WO2003003520A3 - Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado - Google Patents

Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado Download PDF

Info

Publication number
WO2003003520A3
WO2003003520A3 PCT/ES2002/000315 ES0200315W WO03003520A3 WO 2003003520 A3 WO2003003520 A3 WO 2003003520A3 ES 0200315 W ES0200315 W ES 0200315W WO 03003520 A3 WO03003520 A3 WO 03003520A3
Authority
WO
WIPO (PCT)
Prior art keywords
metallic substrate
circuit board
printed circuit
cooling system
integrated cooling
Prior art date
Application number
PCT/ES2002/000315
Other languages
English (en)
French (fr)
Other versions
WO2003003520A2 (es
Inventor
Bel Carles Borrego
Foguet Xavier Sanchez
Sole Alex Subirats
Original Assignee
Lear Automotive Eeds Spain
Bel Carles Borrego
Foguet Xavier Sanchez
Sole Alex Subirats
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive Eeds Spain, Bel Carles Borrego, Foguet Xavier Sanchez, Sole Alex Subirats filed Critical Lear Automotive Eeds Spain
Priority to DE60202476T priority Critical patent/DE60202476T2/de
Priority to EP02743277A priority patent/EP1408728B1/en
Publication of WO2003003520A2 publication Critical patent/WO2003003520A2/es
Publication of WO2003003520A3 publication Critical patent/WO2003003520A3/es
Priority to US10/707,634 priority patent/US7119284B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer

Abstract

Comprende un substrato metálico (10), al menos una capa eléctricamente aislante (11) adherida a dicho substrato metálico (10) y unas pistas electroconductoras (12) capaces de interconectar componentes electrónicos de potencia (24), adheridas a dicha capa eléctricamente aislante (11), incorporando dicho substrato metálico (10) unos canales de transporte de calor los cuales comprenden unas conducciones para un fluido caloportador, cuyas conducciones se extienden al exterior del substrato metálico hasta una zona de transferencia térmica a un medio externo.
PCT/ES2002/000315 2001-06-28 2002-06-27 Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado WO2003003520A2 (es)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE60202476T DE60202476T2 (de) 2001-06-28 2002-06-27 Leiterplatte mit einem isolierten metallischen substrat mit einem integrierten kühlsystem
EP02743277A EP1408728B1 (en) 2001-06-28 2002-06-27 Printed circuit board with isolated metallic substrate comprising an integrated cooling system
US10/707,634 US7119284B2 (en) 2001-06-28 2003-12-26 Printed circuit board with isolated metallic substrate comprising an integrated cooling system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ES200101499A ES2187280B1 (es) 2001-06-28 2001-06-28 Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado.
ESP200101499 2001-06-28

Publications (2)

Publication Number Publication Date
WO2003003520A2 WO2003003520A2 (es) 2003-01-09
WO2003003520A3 true WO2003003520A3 (es) 2003-03-13

Family

ID=8498211

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/ES2002/000315 WO2003003520A2 (es) 2001-06-28 2002-06-27 Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado

Country Status (5)

