
TW218397B (en) * 1993-06-15 1994-01-01 Electroplating & Chemical Raw Materials Vibratory electroplating process and its device
CN1104267A (zh) * 1993-12-24 1995-06-28 辰泽兴业有限公司 震动式电镀方法及装置
JP3591721B2 (ja) * 2001-06-29 2004-11-24 株式会社アルメックス 表面処理装置
JP2003073894A (ja) 2001-09-04 2003-03-12 Kida Seiko Kk 連続電気メッキ処理システム及びこれに用いる旋回治具
JP2004111893A (ja) * 2002-07-24 2004-04-08 Kyocera Corp 多数個取り配線基板の製造方法
JP2004211118A (ja) 2002-12-27 2004-07-29 Marunaka Kogyo Kk 液中搬送式電気メッキ装置におけるワーク搬送装置
JP2004281444A (ja) * 2003-03-12 2004-10-07 Chuo Seisakusho Ltd プリント配線板のスルーホールめっき装置
JP4257897B2 (ja) * 2003-05-23 2009-04-22 株式会社ケミトロン メッキ装置
KR20050042627A (ko) * 2003-11-03 2005-05-10 (주)포인텍 도금 처리장치용 반송장치
CN2742723Y (zh) * 2004-11-19 2005-11-23 丰顺县骏达电子有限公司 一种用于线路板的摇摆振动装置
JP5038024B2 (ja) * 2007-06-06 2012-10-03 上村工業株式会社 ワークの表面処理システム
JP5457010B2 (ja) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 連続めっき処理装置
CN201276605Y (zh) * 2008-03-07 2009-07-22 竞铭机械股份有限公司 脱气装置
CN101498028A (zh) * 2009-01-20 2009-08-05 东莞宝迪环保电镀设备有限公司 一种单槽多工艺表面处理装置
CN201420109Y (zh) * 2009-03-24 2010-03-10 东莞市宏德电子设备有限公司 一种气缸顶振与电振动装置
CN201490825U (zh) * 2009-08-21 2010-05-26 东莞美维电路有限公司 沉锡线电振动装置
JP2012046783A (ja) * 2010-08-25 2012-03-08 Almex Pe Inc 表面処理装置
JP5613499B2 (ja) * 2010-08-25 2014-10-22 アルメックスＰｅ株式会社 表面処理装置

Also Published As

Publication number Publication date
KR20120030308A (ko) 2012-03-28
CN102409387A (zh) 2012-04-11
KR101295249B1 (ko) 2013-08-12
JP2012062555A (ja) 2012-03-29
CN105442027A (zh) 2016-03-30

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