KR20010045825A - Heat transfer device for using refrigerant - Google Patents

Abstract

PURPOSE: A heat transfer device is provided to smooth circulation of coolant, enable a heat absorption container to be installed irrespective of arrangement of heat discharge parts, and apply heat transfer parts to a computer system so that it can enhance a cooling efficiency and reduce mechanical noises. CONSTITUTION: The system comprises a heat absorption container(13), a heat discharge container(14), the first pipeline(15) and the second pipeline(16). The heat absorption container(13) absorbs the heat generated from heated area in the computer system. The heat discharge container(14), installed at a higher position than the heat absorption container(13), discharges the heat absorbed from the container(13). The first pipeline(15) and the second pipeline(16), connected between the heat absorption container(13) and the heat discharge container(14), forms closed space filled with the coolant. The coolant flows in one direction by installing a check valve in the pipelines(15,16).

Description

Heat transfer device using refrigerant {HEAT TRANSFER DEVICE FOR USING REFRIGERANT}

The present invention relates to a heat transfer device between two locations having a temperature difference (for example, a CPU or a hard disk drive (HDD) such as a built-in personal computer and an external device), and more specifically, mechanical operation. It relates to a heat transfer device that can eliminate the noise caused by.

In general, in the case of devices or devices embedded in a computer such as a PC, particularly a CPU or an HDD, a lot of heat is generated as the capacity and speed are gradually increased. If the temperature of the CPU or HDD rises due to such heat generation, its function may deteriorate or malfunction, resulting in a shortened lifespan. In order to cool such an element or a device, a cooling device using a cooling fan and a heat radiation fin is used.

In other words, in the case of the CPU, when the heat dissipation fin (Fin) and the cooling fan is installed on the heat dissipation surface of the CPU, and the cooling fan is driven, the heat generated by the CPU is discharged while air flows around each heat dissipation fin to prevent the CPU from overheating. Will be prevented. In addition, the back of the computer main body is equipped with another blowing fan (fan), which blows the air inside the main body case to the outside to allow the fresh air to enter the inside to circulate the air in the computer Let's do it. This air circulation suppresses the heat generated in the device and the device from being transferred to the outside and the internal temperature rising.

However, such a cooling device generates noise due to the driving of the cooling fan and the blowing fan. Attempts were made to minimize this noise but were not satisfactory. In addition, while exhausting the air inside the main body case and the outside air is introduced, dust or moisture may be introduced together in the case. This moisture and dust can adversely affect the devices and devices built into the computer.

Therefore, the present inventors do not use mechanical cooling and air circulation means such as a cooling fan, a blowing fan, etc. to solve the problems mentioned above, there is no mechanical operation, low noise, low probability of mechanical failure We proposed a cooling device that does not require extra power consumption and found that it has a very good effect.

The concept thereof will be described with reference to FIGS. 1 to 3. As shown in FIG. 1, the cooling device includes an endothermic container 2 attached to an element or device, for example, a heat generating surface of the CPU 1, and a heat dissipation container 3 for dissipating heat to the outside of the computer. It consists of.

The inside of the endothermic container 2 and the inside of the heat dissipating container 3 communicate with each other by the first conduit 4 and the second conduit 5 to form a sealed space, and the refrigerant is accommodated in the sealed space. The heat absorbing container 2 and the heat radiating container 3 are circulated. The heat dissipation fin 6 is attached to one side of the heat dissipation container 3.

According to this configuration, when heat is generated in the CPU 1, the liquid refrigerant stored in the endothermic container 2 absorbs heat, and the heat absorbed refrigerant becomes a gaseous state in the liquid state so that the first conduit 5 It will flow to the heat dissipation container (3) through. The gaseous refrigerant flowed into the heat dissipation container 3 transfers heat to the outside through the heat dissipation fins 6, thereby becoming liquid again, and absorbs heat again through the second conduit 5 at the bottom in the heat dissipation container 3. Return to the container (2).

Therefore, the refrigerant is evaporated in the endothermic container 2 and flows into the heat dissipation container 3, and the refrigerant is repeatedly liquefied in the heat dissipating container 3 and flows into the endothermic container 2 again. The CPU 1 can be cooled without using it.

In such a refrigerant circulation cooling device, the cooling efficiency is increased only when the refrigerant is circulated smoothly. To this end, the heat dissipation container 3 should be installed higher than the heat absorbing container 2, and the connection position of the heat absorbing container 2 and the first conduit 4 is a place where vaporized refrigerant is discharged, so as to be in a high gas state. The coolant in the first pipe (4) is such that the liquid coolant flows through the second pipe (5) well.

However, to set the position of the outlet 7 of the endothermic container 2 connected to the first conduit 4 as high as shown in FIG. 2, the endothermic container 2 may be raised, but the CPU always heats up to attach the endothermic container. The face should face laterally. On the other hand, if the height difference is not large between the outlet 7 connected to the first pipe and the suction port connected to the second pipe, it is difficult to start the circulation because the refrigerant pressure applied to the first pipe and the second pipe when the computer starts up is the same.

Therefore, as shown in FIG. 3, it has been proposed to form the connection portion of the first conduit 4 on the top surface of the endothermic container 2, but in this case, the first conduit 2 and the endothermic container 2 are connected. Since the endothermic container 2 must be thickened or the protrusion 8 must be formed at the connection site as shown in order to ensure the tight airtightness of the site, the total height of the endothermic container 2 also becomes thicker. In addition, in the case where the first conduit 4 is provided on the upper surface of the endothermic container 2, for example, the CPU 1 is provided on the bottom of the substrate (not shown), so that the heat dissipation surface of the CPU 1 It may not be possible to install the endothermic container, depending on the installation state of the device or device.

Thus, the circulation of the refrigerant can be surely performed at any time, and the endothermic container can be attached regardless of where the heat dissipating surface (that is, the side to which the endothermic container is attached) of the heat generating element is directed-that is, the orientation. Development of a cooling system, ie a heat transfer system, is required.

On the other hand, by using the refrigerant circulation cooling device does not use the conventional cooling fan and blowing fan, there is an advantage to eliminate the mechanical noise of the cooling fan and blowing fan, and to reduce the separate power consumption, but HDD Still other noises generated by the drive motors operating the devices, such as, have not yet been addressed, which has not completely solved the realization of computer noise reduction.

The present invention is to solve the above problems, it is to provide a heat transfer device that can smoothly circulate the refrigerant, and can attach the endothermic container irrespective of the orientation of the heat generating parts.

Another object of the present invention is to provide a heat transfer apparatus having a heat dissipation container having excellent heat dissipation effect.

Another object of the present invention is to provide a computer cooling device and a low noise computer in which a heat transfer device is applied to a computer to reduce mechanical noise in the computer to the maximum, thereby realizing low noise of the computer.

1 is a perspective view showing a conventional cooling device.

FIG. 2 is an enlarged sectional view taken along the line II-II of FIG. 1. FIG.

3 is a cross-sectional view of another conventional example.

Figure 4 is a schematic view showing a cooling apparatus according to an embodiment of the present invention.

5 is an enlarged cross-sectional structural view of the CPU cooling device of FIG.

6 is a cross-sectional view taken along the line VI-VI of FIG. 5.

Figure 7a) (b) is an enlarged cross-sectional view of the main portion of Figure 6 showing the operating state of the refrigerant backflow prevention device in the cooling device according to the present invention.

Figure 8 is a perspective view of the pipe member in the non-return means of Figure 7;

9 is a schematic view showing a cooling apparatus according to another embodiment of the present invention.

10 is a schematic view showing a cooling apparatus according to another embodiment of the present invention.

Figure 11 is a cross-sectional view showing a cooling device of the HDD according to an embodiment of the present invention.

12 is an exploded perspective view of FIG. 11;

13 is a block diagram showing a bridge system for cooling a plurality of heating elements according to an embodiment of the present invention

14 is a block diagram illustrating a system for cooling a plurality of heating elements according to an embodiment of the present invention.

