JP5600097B2 - 冷却板アセンブリおよびパワーエレクトロニクス・モジュール - Google Patents
冷却板アセンブリおよびパワーエレクトロニクス・モジュール Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/083—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
- F28F9/0221—Header boxes or end plates formed by stacked elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
本明細書は、概略的には冷却板アセンブリに関し、より詳細には、多層式の冷却板アセンブリ、および、それを取入れたパワーエレクトロニクス・モジュールに関する。
105 冷却流体取入口
112 目標熱伝達層
113、113a〜113f 目標熱伝達区画
114 第2パス熱伝達層
115、115a〜115f 第2パス熱伝達区画
117、117a〜117f 中央流体吐出領域
120 目標熱伝達層マイクロチャネル
124 第2パス熱伝達層マイクロチャネル
127 遷移チャネル
130 目標熱伝達層フィン
132 第2パス熱伝達層フィン
160 取入マニフォルド層
161 衝当噴流ノズル
162 取入チャネル
164 流体取入孔
166 冷却流体吐出口
170 吐出マニフォルド層
172 吐出チャネル
174 流体吐出孔
Claims (14)
- 冷却流体取入口と、
冷却流体吐出口と取入チャネルとを備える取入マニフォルド層であって、前記取入チャネルは複数の衝当噴流ノズルに対して流体結合された複数の流体取入孔を備え、前記複数の流体取入孔の内の少なくとも2つの流体取入孔は前記冷却流体取入口から不等距離だけ離間され、各流体取入孔における冷却流体の取入冷却流体流量は実質的に均一であるという取入マニフォルド層と、
複数の目標熱伝達区画を備える目標熱伝達層であって、各目標熱伝達区画は、中央衝当領域から径方向に延在する複数の目標熱伝達層マイクロチャネルを画成する複数の目標熱伝達層フィンを備えるという目標熱伝達層と、
複数の第2パス熱伝達区画を備える第2パス熱伝達層であって、各第2パス熱伝達区画は、中央流体吐出領域に向けて径方向に延在する複数の第2パス熱伝達層マイクロチャネルを画成する複数の第2パス熱伝達層フィンと、各第2パス熱伝達区画の周縁部に位置決めされた1つ以上の遷移チャネルとを備え、
前記第2パス熱伝達層は前記目標熱伝達層に対して熱的に結合され、
前記各遷移チャネルは、前記第2パス熱伝達層を前記目標熱伝達層に対して流体結合し、
前記複数の衝当噴流ノズルは、前記第2パス熱伝達区画の前記中央流体吐出領域を通して流体を導向すべく位置決めされるという第2パス熱伝達層と、
吐出チャネルを備える吐出マニフォルド層であって、前記吐出チャネルは複数の流体吐出孔を備え、
前記吐出マニフォルド層は、前記第2パス熱伝達層および前記取入マニフォルド層に対して熱的に結合され、
前記吐出チャネルは前記冷却流体吐出口に対して流体結合され、
前記複数の衝当噴流ノズルは前記複数の流体吐出孔を貫通通過する、
という吐出マニフォルド層とを備える、冷却板アセンブリ。 - 前記取入マニフォルド層は、前記取入チャネルの周縁部に沿う複数の誘引取入チャネル壁部を更に備え、各誘引取入チャネル壁部は、個々の流体取入孔の近傍に配置された取入用スプライン状特定構造を備え、
