AU2002252808A1 - Conduited heat dissipation device - Google Patents

Conduited heat dissipation device

Info

Publication number
AU2002252808A1
AU2002252808A1 AU2002252808A AU5280802A AU2002252808A1 AU 2002252808 A1 AU2002252808 A1 AU 2002252808A1 AU 2002252808 A AU2002252808 A AU 2002252808A AU 5280802 A AU5280802 A AU 5280802A AU 2002252808 A1 AU2002252808 A1 AU 2002252808A1
Authority
AU
Australia
Prior art keywords
conduited
heat dissipation
dissipation device
heat
dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002252808A
Inventor
Terrace J. Dishongh
Prateek Dujari
Bin Lian
Damion T. Searls
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2002252808A1 publication Critical patent/AU2002252808A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2002252808A 2000-12-05 2001-11-06 Conduited heat dissipation device Abandoned AU2002252808A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/730,629 2000-12-05
US09/730,629 US20020067596A1 (en) 2000-12-05 2000-12-05 Conduited heat dissipation device
PCT/US2001/044163 WO2002047451A2 (en) 2000-12-05 2001-11-06 Conduited heat dissipation device

Publications (1)

Publication Number Publication Date
AU2002252808A1 true AU2002252808A1 (en) 2002-06-18

Family

ID=24936123

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002252808A Abandoned AU2002252808A1 (en) 2000-12-05 2001-11-06 Conduited heat dissipation device

Country Status (3)

Country Link
US (1) US20020067596A1 (en)
AU (1) AU2002252808A1 (en)
WO (1) WO2002047451A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2800705Y (en) * 2005-05-29 2006-07-26 富准精密工业(深圳)有限公司 Protective cover and heat radiator with same
US7414840B1 (en) * 2007-02-06 2008-08-19 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273657A (en) * 1988-09-09 1990-03-13 Hitachi Ltd Radial flow heat sink and semiconductor cooler using the same
JP3069819B2 (en) * 1992-05-28 2000-07-24 富士通株式会社 Heat sink, heat sink fixture used for the heat sink, and portable electronic device using the heat sink
TW314223U (en) * 1995-11-06 1997-08-21 Nippon Keiki Works Co Ltd Cooling radiator
US5579827A (en) * 1995-11-13 1996-12-03 Us Micro Lab, Inc. Heat sink arrangement for central processing unit
US5896917A (en) * 1996-02-22 1999-04-27 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
JPH10154889A (en) * 1996-11-25 1998-06-09 Yaskawa Electric Corp Cooling device

Also Published As

Publication number Publication date
US20020067596A1 (en) 2002-06-06
WO2002047451A2 (en) 2002-06-13
WO2002047451A3 (en) 2003-01-30

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