ES2187280B1 - Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado. - Google Patents
Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado.Info
- Publication number
- ES2187280B1 ES2187280B1 ES200101499A ES200101499A ES2187280B1 ES 2187280 B1 ES2187280 B1 ES 2187280B1 ES 200101499 A ES200101499 A ES 200101499A ES 200101499 A ES200101499 A ES 200101499A ES 2187280 B1 ES2187280 B1 ES 2187280B1
- Authority
- ES
- Spain
- Prior art keywords
- metal substrate
- printed circuit
- refrigeration system
- circuit plate
- isolated metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Placa de circuito impreso con substrato metálico aislado con sistema de refrigeración integrado. Comprende un substrato metálico (10), al menos una capa eléctricamente aislante (11) adherida a dicho substrato metálico (10) y unas pistas electroconductoras (12) capaces de interconectar componentes electrónicos de potencia (24), adheridas a dicha capa eléctricamente aislante (11), incorporando dicho substrato metálico (10) unos canales de transporte de calor los cuales comprenden unas conducciones para un fluido caloportador, cuyas conducciones se extienden al exterior del substrato metálico hasta una zona de transferencia térmica a un medio externo.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES200101499A ES2187280B1 (es) | 2001-06-28 | 2001-06-28 | Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado. |
PCT/ES2002/000315 WO2003003520A2 (es) | 2001-06-28 | 2002-06-27 | Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado |
EP02743277A EP1408728B1 (en) | 2001-06-28 | 2002-06-27 | Printed circuit board with isolated metallic substrate comprising an integrated cooling system |
DE60202476T DE60202476T2 (de) | 2001-06-28 | 2002-06-27 | Leiterplatte mit einem isolierten metallischen substrat mit einem integrierten kühlsystem |
US10/707,634 US7119284B2 (en) | 2001-06-28 | 2003-12-26 | Printed circuit board with isolated metallic substrate comprising an integrated cooling system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES200101499A ES2187280B1 (es) | 2001-06-28 | 2001-06-28 | Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2187280A1 ES2187280A1 (es) | 2003-05-16 |
ES2187280B1 true ES2187280B1 (es) | 2004-08-16 |
Family
ID=8498211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES200101499A Withdrawn - After Issue ES2187280B1 (es) | 2001-06-28 | 2001-06-28 | Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado. |
Country Status (5)
Country | Link |
---|---|
US (1) | US7119284B2 (es) |
EP (1) | EP1408728B1 (es) |
DE (1) | DE60202476T2 (es) |
ES (1) | ES2187280B1 (es) |
WO (1) | WO2003003520A2 (es) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005010129A1 (de) * | 2004-03-05 | 2005-09-15 | Marquardt Gmbh | Elektrische Schaltungsanordnung für ein Elektrowerkzeug |
DE102005014513B4 (de) * | 2005-03-30 | 2011-05-12 | Att Advanced Temperature Test Systems Gmbh | Vorrichtung und Verfahren zum Temperieren eines Substrats, sowie Verfahren zur Herstellung der Vorrichtung |
US20060256533A1 (en) * | 2005-05-13 | 2006-11-16 | Lear Corporation | Thermally dissipating and power dispersing adhesively bonded metal-printed circuit board structure |
EP1761114A3 (en) | 2005-08-31 | 2009-09-16 | Kabushiki Kaisha Toyota Jidoshokki | Circuit board |
DE102005056046B4 (de) * | 2005-11-24 | 2008-04-17 | Siemens Ag | Zur Montage in einem Kraftfahrzeug zwischen zwei A-Säulen vorgesehenes Cockpit |
US7738249B2 (en) | 2007-10-25 | 2010-06-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
US7742307B2 (en) * | 2008-01-17 | 2010-06-22 | Raytheon Company | High performance power device |
WO2009149207A2 (en) | 2008-06-03 | 2009-12-10 | Bsst Llc | Thermoelectric heat pump |
US7898807B2 (en) * | 2009-03-09 | 2011-03-01 | General Electric Company | Methods for making millichannel substrate, and cooling device and apparatus using the substrate |
TW201036527A (en) * | 2009-03-19 | 2010-10-01 | Acbel Polytech Inc | Large-area liquid-cooled heat-dissipation device |
US8232637B2 (en) * | 2009-04-30 | 2012-07-31 | General Electric Company | Insulated metal substrates incorporating advanced cooling |
WO2010145074A1 (zh) * | 2009-06-17 | 2010-12-23 | 华为技术有限公司 | 散热装置和具有散热装置的射频模块 |
EP2354744B1 (en) * | 2010-01-20 | 2017-09-20 | ABB Technology Oy | Cooling element |
US8077460B1 (en) | 2010-07-19 | 2011-12-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same |
US8179676B2 (en) * | 2010-07-21 | 2012-05-15 | Telefonaktiebolaget L M Ericsson (Publ) | Optical interconnects in cooling substrates |