前記吐出マニフォルド層は、前記吐出チャネルの周縁部に沿う複数の誘引吐出チャネル壁部を更に備え、各誘引吐出チャネル壁部は、個々の流体吐出孔の近傍に配置された吐出用スプライン状特定構造を備える、請求項1に記載の冷却板アセンブリ。 - 前記目標熱伝達層フィンおよび前記第2パス熱伝達層フィンは湾曲壁部を備え、
前記目標熱伝達層フィンおよび前記第2パス熱伝達層フィンの前記湾曲壁部は、冷却流体および前記目標熱伝達層フィンおよび前記第2パス熱伝達層フィンの間の対流的な熱伝達を最適化すべく形状化される、請求項1に記載の冷却板アセンブリ。 - 前記複数の目標熱伝達表面層マイクロチャネルにより画成される目標熱伝達層マイクロチャネル・パターンは、前記複数の第2パス熱伝達層マイクロチャネルにより画成される第2パス熱伝達層マイクロチャネル・パターンとは異なる、請求項1に記載の冷却板アセンブリ。
- 冷却流体吐出口と取入チャネルとを備える取入マニフォルド層であって、前記取入チャネルは、複数の衝当噴流ノズルに対して流体結合された複数の流体取入孔と、該取入チャネルの周縁部に沿う複数の誘引取入チャネル壁部とを備え、各誘引取入チャネル壁部は、個々の流体取入孔の近傍に配置された取入用スプライン状特定構造を備えるという取入マニフォルド層と、
複数の目標熱伝達区画を備える目標熱伝達層であって、各目標熱伝達区画は、中央衝当領域から径方向に外方に延在する複数の目標熱伝達層マイクロチャネルを画成する湾曲壁部を有する複数の目標熱伝達層フィンを備えるという目標熱伝達層と、
複数の第2パス熱伝達区画を備える第2パス熱伝達層であって、各第2パス熱伝達区画は、中央流体吐出領域に向けて径方向に内方に延在する複数の第2パス熱伝達層マイクロチャネルを画成する湾曲壁部を有する複数の第2パス熱伝達層フィンと、各第2パス熱伝達区画間に位置決めされた1つ以上の遷移チャネルとを備え、
前記第2パス熱伝達層は、前記目標熱伝達層に対して熱的に結合され、
前記遷移チャネルは、前記第2パス熱伝達層を前記目標熱伝達層に対して流体結合し、
前記複数の衝当噴流ノズルは、前記各第2パス熱伝達区画の前記中央流体吐出領域を貫通して位置決めされるという第2パス熱伝達層と、
吐出チャネルを備える吐出マニフォルド層であって、前記吐出チャネルは、複数の流体吐出孔と、該吐出チャネルの周縁部に沿う複数の誘引吐出チャネル壁部とを備え、各誘引吐出チャネル壁部は、個々の流体吐出孔の近傍に配置された吐出用スプライン状特定構造を備え、
前記吐出マニフォルド層は、前記第2パス熱伝達層および前記取入マニフォルド層に対して熱的に結合され、
前記吐出チャネルは、前記冷却流体吐出口に対して流体結合され、
前記複数の衝当噴流ノズルは前記複数の流体吐出孔を貫通通過し、
前記複数の目標熱伝達層マイクロチャネルにより画成される目標熱伝達層マイクロチャネル・パターンは、前記複数の第2パス熱伝達層マイクロチャネルにより画成される第2パス熱伝達層マイクロチャネル・パターンとは異なるという吐出マニフォルド層とを備える、冷却板アセンブリ。 - 冷却流体は、前記複数の衝当噴流ノズルから流れ、各目標熱伝達区画の前記中央衝当領域において前記目標熱伝達層に衝当し、前記複数の目標熱伝達層マイクロチャネルを通り各目標熱伝達区画の周縁部に向けて外方に流れる、請求項1または請求項5に記載の冷却板アセンブリ。
- 冷却流体は、前記目標熱伝達層から前記1つ以上の遷移チャネルを通り前記第2パス熱伝達層まで流れ、前記第2パス熱伝達層マイクロチャネルを通り前記各第2パス熱伝達区画の前記中央流体吐出領域に向けて流れる、請求項1または請求項5に記載の冷却板アセンブリ。
- 冷却流体は、前記熱伝達層から前記複数の流体吐出孔を通り前記吐出マニフォルド層へと、各流体吐出孔において実質的に均一である吐出冷却流体流量にて流れる、請求項1または請求項5に記載の冷却板アセンブリ。
