AU2002211325A1 - Microfluidic devices for heat transfer - Google Patents

Microfluidic devices for heat transfer

Info

Publication number
AU2002211325A1
AU2002211325A1 AU2002211325A AU1132502A AU2002211325A1 AU 2002211325 A1 AU2002211325 A1 AU 2002211325A1 AU 2002211325 A AU2002211325 A AU 2002211325A AU 1132502 A AU1132502 A AU 1132502A AU 2002211325 A1 AU2002211325 A1 AU 2002211325A1
Authority
AU
Australia
Prior art keywords
heat
heat transfer
microfluidic
microfluidic devices
systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002211325A
Inventor
Eugene Dantsker
Stephen D. O'connor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanostream Inc
Original Assignee
Nanostream Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanostream Inc filed Critical Nanostream Inc
Publication of AU2002211325A1 publication Critical patent/AU2002211325A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406—Reducing the influence of the temperature
    • G11B33/1413—Reducing the influence of the temperature by fluid cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In accordance with the present invention there is provided a microfluidic heat exchange system for cooling heat-generating components of electronic equipment, computers, lasers, analytical instruments, medical equipment and the like. Both direct contact and indirect contact microfluidic systems are described. Also described are microfluidic systems that incorporate remote heat rejection systems that may be located outside the body of the equipment that contains the heat generating components that need cooling.
AU2002211325A 2000-09-29 2001-09-28 Microfluidic devices for heat transfer Abandoned AU2002211325A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23683800P 2000-09-29 2000-09-29
US60236838 2000-09-29
PCT/US2001/030659 WO2002028160A2 (en) 2000-09-29 2001-09-28 Microfluidic devices for heat transfer

Publications (1)

Publication Number Publication Date
AU2002211325A1 true AU2002211325A1 (en) 2002-04-08

Family

ID=22891178

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211325A Abandoned AU2002211325A1 (en) 2000-09-29 2001-09-28 Microfluidic devices for heat transfer

Country Status (6)

Country Link
US (1) US6501654B2 (en)
EP (1) EP1321015B1 (en)
AT (1) ATE267507T1 (en)
AU (1) AU2002211325A1 (en)
DE (1) DE60103415D1 (en)
WO (1) WO2002028160A2 (en)

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Also Published As

Publication number Publication date
ATE267507T1 (en) 2004-06-15
WO2002028160A3 (en) 2002-06-27
EP1321015A2 (en) 2003-06-25
WO2002028160A2 (en) 2002-04-04
EP1321015B1 (en) 2004-05-19
US20020039280A1 (en) 2002-04-04
US6501654B2 (en) 2002-12-31
DE60103415D1 (en) 2004-06-24

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