<Explanation of symbols for main parts of drawing>

11: CPU 12: HDD

13: endothermic container 14: heat dissipation container

15,16: first and second main line 15a, 16a: first and second main line

15b, 16b: first and second branch pipe 17: blocking plate

18: computer body case 18a: heat dissipation hole

19: heat sink 19a: notch groove

20: spacer 21: socket

21a: mounting hole 21b: through hole

22: pipe fitting member 22a: center hole

23: flange portion 24: head portion

24a: opening 25: body

26 packing 27 oscillator

31,32: upper and lower sound insulation case 31a: projection

32a: insertion groove 32b: through hole

32c: home

The object of the present invention is to provide a heat transfer device for transferring heat at a place where heat is generated to another place having a low temperature,

An endothermic container installed to absorb heat from a heat generating place,

A heat dissipation container installed at least at a position higher than the endothermic container and dissipating heat;

A first pipe line and a second pipe line communicating between the endothermic container and the heat dissipation container;

The endothermic container, the heat dissipation container, the first conduit, and the second conduit form an enclosed space, and refrigerant is injected into the enclosed space.

The path through which the refrigerant flows is achieved by a heat transfer device, characterized in that the backflow prevention device is provided so that the refrigerant flows only in one direction.

Further, according to another aspect of the present invention, a cooling system having a heat transfer device for cooling a plurality of heat generating parts,

The endothermic container of the heat transfer device is attached to the heat dissipation surface of any one heat generating component,

A heat transfer plate is attached to the heat dissipation surface of other heat generating parts.

A cooling system is provided between the heat transfer plate and the heat absorbing container.

In addition, according to another aspect of the present invention, as a hard disk drive to which a heat transfer device can be attached,

The heat absorbing container 13 of the heat transfer device is wrapped around the entire device is installed, the inner surface is formed of the upper, lower sound-proof case (31) (32) having a soundproof film, any of the upper, lower sound-proof case (31, 32) Hard disk, characterized in that it comprises an electrical connection port of the device and a through hole (32b) through which the first and second conduits (15, 16) of the endothermic container (13) can pass. Drive is provided.

Hereinafter, preferred embodiments of the present invention will be described in detail by the accompanying drawings.

4 is an example in which the heat transfer device according to an embodiment of the present invention is applied as a cooling device of a computer, the cooling device being applied to elements or devices in the computer, for example, the heat dissipation surface of the CPU 11 or the HDD 12. And a heat absorbing container (13) for absorbing heat generated from the CPU (11) or the HDD (12), and a heat dissipation container (14) for dissipating heat transferred from the CPU (11) or the HDD (12).

The heat absorbing container 13 and the heat dissipating container 14 are connected in a sealed state by the first conduit 15 and the second conduit 16, respectively. The endothermic container 13 contains a liquid refrigerant. When the refrigerant absorbs the heat generated from the device or the device, the refrigerant is in a gaseous state and flows through the first conduit 15 to the heat dissipation container 14, and when the heat is dissipated from the heat dissipation container 14, the liquid again. A state is circulated by returning to the endothermic container 13 through the second conduit 16.

Therefore, in order to smoothly circulate the refrigerant, the heat dissipation container 14 should be installed at a position higher than the heat absorbing container 13, and the heat dissipation container 14 should be located at the upper edge corner of the computer to facilitate heat dissipation. In addition, when dissipating heat, it is blocked by a separate blocking plate 17 so as not to affect the internal device or device, and the computer body case 18 is provided with a plurality of heat dissipation holes 18a for dissipating heat. It is preferable to separately set the chamber of the heat dissipation container 14 in the form.

FIG. 5 is a sectional view showing only the cooling device for cooling the CPU 11 in FIG. 4 in detail. The cooling device of the CPU 11 and the HDD 12 have the same configuration and principle, and thus the cooling device of the CPU 11. Explain only.