- 前記複数の流体取入孔および前記複数の流体吐出孔は、該複数の流体取入孔が該複数の流体吐出孔と同心的に整列される如く、少なくとも2本の列状に、前記取入チャネルおよび前記吐出チャネル内に夫々配置される、請求項1または請求項5に記載の冷却板アセンブリ。
- 前記取入マニフォルド層に対して熱的に結合されたシール層を更に備える、請求項1または請求項5に記載の冷却板アセンブリ。
- 前記複数の衝当噴流ノズルは、前記取入マニフォルド層と一体的であり、前記複数の流体取入孔に対して流体結合される、請求項1または請求項5に記載の冷却板アセンブリ。
- 前記1つ以上の遷移チャネルは、前記複数の目標熱伝達層マイクロチャネルおよび前記複数の第2パス熱伝達層マイクロチャネルに対して直交する、請求項1または請求項5に記載の冷却板アセンブリ。
- 前記取入マニフォルド層は、付加的な流体取入口を備える付加的な取入チャネルを更に備え、
前記目標熱伝達層は、複数の付加的な目標熱伝達区画を備え、
前記第2パス熱伝達層は、複数の付加的な第2パス熱伝達区画を備え、
前記吐出マニフォルド層は、付加的な吐出チャネルを更に備え、
前記吐出チャネルは、前記付加的な流体取入口に対して流体結合された結合チャネルを更に備え、
前記付加的な吐出チャネルは前記冷却流体吐出口に対して流体結合される、請求項1または請求項5に記載の冷却板アセンブリ。 - 冷却板アセンブリであって、
冷却流体取入口と、
冷却流体吐出口と取入チャネルとを備える取入マニフォルド層であって、前記取入チャネルは複数の衝当噴流ノズルに対して流体結合された複数の流体取入孔を備え、前記複数の流体取入孔の内の少なくとも2つの流体取入孔は前記冷却流体取入口から不等距離だけ離間され、且つ、各流体取入孔における冷却流体の取入冷却流体流量は実質的に均一であるという取入マニフォルド層と、
複数の目標熱伝達区画を備える目標熱伝達層であって、各目標熱伝達区画は、中央衝当領域から径方向に延在する複数の目標熱伝達層マイクロチャネルを画成する複数の目標熱伝達層フィンを備えるという目標熱伝達層と、
複数の第2パス熱伝達区画を備える第2パス熱伝達層であって、各第2パス熱伝達区画は、中央流体吐出領域に向けて径方向に延在する複数の第2パス熱伝達層マイクロチャネルを画成する複数の第2パス熱伝達層フィンと、各第2パス熱伝達区画間に位置決めされた1つ以上の遷移チャネルとを備え、
前記第2パス熱伝達層は前記目標熱伝達層に対して熱的に結合され、
前記各遷移チャネルは、前記第2パス熱伝達層を前記目標熱伝達層に対して流体結合し、
前記複数の衝当噴流ノズルは、前記第2パス熱伝達区画の前記中央流体吐出領域を通して流体を導向すべく位置決めされるという第2パス熱伝達層と、
吐出チャネルを備える吐出マニフォルド層であって、前記吐出チャネルは複数の流体吐出孔を備え、
前記吐出マニフォルド層は、前記第2パス熱伝達層および前記取入マニフォルド層に対して熱的に結合され、
前記吐出チャネルは前記冷却流体吐出口に対して流体結合され、且つ、
前記複数の衝当噴流ノズルは前記複数の流体吐出孔を貫通通過する、
という吐出マニフォルド層とを備えるという冷却板アセンブリと、
前記目標熱伝達層の背面に対して結合された基材層と、
前記基材層に対して結合されたパワーエレクトロニクス・デバイスであって、該パワーエレクトロニクス・デバイスにより生成された熱は、少なくとも前記基材層と前記目標熱伝達層とを通して前記冷却板アセンブリ内の前記冷却流体に対して伝達されるというパワーエレクトロニクス・デバイスとを備える、パワーエレクトロニクス・モジュール。
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