Country Link
US (1) US7119284B2 (es)
EP (1) EP1408728B1 (es)
DE (1) DE60202476T2 (es)
ES (1) ES2187280B1 (es)
WO (1) WO2003003520A2 (es)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005010129A1 (de) * 2004-03-05 2005-09-15 Marquardt Gmbh Elektrische Schaltungsanordnung für ein Elektrowerkzeug
DE102005014513B4 (de) * 2005-03-30 2011-05-12 Att Advanced Temperature Test Systems Gmbh Vorrichtung und Verfahren zum Temperieren eines Substrats, sowie Verfahren zur Herstellung der Vorrichtung
US20060256533A1 (en) * 2005-05-13 2006-11-16 Lear Corporation Thermally dissipating and power dispersing adhesively bonded metal-printed circuit board structure
EP1761114A3 (en) * 2005-08-31 2009-09-16 Kabushiki Kaisha Toyota Jidoshokki Circuit board
DE102005056046B4 (de) * 2005-11-24 2008-04-17 Siemens Ag Zur Montage in einem Kraftfahrzeug zwischen zwei A-Säulen vorgesehenes Cockpit
US7738249B2 (en) * 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
US7742307B2 (en) * 2008-01-17 2010-06-22 Raytheon Company High performance power device
EP2315987A2 (en) 2008-06-03 2011-05-04 Bsst Llc Thermoelectric heat pump
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
US8232637B2 (en) * 2009-04-30 2012-07-31 General Electric Company Insulated metal substrates incorporating advanced cooling
EP2431701B1 (en) * 2009-06-17 2017-04-26 Huawei Technologies Co., Ltd. Heat dissipation device and radio frequency module with same
EP2354744B1 (en) * 2010-01-20 2017-09-20 ABB Technology Oy Cooling element
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8179676B2 (en) * 2010-07-21 2012-05-15 Telefonaktiebolaget L M Ericsson (Publ) Optical interconnects in cooling substrates
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
JP5848874B2 (ja) * 2011-01-07 2016-01-27 日本発條株式会社 温度調節装置およびこの温度調節装置の製造方法
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
JP5409740B2 (ja) * 2011-09-28 2014-02-05 日本発條株式会社 放熱構造体、パワーモジュール、放熱構造体の製造方法およびパワーモジュールの製造方法
CN103078518A (zh) * 2011-10-26 2013-05-01 台达电子企业管理（上海）有限公司 一种散热装置
KR101388781B1 (ko) * 2012-06-22 2014-04-23 삼성전기주식회사 전력 모듈용 방열 시스템
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
WO2016044246A1 (en) * 2014-09-15 2016-03-24 D Onofrio Nicholas Michael Liquid cooled metal core printed circuit board
DE102016218451A1 (de) 2016-09-26 2018-03-29 Siemens Aktiengesellschaft Leistungselektronische Schaltung und Verfahren zu deren Herstellung
FR3097077B1 (fr) * 2019-06-04 2021-06-25 Sodern Module électronique
DE102020107173A1 (de) 2020-03-16 2021-09-16 Bayerische Motoren Werke Aktiengesellschaft Kühlungsanordnung für zumindest eine stromführende Komponente eines Kraftfahrzeugs
CN113645799A (zh) * 2020-04-27 2021-11-12 富泰华工业（深圳）有限公司 用于电子装置的散热结构及电子装置
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES8801720A1 (es) * 1985-03-26 1987-08-01 Hughes Aircraft Co Un modulo electronico para uso en una estructura de montaje que tiene un disipador de calor asciado con la misma
GB2278676A (en) * 1993-05-14 1994-12-07 Furukawa Electric Co Ltd Cooling electronic apparatus
JPH0837389A (ja) * 1994-07-22 1996-02-06 Furukawa Electric Co Ltd:The ヒートパイプ式放熱装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5875097A (en) * 1997-06-09 1999-02-23 Power Trends, Inc. Heat sink for auxiliary circuit board
US5929518A (en) * 1997-07-20 1999-07-27 Motorola, Inc. Circuit board and method
US6201701B1 (en) * 1998-03-11 2001-03-13 Kimball International, Inc. Integrated substrate with enhanced thermal characteristics
JP3082738B2 (ja) * 1998-03-13 2000-08-28 日本電気株式会社 高効率液体冷却装置
TW388201B (en) * 1998-04-22 2000-04-21 World Wiser Electronics Inc Method for producing thermal structure of printed circuit board
TW430959B (en) * 1998-04-22 2001-04-21 World Wiser Electronics Inc Thermal enhanced structure of printed circuit board
DE19842590A1 (de) * 1998-09-17 2000-04-13 Daimler Chrysler Ag Verfahren zur Herstellung von Schaltungsanordnungen
US6219246B1 (en) * 1999-07-02 2001-04-17 Powerware Corporation Heat sink apparatus
US6212071B1 (en) * 1999-08-20 2001-04-03 Lucent Technologies, Inc. Electrical circuit board heat dissipation system
US6226178B1 (en) * 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES8801720A1 (es) * 1985-03-26 1987-08-01 Hughes Aircraft Co Un modulo electronico para uso en una estructura de montaje que tiene un disipador de calor asciado con la misma
GB2278676A (en) * 1993-05-14 1994-12-07 Furukawa Electric Co Ltd Cooling electronic apparatus
JPH0837389A (ja) * 1994-07-22 1996-02-06 Furukawa Electric Co Ltd:The ヒートパイプ式放熱装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 199615, Derwent World Patents Index; AN 1996-148896, XP002971282 *

Also Published As

Publication number Publication date
DE60202476T2 (de) 2005-12-29
US7119284B2 (en) 2006-10-10
EP1408728B1 (en) 2004-12-29
US20040188132A1 (en) 2004-09-30
ES2187280A1 (es) 2003-05-16
WO2003003520A2 (es) 2003-01-09
EP1408728A2 (en) 2004-04-14
ES2187280B1 (es) 2004-08-16
DE60202476D1 (de) 2005-02-03

Similar Documents

Publication Publication Date Title
WO2003003520A3 (es) Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado
US7872876B2 (en) Multi-layered printed circuit board
EP1599081A3 (en) Thermal management system and method for electronic equipment mounted on coldplates
WO2005038910A3 (en) Three-dimensional integrated circuit with integrated heat sinks
EP1781076A3 (en) Electronic assembly having multiple side cooling and method
WO2002049104A3 (de) Leistungsmodul mit verbessertem transienten wärmewiderstand
WO2002102124A3 (en) Single or dual buss thermal transfer system
TW200802744A (en) Electronic component module
HK1041402A1 (en) Substrate of circuit board.
EP1393369A4 (en) HIGH PERFORMANCE THERMAL WELL FOR PRINTED CIRCUIT BOARDS
WO2001084898A3 (de) Eine elektronische steuerbaugruppe für ein fahrzeug
EP1615488A3 (fr) Assemblage électronique à drain thermique notamment pour module de commande de lampe à décharge de projecteurs de véhicule automobile
WO2005104231A3 (en) Multi-substrate circuit assembly
DE60212957D1 (de) Integrierte kühlung einer leiterplattenstruktur
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
CA2355037A1 (en) Circuit board assembly with heat sinking
CA2290802A1 (fr) Composant electronique de puissance comportant des moyens de refroidissement
EP1395103A3 (en) PCB Heatsink
US20100020505A1 (en) Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution
EP1289011A3 (de) Schalt- oder Steuergerät
US6206708B1 (en) Through via plate electrical connector and method of manufacture thereof
EP1253636A4 (en) ELECTRONIC EQUIPMENT
EP1037518A3 (en) Heat sink for printed circuit board
EP1192842A1 (en) A method and an arrangement for the electrical contact of components
TW200512900A (en) High heat dissipation chip module and substrate thereof

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

WWE Wipo information: entry into national phase

Ref document number: 2002743277

Country of ref document: EP

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWP Wipo information: published in national office

Ref document number: 2002743277

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2004115628

Country of ref document: RU

Kind code of ref document: A

WWG Wipo information: grant in national office

Ref document number: 2002743277

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP