AU1177901A - Heat transfer apparatus using refrigerant and computer having the same - Google Patents

Heat transfer apparatus using refrigerant and computer having the same

Info

Publication number
AU1177901A
AU1177901A AU11779/01A AU1177901A AU1177901A AU 1177901 A AU1177901 A AU 1177901A AU 11779/01 A AU11779/01 A AU 11779/01A AU 1177901 A AU1177901 A AU 1177901A AU 1177901 A AU1177901 A AU 1177901A
Authority
AU
Australia
Prior art keywords
refrigerant
computer
same
heat transfer
transfer apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU11779/01A
Inventor
Kwang-Soon Lee
Mok-Hyoung Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MOK HYOUNG LEE
Original Assignee
MOK HYOUNG LEE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019990049284A external-priority patent/KR20010045825A/en
Priority claimed from KR1020000008211A external-priority patent/KR20010083711A/en
Application filed by MOK HYOUNG LEE filed Critical MOK HYOUNG LEE
Publication of AU1177901A publication Critical patent/AU1177901A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406—Reducing the influence of the temperature
    • G11B33/1413—Reducing the influence of the temperature by fluid cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU11779/01A 1999-11-08 2000-11-08 Heat transfer apparatus using refrigerant and computer having the same Abandoned AU1177901A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR9949284 1999-11-08
KR1019990049284A KR20010045825A (en) 1999-11-08 1999-11-08 Heat transfer device for using refrigerant
KR008211 2000-02-21
KR1020000008211A KR20010083711A (en) 2000-02-21 2000-02-21 Case of hard disk drive
PCT/KR2000/001277 WO2001035199A1 (en) 1999-11-08 2000-11-08 Heat transfer apparatus using refrigerant and computer having the same

Publications (1)

Publication Number Publication Date
AU1177901A true AU1177901A (en) 2001-06-06

Family

ID=26636297

Family Applications (1)

Application Number Title Priority Date Filing Date
AU11779/01A Abandoned AU1177901A (en) 1999-11-08 2000-11-08 Heat transfer apparatus using refrigerant and computer having the same

Country Status (3)

Country Link
KR (1) KR20020053838A (en)
AU (1) AU1177901A (en)
WO (1) WO2001035199A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100492706B1 (en) * 2002-10-10 2005-06-07 주식회사 에이팩 Cooling means of server
US6867985B2 (en) 2003-02-11 2005-03-15 Microsoft Corporation Computer system with noiseless cooling
DE20314532U1 (en) * 2003-09-16 2004-02-19 Pries, Wulf H. Device for dissipating heat from electronic and electrical components
DE102004031251B4 (en) * 2004-06-29 2007-03-22 Sebastian Jaksch Device for liquid cooling of microprocessors in computer systems
KR102154102B1 (en) * 2020-08-06 2020-09-09 지스타기어(주) Water storage device for cpu cooling
WO2023239064A1 (en) * 2022-06-10 2023-12-14 삼성전자주식회사 Frame structure and electronic device including same
CN117293104B (en) * 2023-11-27 2024-03-22 贵州芯际探索科技有限公司 SIC device heat dissipation packaging structure and packaging method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JP3017837B2 (en) * 1991-05-31 2000-03-13 株式会社日立製作所 Electronic equipment
KR20000052197A (en) * 1999-01-30 2000-08-16 구자홍 Apparatus for cooling chip of computer

Also Published As

Publication number Publication date
WO2001035199A1 (en) 2001-05-17
KR20020053838A (en) 2002-07-05

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase