FR3097077B1 - Module électronique - Google Patents

Module électronique Download PDF

Info

Publication number
FR3097077B1
FR3097077B1 FR1905911A FR1905911A FR3097077B1 FR 3097077 B1 FR3097077 B1 FR 3097077B1 FR 1905911 A FR1905911 A FR 1905911A FR 1905911 A FR1905911 A FR 1905911A FR 3097077 B1 FR3097077 B1 FR 3097077B1
Authority
FR
France
Prior art keywords
heat pipe
plate
pipe
hermetic enclosure
electronic module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1905911A
Other languages
English (en)
Other versions
FR3097077A1 (fr
Inventor
Pascal Pranyies
Philippe Daniaud
Francis Descours
Isabelle Toubhans
Franck Pecal
Charlie Koechlin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SODERN SA
Original Assignee
SODERN SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SODERN SA filed Critical SODERN SA
Priority to FR1905911A priority Critical patent/FR3097077B1/fr
Publication of FR3097077A1 publication Critical patent/FR3097077A1/fr
Application granted granted Critical
Publication of FR3097077B1 publication Critical patent/FR3097077B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Module électronique comprenant des composants électroniques (10a, 10b) montés sur une platine (1) en matériau céramique. La platine (1) est équipée d’un caloduc formé par une structure capillaire et une enceinte hermétique renfermant un fluide sous forme liquide en équilibre avec sa phase gazeuse. Au moins un conduit (4, 4a, 4b) est formé dans l'épaisseur du corps (2) de la platine et débouche sur au moins une face (5) de ce corps par un premier orifice (60), ce conduit délimitant en partie l'enceinte hermétique du caloduc et formant une zone d'absorption thermique du caloduc. Au moins une conduite métallique (34), extérieure à la platine (1), est raccordée au conduit au niveau du premier orifice (60), de manière étanche et par l'intermédiaire d'un raccord métallique (50), cette conduite métallique (34) délimitant en partie l'enceinte hermétique du caloduc et formant la zone de dissipation thermique du caloduc. Figure 1
FR1905911A 2019-06-04 2019-06-04 Module électronique Active FR3097077B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1905911A FR3097077B1 (fr) 2019-06-04 2019-06-04 Module électronique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1905911A FR3097077B1 (fr) 2019-06-04 2019-06-04 Module électronique
FR1905911 2019-06-04

Publications (2)

Publication Number Publication Date
FR3097077A1 FR3097077A1 (fr) 2020-12-11
FR3097077B1 true FR3097077B1 (fr) 2021-06-25

Family

ID=68138377

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1905911A Active FR3097077B1 (fr) 2019-06-04 2019-06-04 Module électronique

Country Status (1)

Country Link
FR (1) FR3097077B1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2187280B1 (es) * 2001-06-28 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado.
WO2014157147A1 (fr) * 2013-03-27 2014-10-02 古河電気工業株式会社 Appareil de refroidissement
TWI588439B (zh) * 2015-05-25 2017-06-21 訊凱國際股份有限公司 立體導熱結構及其製法
CN107278089B (zh) * 2016-04-07 2019-07-19 讯凯国际股份有限公司 热导结构
US10288356B2 (en) * 2016-10-14 2019-05-14 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure and combining method thereof

Also Published As

Publication number Publication date
FR3097077A1 (fr) 2020-12-11

Similar Documents

Publication Publication Date Title
Fortuna et al. Frequency response of the boundary layer on wall transfer probes
Mehmood et al. The effect of slip condition on unsteady MHD oscillatory flow of a viscous fluid in a planer channel
Conley et al. Ventilated oscillatory boundary layers
Pera et al. Laminar plume interactions
Chen et al. Theoretical study on impingement heat transfer with single-phase free-surface slot jets
US20070251487A1 (en) Light-Metal Piston Having Heat Pipes
FI20065558A (fi) Optinen virtauskenno, jota voidaan käyttää korkean lämpötilan ja korkean paineen olosuhteissa
Saito et al. Soot suppression by acoustic oscillated combustion
FR3097077B1 (fr) Module électronique
Kneer et al. Flow structures and heat transfer in submerged and free laminar jets
JPS6193914A (ja) 超音波式流体流量測定方法および装置
Sodjavi et al. Passive control of wall shear stress and mass transfer generated by submerged lobed impinging jet
CN110173382A (zh) 一种用于燃烧弹中喷雾燃烧实验的喷油器冷却系统
Abdrashitov et al. Nozzle length effect on the performance of the jet-driven Helmholtz oscillator
JPS6039798Y2 (ja) 圧力測定装置
KR920012509A (ko) 내면이 세라믹 피복된 소둔가열로용 방열튜브
CN110413937B (zh) 一种铝熔体复合除气装置中超声换能器的冷却系统的换热功率校正计算及修正方法
CN108347866A (zh) 一种散热板
CN216246890U (zh) 一种黏度传感器
Pai et al. Film boiling of liquid nitrogen from porous surfaces with vapor suction: Experimental extensions
Gabdrakhmanov et al. Experimental investigation of thermo-oscillatory convection
Fang et al. Experimental study on the effect of synthetic jets on flow boiling heat transfer in microchannels
Steinruck Upstream travelling waves in the boundary layer of a horizontal mixed convection flow
Schmid et al. Ultrasonic suction pump at vapour pressure for condensate return in a vibrating heat pipe
Wang et al. INVESTIGATION OF MODIFIED SWEEPING JET FILM COOLING ON TURBINE VANE

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20201211

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5