US8199505B2 (en) | 2010-09-13 | 2012-06-12 | Toyota Motor Engineering & Manufacturing Norh America, Inc. | Jet impingement heat exchanger apparatuses and power electronics modules |
US8659896B2 (en) | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
US8427832B2 (en) | 2011-01-05 | 2013-04-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
JP5848874B2 (ja) * | 2011-01-07 | 2016-01-27 | 日本発條株式会社 | 温度調節装置およびこの温度調節装置の製造方法 |
US8391008B2 (en) | 2011-02-17 | 2013-03-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics modules and power electronics module assemblies |
US8482919B2 (en) | 2011-04-11 | 2013-07-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics card assemblies, power electronics modules, and power electronics devices |
JP5409740B2 (ja) * | 2011-09-28 | 2014-02-05 | 日本発條株式会社 | 放熱構造体、パワーモジュール、放熱構造体の製造方法およびパワーモジュールの製造方法 |
CN103078518A (zh) * | 2011-10-26 | 2013-05-01 | 台达电子企业管理(上海)有限公司 | 一种散热装置 |
KR101388781B1 (ko) * | 2012-06-22 | 2014-04-23 | 삼성전기주식회사 | 전력 모듈용 방열 시스템 |
US8643173B1 (en) | 2013-01-04 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
US9686887B2 (en) * | 2014-09-15 | 2017-06-20 | Nicholas Michael D'Onofrio | Liquid cooled metal core printed circuit board |
DE102016218451A1 (de) | 2016-09-26 | 2018-03-29 | Siemens Aktiengesellschaft | Leistungselektronische Schaltung und Verfahren zu deren Herstellung |
FR3097077B1 (fr) * | 2019-06-04 | 2021-06-25 | Sodern | Module électronique |
DE102020107173A1 (de) | 2020-03-16 | 2021-09-16 | Bayerische Motoren Werke Aktiengesellschaft | Kühlungsanordnung für zumindest eine stromführende Komponente eines Kraftfahrzeugs |
CN113645799A (zh) * | 2020-04-27 | 2021-11-12 | 富泰华工业(深圳)有限公司 | 用于电子装置的散热结构及电子装置 |
US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4777561A (en) * | 1985-03-26 | 1988-10-11 | Hughes Aircraft Company | Electronic module with self-activated heat pipe |
GB2278676B (en) * | 1993-05-14 | 1997-05-07 | Furukawa Electric Co Ltd | Heat pipe type radiator and method for manufacturing same |
JPH0837389A (ja) * | 1994-07-22 | 1996-02-06 | Furukawa Electric Co Ltd:The | ヒートパイプ式放熱装置 |
US5875097A (en) * | 1997-06-09 | 1999-02-23 | Power Trends, Inc. | Heat sink for auxiliary circuit board |
US5929518A (en) * | 1997-07-20 | 1999-07-27 | Motorola, Inc. | Circuit board and method |
US6201701B1 (en) * | 1998-03-11 | 2001-03-13 | Kimball International, Inc. | Integrated substrate with enhanced thermal characteristics |
JP3082738B2 (ja) * | 1998-03-13 | 2000-08-28 | 日本電気株式会社 | 高効率液体冷却装置 |
TW430959B (en) * | 1998-04-22 | 2001-04-21 | World Wiser Electronics Inc | Thermal enhanced structure of printed circuit board |
TW388201B (en) * | 1998-04-22 | 2000-04-21 | World Wiser Electronics Inc | Method for producing thermal structure of printed circuit board |
DE19842590A1 (de) * | 1998-09-17 | 2000-04-13 | Daimler Chrysler Ag | Verfahren zur Herstellung von Schaltungsanordnungen |
US6219246B1 (en) * | 1999-07-02 | 2001-04-17 | Powerware Corporation | Heat sink apparatus |
US6212071B1 (en) * | 1999-08-20 | 2001-04-03 | Lucent Technologies, Inc. | Electrical circuit board heat dissipation system |
US6226178B1 (en) * | 1999-10-12 | 2001-05-01 | Dell Usa, L.P. | Apparatus for cooling a heat generating component in a computer |
-
2001
- 2001-06-28 ES ES200101499A patent/ES2187280B1/es not_active Withdrawn - After Issue
-
2002
- 2002-06-27 WO PCT/ES2002/000315 patent/WO2003003520A2/es not_active Application Discontinuation
- 2002-06-27 DE DE60202476T patent/DE60202476T2/de not_active Expired - Lifetime
- 2002-06-27 EP EP02743277A patent/EP1408728B1/en not_active Expired - Fee Related
-
2003
- 2003-12-26 US US10/707,634 patent/US7119284B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
BASE DE DATOS WPI en EPOQUE, semana 199615, Londres: Derwent Publications Ltd., AN 1996-148896 & JP 08-037389 A (THE FURUKAWA ELECTRIC CO LTD) 06.02.1996, resumen; figuras 1-6. * |
Also Published As
Publication number | Publication date |
---|---|
US20040188132A1 (en) | 2004-09-30 |
US7119284B2 (en) | 2006-10-10 |
EP1408728A2 (en) | 2004-04-14 |
DE60202476D1 (de) | 2005-02-03 |
WO2003003520A2 (es) | 2003-01-09 |
DE60202476T2 (de) | 2005-12-29 |
ES2187280A1 (es) | 2003-05-16 |
WO2003003520A3 (es) | 2003-03-13 |
EP1408728B1 (en) | 2004-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EC2A | Search report published |
Date of ref document: 20030516 Kind code of ref document: A1 |
|
FG2A | Definitive protection |
Ref document number: 2187280B1 Country of ref document: ES |
|
FA2A | Application withdrawn |
Effective date: 20050301 |