AU2001262761A1 - Computer having cooling apparatus and heat exchanging device of the cooling apparatus - Google Patents

Computer having cooling apparatus and heat exchanging device of the cooling apparatus

Info

Publication number
AU2001262761A1
AU2001262761A1 AU2001262761A AU6276101A AU2001262761A1 AU 2001262761 A1 AU2001262761 A1 AU 2001262761A1 AU 2001262761 A AU2001262761 A AU 2001262761A AU 6276101 A AU6276101 A AU 6276101A AU 2001262761 A1 AU2001262761 A1 AU 2001262761A1
Authority
AU
Australia
Prior art keywords
cooling apparatus
computer
heat exchanging
exchanging device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001262761A
Inventor
Ki-Oan Cheon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KI OAN CHEON
Original Assignee
KI OAN CHEON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/579,282 external-priority patent/US6313990B1/en
Priority claimed from KR10-2001-0028477A external-priority patent/KR100403966B1/en
Application filed by KI OAN CHEON filed Critical KI OAN CHEON
Publication of AU2001262761A1 publication Critical patent/AU2001262761A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2001262761A 2000-05-25 2001-05-24 Computer having cooling apparatus and heat exchanging device of the cooling apparatus Abandoned AU2001262761A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US09579282 2000-05-25
US09/579,282 US6313990B1 (en) 2000-05-25 2000-05-25 Cooling apparatus for electronic devices
KR1020000064009A KR20010000940A (en) 2000-05-25 2000-10-30 Computer having cooling apparatus and heat exchanging device of the cooling apparatus
KR0064009 2000-10-30
KR10-2001-0028477A KR100403966B1 (en) 2000-05-25 2001-05-23 Computer having cooling apparatus and heat exchanging device of the cooling apparatus
KR0128477 2001-05-23
PCT/KR2001/000861 WO2001090867A1 (en) 2000-05-25 2001-05-24 Computer having cooling apparatus and heat exchanging device of the cooling apparatus

Publications (1)

Publication Number Publication Date
AU2001262761A1 true AU2001262761A1 (en) 2001-12-03

Family

ID=27350350

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001262761A Abandoned AU2001262761A1 (en) 2000-05-25 2001-05-24 Computer having cooling apparatus and heat exchanging device of the cooling apparatus

Country Status (3)

Country Link
EP (1) EP1305700A1 (en)
AU (1) AU2001262761A1 (en)
WO (1) WO2001090867A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10334798B4 (en) * 2003-07-30 2005-06-23 Fujitsu Siemens Computers Gmbh Arrangement for cooling heat-generating computer components
US20050189096A1 (en) * 2004-02-26 2005-09-01 Wilson Michael J. Compact radiator for an electronic device
US20070184320A1 (en) * 2004-06-24 2007-08-09 Jean-Paul Domen Cooling devices for various applications
DE102004042034A1 (en) * 2004-08-26 2006-03-16 Laing, Oliver An electrical device power supply device and method for providing electrical power to components of an electrical device
DE102004043398A1 (en) * 2004-09-03 2006-06-22 Laing, Oliver Cooling assembly e.g. for electrical appliance like PC, has several heat sources, and electrical appliance provided with electric power supply unit encompassing heat source
US20060213645A1 (en) * 2005-03-24 2006-09-28 Wintersteen Douglas C Integral liquid cooling unit for a computer
JP4781929B2 (en) * 2006-07-25 2011-09-28 富士通株式会社 Electronics
DE102010032899A1 (en) * 2010-07-30 2012-02-02 Valeo Klimasysteme Gmbh Cooling device for a vehicle battery and vehicle battery assembly with such a cooling device
JP5991088B2 (en) * 2012-08-31 2016-09-14 富士通株式会社 Power supply control apparatus, information processing apparatus, and power supply control method
US10993353B2 (en) 2014-09-29 2021-04-27 Hewlett Packard Enterprise Development Lp Fan controlled ambient air cooling of equipment in a controlled airflow environment
CN110647226B (en) * 2019-10-08 2020-12-08 周川 Reinforced water-cooling computer cooling equipment
CN113835495B (en) * 2020-06-23 2024-02-20 聊城市德通交通器材制造有限公司 Water-cooling radiator with good circulation effect and radiating method
CN111770665A (en) * 2020-06-28 2020-10-13 广德姑苏线路板有限公司 Assembled electronic efficient radiator
CN113437450B (en) * 2021-07-13 2022-06-10 深圳市华天通科技有限公司 Multicore cell-phone lithium cell
CN114364219B (en) * 2021-12-30 2022-12-06 博能传动(苏州)有限公司 Servo driver
CN115951768A (en) * 2023-02-21 2023-04-11 西安翎飞鸾信息科技有限公司 Computer water-cooling heat abstractor
CN116867166B (en) * 2023-09-04 2023-11-24 福建宝锋电子有限公司 Heat abstractor and communication equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355942A (en) * 1991-08-26 1994-10-18 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
KR0177918B1 (en) * 1996-02-26 1999-05-15 이상철 Cooling device for electronic equipment
KR200183325Y1 (en) * 2000-01-07 2000-05-15 권철신 Personal Computer Cooling System using Semi-Conductor Heat Exchange

Also Published As

Publication number Publication date
WO2001090867A1 (en) 2001-11-29
EP1305700A1 (en) 2003-05-02

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