An endothermic container 13 made of metal (preferably metal such as aluminum, which is well-heated) is installed on the heat dissipation surface of the CPU 11, and one end of the first conduit 15 and the second conduit 16 is endothermic. It is connected to the side of the container 13 through. As shown, even when the heat dissipation surface (heat dissipation surface) of the CPU 11 is installed to face upward, the heat absorbing container 13 may be attached, and although not shown, the heat dissipation surface is directed downward. Even when installed, the endothermic container 13 can be attached to the heat dissipating surface (that is, the endothermic container is attached to the bottom of the CPU) so that the endothermic container 13 dissipates heat regardless of the installation state of the CPU 11. It is attached to the face. Although not shown in detail in FIG. 4, a passage communicating the endothermic container with the first conduit is formed in the wall of the endothermic container, which is formed in the horizontal slits, and the endothermic container is above or below the CPU. It is desirable to always point to the top of the space in the endothermic container, regardless of where it is attached (see FIG. 2).

A gaseous refrigerant flows through the first conduit 15, and a liquid refrigerant flows through the second conduit 16. In the drawing, the first pipe line 15 is connected to the upper side of the endothermic container 13, and the second pipe line 16 is connected to the lower side. However, the same height or relative height relationship may be connected in the opposite state. have.

The other end of the first conduit 15 penetrates the bottom of the heat dissipation container 14 so as to be approximately at an upper position in the heat dissipation container 14, and the other end of the second conduit 16 opens the bottom of the heat dissipation container 14. It is desirable to penetrate so that it is on the same horizontal plane as the bottom surface.

The heat dissipation container 14 made of metal (preferably metal such as aluminum, which is well-heated) is formed in a hollow cylindrical shape, and a protrusion 14a extending in the longitudinal direction in the longitudinal direction as shown in FIG. 6 around the inner surface. ) Is formed to increase the surface area to increase the heat transfer efficiency. The body of the heat dissipation container 14 is preferably formed by forging aluminum or aluminum alloy.

In addition, a thin plate-like heat sink 19 is inserted around the outer surface of the heat dissipation container 14, and a plurality of heat sinks 19 are stacked in the longitudinal direction, and a circular ring-shaped spacer 20 is installed between the heat sinks 19 so as to be adjacent to the heat sink. The gap between (19) and the air flows is formed, and the heat sink 19 is configured to maximize the heat dissipation area by forming the fin FIN by a plurality of radial cutout grooves 19a.

At the end of the second conduit 16 connected to the heat dissipation container 14, it is possible for the refrigerant to flow from the heat dissipation container 14 to the heat absorbing container 13, and backflow from the heat absorbing container 13 to the heat dissipation container 14. To prevent the refrigerant from flowing back.

The endothermic container and the heat dissipation container are manufactured as a sealed container by welding or the like, and a refrigerant inlet (not shown) is provided at one side of the container. The refrigerant inlet is sealed after the refrigerant is injected. Refrigerant used in the present invention can be used as a normal refrigerant, and should not be harmful or dangerous to the human body, it is preferable that the chemical reaction with the components of the cooling device is difficult to occur. As such a refrigerant, HCFC-123 is preferably used. The refrigerant may be obtained under the name Suva 123 of DuPont, USA.

The refrigerant backflow prevention device includes a socket 21 fixed to the bottom surface of the heat dissipation container 14 as shown in FIG. The socket 21 communicates with the mounting hole 21a drilled a predetermined depth from the surface facing outward, and the through hole 21b communicating with the inside of the heat dissipation container 14 from the mounting hole 21a and having the chamfered inlet. Forming. The pipe fitting member 22 is fixed in the mounting hole 21a of the socket 21.

As shown in FIG. 8, the pipe fitting member 22 includes a flange portion 23 fixed to the mounting hole 21a of the socket 21, and an upper head portion 24 around the flange portion 23. ), The lower body portion 25 is integrally formed.

