KR100317451B1 - Method for cooling electronic device and electronic device cooler using the same - Google Patents

Abstract

Disclosed are a cooling method for cooling an electronic device such as a computer, and an electronic device cooling device using the same. An object of the present invention is to close the inside of the electronic device almost completely, thereby protecting the inside of the electronic device from dust, and cooling the heat generating parts of the electronic device while preventing the noise generated inside the electronic device to be transmitted to the outside To provide a cooling device. The electronic device cooling method according to the present invention completely encloses the inside of the electronic device with the case, and heat generated inside the sealed case is radiated to the outside of the case by forced air cooling. To this end, the present invention preferably cools through a heat sink installed in a component in which heat is generated by forcibly circulating air in the case, and heat of air in the heated case is sub-cooling means installed in the case and / or the case. Heat is transferred to the outside of the electronic device to radiate heat to the outside.

Description

Electronic device cooling method and electronic device cooling device using the same {Method for cooling electronic device and electronic device cooler using the same}

The present invention relates to a cooling method for cooling an electronic device and an electronic device cooling device using the same. More particularly, the case surrounding the electronic device is completely sealed, and heat from the heat generating portion is generated by the internal air circulation. And / or relates to a cooling method for cooling the electronic device by radiating to the outside through the auxiliary cooling means attached to the case and an electronic device cooling device using the same.

In general, electronic devices that require cooling devices are included in computers, TVs, VCRs, TV projectors, power supply units, projectors, sliders, overhead projectors, fax machines, printers, and copiers. The main heating parts inside the device include CPU, hard disk drive (hereinafter referred to as HDD), power supply unit, and LCD module. As the electronic devices are used, heat is generated from the heat generating parts installed therein, and cooling devices such as a cooling fan are installed to cool the generated heat, thereby generating noise.

Referring to the computer as an example, as shown in FIG. 1, the power supply device 2, the main board 3, and the auxiliary memory device 4 are installed in the base frame 1 of the computer, and the main board 3 is provided. The central processing unit 5 is installed. Cooling fans 6 are installed in the central processing unit 5, the power supply unit 2, and the base frame 1, respectively, and the devices are located in an inner space that is isolated from the outside by a case. The power supply unit 2 converts an AC power supply of 110V or 220V into a DC power supply of a predetermined volt and supplies it to the main board 3, the central processing unit 5, the auxiliary storage device 4, and the cooling fans 6. The cooling fans 6 are respectively installed in the power supply unit 2 and the central processing unit 5 which generate a lot of heat, and intensively cool the power supply unit 2 and the central processing unit 5, and additionally, Cool the heat generating parts.

The reason for cooling the power supply unit 2, the central processing unit 5, and other heat generating parts in this way is that the heat generated by itself shortens the life of each device or parts, or stops operation when it is severe. In particular, the power supply unit 2 may cause a fire when overheated, and the central processing unit 5 may slow down the processing speed when it is overheated, shorten the lifespan, and, in severe cases, the operation may be stopped. On the other hand, the computer is equipped with a secondary storage device such as HDD, CD-ROM drive, DVD-ROM drive, which generates noise (26 ~ 30dB) and heat as the operation, the dust and heat of the product There is a risk of poor performance or failure.

Until now, the cooling fan 6 is mainly used as a cooling device for cooling the central processing unit 5, the power supply unit 2 and other heat generating parts. The cooling fan 6 is provided in the power supply unit 2 and the central processing unit 5, respectively, and the cooling fan 6 is also installed in the base frame 1 auxiliary. That is, the cooling fan 6 receives power from the power supply unit 2 to introduce external air into the case, and cools the components inside the computer by flowing the air inside the case to the outside. However, as the air is circulated in and out by rotating the cooling fan 6, there is a problem that the noise generated from the cooling fan 6 adversely affects the working environment. When the dust is introduced into the external dust is also introduced into the computer there is a problem that lowers the heat radiation and reliability of each component.

Conventional computers as described above have a lot of noise (30dB or more) generated from the cooling fan, there is a problem that causes a lot of failure due to the incoming dust. In addition, when the cooling fan is broken, there is a problem that the whole computer and some parts do not operate. In addition, the noise generated during the operation of the auxiliary memory device could not be removed.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an electronic device cooling method capable of protecting an interior of an electronic device from dust, preventing internal noise from being transmitted to the outside, and cooling each of the heating parts of the electronic device. To provide.