In the pipe fitting member 22, a central hole 22a penetrating the center is formed, and the outer diameter of the trunk portion 25 becomes smaller toward the lower end of the trunk portion 25, and both side surfaces of the head portion 24 are formed. The opening part groove 24a is formed so that a part of it may pass through the center hole 22a.

A predetermined gap is maintained between the flange portion 23 of the pipe fitting member 22 and the through hole 21b of the socket 21, and a sealing packing 26 fitted therebetween is provided. Between the 21b) and the head part 24, the spherical oscillator 27 of diameter smaller than the distance between them is provided.

As shown in FIG. 7A, the oscillator 27 is in close contact with the head portion 24 when the coolant flows from the heat dissipation container 14 to the heat absorbing container 13 so that the coolant passes through the through hole 21b. And flow toward the endothermic container 13 through the opening groove 24a of the head portion 24, and the refrigerant flows from the endothermic container 13 toward the heat dissipating container 14 as shown in FIG. In the case of flowing, it is in close contact with the through-hole 21b and closes the through-hole 21b to prevent the backflow of the refrigerant.

In the present exemplary embodiment, the socket 21 of the refrigerant backflow preventing means is separately formed, but the mounting hole 21a and the through hole 21b of the heat dissipation container 14 are not formed separately. It can also be formed directly on the bottom.

According to the cooling apparatus of the present invention configured as described above, as shown in FIG. 5, when heat is generated in the CPU 11, the refrigerant in the endothermic container 13 absorbs this heat to become a gas state, and prevents backflow. Since a pressure difference occurs between the first conduit 15 and the second conduit 16 by the action of the device, the gaseous refrigerant flows into the heat dissipation container 14 through the first conduit 15.

The gaseous refrigerant flowing into the heat dissipation container 14 through the first conduit 15 is a convex-concave portion 14a formed at the inner circumference of the heat dissipation container 14 and a heat dissipation plate installed at the outer circumference of the heat dissipation container 14 ( 19, the heat is deprived, whereby the refrigerant is brought back into the liquid state and accumulated at the bottom of the heat dissipation container 14.

The heat sink 19 takes heat away from the refrigerant and releases heat. A gap is formed between the spacers 20 so that air flows through the gap, and the heat dissipation area is increased by the cutout groove 19a. High thermal efficiency

The refrigerant that has become a liquid in the heat dissipation container 14 is circulated by returning back to the heat absorbing container 13 through the second conduit 16, and by repeatedly performing such circulation, cooling of the CPU 11 is performed. Done.

The cooling apparatus is provided with a backflow preventing means in the second conduit 16 so that the first conduit 15 and the second conduit 16 can be disposed on the side of the endothermic container 13 without height difference or on which conduit. Even if it is installed, the refrigerant can be smoothly circulated without flowing back from the endothermic container 13 to the heat dissipation container 14, thereby improving the cooling efficiency of the device or the device and making the endothermic container 13 thin. It takes up no space in the computer and can be applied regardless of the installation state of the device or device.

Although the operation of the cooling device of the CPU 11 has been described so far, the operation of the cooling device of the HDD 12 which is the device has the same function, and thus description of the operation thereof will be omitted.

4, the heat absorbing container 13 of the CPU 11 and the heat absorbing container 13 of the HDD 12 are each of the heat dissipating containers 14, each of the first conduits 15 and the second conduits 16. Although illustrated as being connected to, the heat absorbing container 13 of the CPU 11 and the heat absorbing container 13 of the HDD 12 are not limited thereto, and the heat absorbing container 14 of the HDD 12 is not limited thereto. ) May be connected to each of the first conduit 15 and the second conduit 16, and as shown in FIG. 10, the endothermic container 13 and one heat dissipation container 14 of the CPU 11. Is connected to the first main pipe line 15a and the second main pipe line 16a, and the endothermic container 13 of the HDD 12 branches from the first main pipe line 15a and the second main pipe line 16a. The first branch pipe (15b) and the second branch pipe (16b) may be installed in connection with the heat dissipation container (14).

Although the CPU 11 as an element and the HDD 12 as a device have been described as an example, the present invention is not limited thereto, and any device or device that generates heat in a computer can be used.

On the other hand, the present invention is further provided with soundproof means for blocking the noise in the case of the device for generating noise by a drive motor or the like in the computer. That is, Fig. 11 is a cross-sectional view of the HDD 12, which is a device for generating noise by a driving motor, as an example, and Fig. 12 is an exploded perspective view of Fig. 11, wherein the soundproofing means is an HDD 12 and the HDD 12. It consists of an upper, lower sound-proof case (31) (32) surrounding the entire heat absorbing container (13) installed in the heat generating portion (mainly stator core) of.

The bottom surface of the lower soundproof case 32 is provided with an insertion groove 32a formed in a corresponding shape so that the heat absorbing container 13 is inserted, and one side of the lower soundproof case 32 is electrically connected to the HDD 12. A rectangular through hole 32b for the first pipe line 15 and the second pipe line 16 connected to the connection port and the endothermic container 13 is formed.

In addition, a protrusion 31a and a groove 32c into which the protrusion 31a is inserted are formed at the edge where the upper soundproof case 31 and the lower soundproof case 32 contact each other, thereby forming the protrusion 31a and the groove. The upper and lower soundproof cases 31 and 32 are coupled by fitting 32c, and screw holes are formed at four corners of the upper and lower soundproof cases 31 and 32, and the upper and lower soundproof cases 31 and 32 are formed as fixing means such as screws. The lower sound insulation cases 31 and 32 are fixed.

In addition, the upper and lower sound insulation cases 31 and 32 are covered with a primary sound insulation film 33 such as synthetic rubber as a sound insulation layer to block the noise, and a sponge is provided on the primary sound insulation film (sound insulation film) 33. The secondary sound absorbing film 34 is formed to absorb noise and is configured to protect the HDD 12 from external shock.

According to such a structure, since the upper and lower sound insulation cases 31 and 32, the primary sound insulation film 33, and the secondary sound insulation film 34 of the sponge surround the whole HDD 12, the HDD 12 is replaced. Mechanical noise of the actuating drive motor (not shown) is cut off. Thus, the noise caused by the driving of the conventional cooling fan and the blower fan is removed by the refrigerant circulation type cooling device, and the noise generated by the drive means such as the HDD drive motor is made up of the upper and lower soundproof cases 31, 32, and the like. By blocking by the sound insulation means, it is possible to realize low noise of the computer.

Fig. 13 shows the structure of a cooling apparatus when the heat generating elements are adjacent to each other. As shown in FIG. 13, a first heat generating element 50 such as a CPU and a second heat generating element 52 such as a chipset may be adjacent to an internal substrate of the computer. At this time, the heat absorbing container 54 is provided on the heat dissipating surface 52 of the first heat generating element 50. This is the same as the endothermic container of the cooling apparatus shown in FIG. On the other hand, a heat transfer plate (heat transfer plate) 56 is provided on the heat dissipation surface of the adjacent second heat generating element 52. The heat transfer plate 56 is made of a metal plate such as aluminum having excellent thermal conductivity.

The heat transfer connector 58 connects between the heat absorbing container 54 and the heat transfer plate 56. The heat transfer connector 58 is provided with a connection plate 62 each of which is fixed to the heat absorbing container 54 and the heat transfer plate 56 by fasteners such as screws 60 and the like. Between each connecting plate 62 is provided a braided connecting portion 64 fixed to each connecting plate 62 by brazing or soldering. The connecting portion 64 is preferably braided with a copper wire material, but is not limited thereto. Anything that can transfer heat well and is flexible can be used.