Another object of the present invention is to provide an electronic device cooling method capable of protecting the inside of an electronic device from dust, preventing the internal noise from being transmitted to the outside, and cooling each heating component of the electronic device in view of the above-described problems. It is to provide an electronic device cooling apparatus using.

Another object of the present invention in view of the above-described problems, and protect the auxiliary storage device installed inside the electronic device from dust, and at the same time prevent the noise inside the auxiliary storage device is transmitted to the outside, the auxiliary memory An electronic device cooling device using an electronic device cooling method capable of cooling a device is provided.

1 is a perspective view of a conventional general computer body.

2 is a conceptual diagram illustrating a computer case, a CPU, and a fan for explaining an electronic device cooling method according to the present invention.

3A and 3B are graphs illustrating an external temperature, an internal temperature, and a CPU temperature of a computer cooled according to an electronic device cooling method according to the related art and the present invention, respectively.

Figure 4 is an exploded perspective view showing a separate computer body using the electronic device cooling method according to the present invention.

Fig. 5 is an assembled perspective view of the computer main body as shown in Fig. 4 using the electronic device cooling method according to the present invention.

6 is a perspective view of the heat dissipation fin formed in the case of the computer main body using the electronic device cooling method according to the present invention.

FIG. 7 is a perspective view of a flower type heat sink that may be attached to the heat absorbing surface and the heat radiating surface of the thermoelectric element illustrated in FIG. 4.

8 is a perspective view illustrating a wire radiator attached to the thermoelectric element illustrated in FIG. 4 to absorb heat of a thermoelectric element or radiate heat of the thermoelectric element into air.

9 is an exploded perspective view of a noiseless HDD case applied to the present invention.

<Description of the symbols for the main parts of the drawings>

10 ... case 20 ... CPU 30 ... fan

40 Internal air 50 External air 60 Main board

70 Secondary memory 80 Thermoelectric element 90 Wire hole

91. Hole Plug

The electronic device cooling method according to the present invention encloses an electronic device including at least one heat generating part in a case and seals the noise and dust to be blocked, and generates heat while the heat generating parts inside the sealed case are forced air-cooled. The air inside the case is forced to circulate so that heat generated in the field is transferred to the case, thereby dissipating heat of the heat generating parts to the outside.

In addition, in the electronic device cooling method of the present invention, a heat absorbing portion having an extended surface area is formed inside the case, and auxiliary cooling means having a heat dissipating portion having an extended surface area outside the case is installed in the case, and the forced air is supplied to the forced air. By the heat transfer to the heat absorbing portion is characterized in that the heat radiation to the outside through the heat radiating portion.

In addition, the electronic device cooling method of the present invention is characterized in that the heat sink or the heat dissipation portion of the auxiliary cooling means uses a flower type heat sink having a large surface area.

In addition, the electronic device cooling method of the present invention is installed between the heat absorbing portion and the heat radiating portion of the sub-cooling means of the heat generating parts through the thermoelectric element forcibly moving heat from the heat absorbing portion to the heat radiating portion as electricity is applied. Heat dissipates.

In addition, the electronic device cooling method of the present invention is characterized in that it comprises a flower-type heat sink in close contact with at least one of the heat generating parts to dissipate heat of the heat generating parts into the air inside the case.

According to another aspect of the present invention, an electronic device cooling apparatus including at least one heating component, comprising: a case which blocks noise and dust with respect to the outside of the electronic device and radiates heat generated therein to the outside; And at least one air circulation fan installed in the case to forcibly circulate the air therein so that the heat generating parts are forced to air-cooled while the heat of the heat generating parts is transferred to the outside of the case through the case. It provides an electronic device, characterized in that.

In addition, the electronic device cooling apparatus of the present invention further comprises a secondary cooling means installed in the case is formed with a heat absorbing portion is extended to the surface area inside the case and the surface area is extended to the outside of the case, the air circulation The heat transmitted to the heat absorbing portion by the air forcedly circulated by the fan is characterized in that the heat radiation to the outside through the heat radiating portion.