Meanwhile, as shown in FIG. 14, the first cooling device 70 and the second cooling device 80 may be connected. The first cooling device 70 includes a heat absorbing container 74 and a heat radiating container 76 connected by a pair of pipes. The endothermic container 74 of the first cooling device 70 is installed on the heat dissipation surface of the first heat generating element 78. The second cooling device 80 includes a heat absorbing container 84 and a heat radiating container 86 connected by a pair of pipes. The heat dissipation container 86 of the second cooling device 80 is attached to one surface of the heat absorbing container 74 of the first cooling device 70. Basically, the first cooling device and the second cooling device have the same structure as the cooling device shown in FIG. 4, and the heat dissipation container 86 of the second cooling device 80 is a heat absorbing container of the first cooling device 70. The structure is modified so as to be attached to one side of 74) to transfer heat well, and those skilled in the art will readily understand such a structural change. The endothermic container 84 of the second cooling device 80 is installed on the heat dissipation surface of the second heat generating element 88. According to this configuration, heat generated in the second heat generating element 88 may ultimately be dissipated through the heat dissipation container of the first cooling device.

The present invention has been described with reference to the cooling device for heat generating parts incorporated in electronic products (particularly, computers). However, the heat transfer device of the present invention is not limited only to the computer cooling device. Cooling components inside other electronics can also be cooled. In addition, it is possible to transfer heat from a high place to a low place if it is between two locations where there is a temperature difference from each other. That is, heat may be transferred from a heater by electricity or combustion to a place where heating is required. This arrangement is particularly useful for supplying heat where there should be no electricity supply.

In an embodiment of the present invention, a heat transfer device may be configured in which a plurality of endothermic containers are connected to one heat dissipation container. In another embodiment, several heat dissipation containers may be connected to one endothermic container.

As described above, according to the heat transfer device of the present invention, the refrigerant vaporized by the backflow prevention means installed in the second pipeline flows only through the first pipeline and does not flow back into the second pipeline, thereby smoothly circulating the refrigerant. According to the configuration of the present invention, no height difference is required at the portion where the endothermic container, the first conduit, and the second conduit are connected. Therefore, the selection of the mounting orientation of the endothermic container is free. That is, the endothermic container can be installed on the heat generating surface regardless of the installation state of the element or device. Furthermore, the endothermic container can be thinned.

In addition, as a cooling device for an element or device in a computer, a refrigerant circulating cooling method is employed to eliminate the conventional noise elements such as a cooling fan and a blowing fan, thereby completely eliminating mechanical noise due to their driving.

When the heat transfer device of the present invention is used in a computer, the noise of the drive motor, such as HDD, which is another noise factor, can be significantly reduced by the soundproof case. Therefore, the noise reduction of the entire computer is realized by using the heat transfer apparatus according to the present invention.

Claims (12)

In the heat transfer device for transferring the heat of the place where the heat is generated to another place where the temperature is low, An endothermic container installed to absorb heat from a heat generating place, A heat dissipation container installed at least at a position higher than the endothermic container and dissipating heat; A first pipe line and a second pipe line communicating between the endothermic container and the heat dissipation container; The endothermic container, the heat dissipation container, the first conduit, and the second conduit form an enclosed space, and refrigerant is injected into the enclosed space. The path through which the refrigerant flows is a heat transfer device characterized in that the backflow prevention device is provided so that the refrigerant flows only in one direction. The method of claim 1, wherein the vaporized refrigerant flows from the heat absorbing container to the heat dissipating container in the first conduit, and the liquefied refrigerant flows from the heat dissipating container into the heat absorbing container in the second conduit, wherein the backflow preventing device is liquefied. And a refrigerant that is prevented from flowing from the endothermic container to the heat dissipation container in a path through which the refrigerant flows. 3. The refrigerant backflow prevention device according to claim 2, wherein the refrigerant backflow preventing device communicates with the mounting hole (21a) drilled a predetermined depth from one surface, the mounting hole (21a) is smaller than the diameter of the mounting hole (21a), and communicates with the mounting hole (21a) inside the heat dissipation container (14). A socket 21 having a through hole 21b; Airtightly fixed in the mounting hole 21a of the socket 21, the head portion 24 spaced apart from the through-hole 21b of the socket 21 at a predetermined interval on the upper side, the second conduit at the bottom A body portion 25 into which the 16 is fitted is integrally formed, and a central through hole 22a extending from the head portion 24 toward the body portion 25 is formed, and the through hole of the head portion 24 is formed. (22a) a pipe fitting member 22 having opening grooves 24a formed on both sides thereof through the central hole 22a; It is installed between the through hole 21b of the socket 21 and the head portion 24 of the pipe fitting member 22 and is in close contact with the through hole 21b according to the flow direction of the refrigerant to close the through hole 21b. And a spherical oscillator (27) in close contact with the upper surface of the head portion to open the through hole (21b). The method of claim 2, The lower wall of the heat dissipation container 14 has a mounting hole 21a which is drilled a predetermined depth from the outer surface and a through hole which is smaller than the diameter of the mounting hole 21a and communicates with the mounting hole 21a and the heat dissipation container 14 inside. 21b, The backflow prevention device is fixed to maintain the airtightness in the mounting hole 21a of the socket 21, the head portion 24 spaced apart from the through hole 21b of the socket 21 at a predetermined interval, The lower body part 25 into which the second conduit 16 is fitted is integrally formed, and a central through hole 22a extending from the head part 24 toward the body part 25 is formed, and the head part ( On both sides of the through hole 22a of the tube 24, the pipe fitting member 22 having an opening groove 24a formed therethrough so as to pass through the center hole 22a; It is installed between the through hole 21b of the socket 21 and the head portion 24 of the pipe fitting member 22 and is in close contact with the through hole 21b according to the flow direction of the refrigerant to close the through hole 21b. And a spherical oscillator (27) in close contact with the upper surface of the head portion to open the through hole (21b). 3. The heat transfer device of claim 2, wherein the backflow preventing device is a check valve. The heat dissipation container (14) according to any one of claims 1 to 5, wherein the heat dissipation container (14) is formed in a cylindrical shape having a constant shape in an up and down direction, and a heat dissipation plate having a plurality of cutout grooves (19a) radially formed on an outer circumference thereof. 19) are laminated in the longitudinal direction a plurality of heat transfer device, characterized in that the spacer (20) is formed between the heat sink (19) to form a gap therebetween. 7. The heat transfer apparatus according to claim 6, wherein the heat dissipation container (14) is formed with splined irregularities (14a) extending in an up and down direction on an inner surface thereof. The heat transfer device according to any one of claims 1 to 5, wherein the endothermic container (14) is attached to a heat generating part of the computer to cool the heat generating part. A cooling system comprising the heat transfer device according to any one of claims 1 to 8 for cooling a plurality of heat generating parts, The endothermic container of the heat transfer device is attached to the heat dissipation surface of any one heat generating component, A heat transfer plate is attached to the heat dissipation surface of other heat generating parts. Cooling system, characterized in that the heat transfer connector is connected between the heat transfer plate and the heat absorbing container. 10. The cooling system of claim 9, wherein the heat transfer connector includes a connection plate respectively attached to the heat absorbing container and the heat transfer plate, and a flexible connection portion connecting the connection plate. In order to cool a plurality of heat generating parts, the first heat transfer device and the second heat transfer device according to any one of claims 1 to 8 are used as a cooling system. The endothermic container of the first heat transfer device is attached to the heat dissipation surface of any one heating element, The endothermic container of the second heat transfer device is attached to the heat dissipation surface of the other heat generating component, And a heat dissipation container of the second heat transfer device is attached to the heat absorption container of the first heat transfer device. A hard disk drive to which the heat transfer device according to any one of claims 1 to 8 can be attached, The heat absorbing container 13 of the heat transfer device is wrapped around the entire device is installed, the inner surface is formed of the upper, lower sound-proof case (31) (32) having a soundproof film, any of the upper, lower sound-proof case (31, 32) Hard disk, characterized in that it comprises an electrical connection port of the device and a through hole (32b) through which the first and second conduits (15, 16) of the endothermic container (13) can pass. drive.