In addition, the electronic device cooling apparatus of the present invention is provided between the heat absorbing portion and the heat radiating portion of the auxiliary cooling means further comprises a thermoelectric element for forcibly moving heat from the heat absorbing portion to the heat radiating portion as electricity is applied. It is done.

In addition, the electronic device cooling apparatus of the present invention is characterized in that it further comprises a flower-type heat sink in close contact with at least one of the heat generating parts to dissipate heat of the heat generating parts into the air inside the case.

In addition, the electronic device cooling apparatus of the present invention, the first and second thermoelectric elements installed in the case; First and second fluid tanks attached to heating surfaces of the first and second thermoelectric elements, respectively; Heat sinks attached to heat absorbing surfaces of the first and second thermoelectric elements; Installed on the outer surface of the case, by connecting the first and second fluid tanks, heat absorbed from the thermoelectric element to which electricity is applied among the first and second thermoelectric elements is transferred to the fluid in the fluid tank to vaporize the fluid A radiator in which heat transferred to the fluid is cooled when it is moved; And a controller for applying or blocking electricity to the first and second thermoelectric elements.

In addition, the electronic device cooling apparatus of the present invention is characterized in that the heat radiation fins are formed inside and outside the case.

According to still another aspect of the present invention, a case, a circuit board installed on a base frame in the case, at least one heating component installed on the circuit board to generate heat, and an auxiliary memory device installed on the base frame A cooling device for cooling an electronic device comprising: a cover for fixing the auxiliary memory device to the base frame to be sealed off from noise and dust; And an air circulation fan installed inside the cover to circulate the air inside the cover.

In addition, the electronic device cooling apparatus of the present invention further comprises at least one auxiliary cooling means installed in the cover is formed in the heat absorbing portion is extended to the inside of the cover and the heat dissipation portion is extended to the outside of the cover formed; It is characterized by.

In addition, the electronic device cooling apparatus of the present invention and the auxiliary cooling means attached to at least one of the heating parts; It is installed on the base frame characterized in that it further comprises at least one air circulation fan for blowing air while the wing is rotated at a speed that little noise is generated.

In addition, the electronic device cooling apparatus of the present invention is characterized in that the auxiliary cooling means is a flower type heat sink.

The electronic device cooling method and the electronic device cooling apparatus using the same according to the present invention can protect the inside of the electronic device from dust, and can cool each part of the electronic device without noise.

Hereinafter, with reference to the accompanying drawings will be described in detail preferred embodiments of the electronic device cooling method and the electronic device cooling apparatus using the same.

Referring to FIG. 2, the temperature of the CPU 20 installed in the computer case 10 is changed according to the wind (air volume and wind pressure) generated by the fan 30 and the temperature of the air 40 inside the case 10. That is, the temperature of the CPU 20 when the air flow rate and the wind pressure is 1.18 m 3 / min and 3 mm H 2 O by rotating the fan 30 having a length of 29 mm on one side at 2400 rpm while maintaining the temperature inside the case 10 at 30 ° C. Is maintained at 40 ° C., the fan 30 is rotated at 3600 rpm while the temperature of the air 40 inside the case 10 is maintained at 35 ° C. to set the air flow rate and wind pressure to 1.58 m 3 / min and 7.0 mmH 2 O. 20) is maintained at 40 ° C. In summary, by adjusting the rotation speed of the fan 30 in consideration of the temperature change of the air inside the case 10, it is possible to maintain the temperature of the CPU 20 at a desired temperature.

Preferably, the heat sink of the CPU 20 is a flower type heat sink 83 as shown in FIG. The flower-type heat sink is made of metal such as copper or aluminum, and the petal-shaped unit heatsinks having fixing holes are formed to be unfolded at a predetermined angle so that they overlap each other at the bottom and not overlap each other at the upper part. The heat transfer path is short and the heat dissipation area is large, so the heat resistance is low to effectively dissipate heat generated from the CPU.

On the other hand, if the temperature of the air 40 inside the case 10 is higher than the temperature outside the case 10, heat inside the case 10 is radiated to the outside of the case 10 through the case 10. In this case, the case 10 is made of a material capable of transferring heat, and the larger the contact area between the case 10 and the internal air 40 and the contact area between the case 10 and the external air 50 is, the larger the case is. (10) The greater the temperature difference between the inside and the outside air, the more heat generated inside the case 10 is radiated to the outside through the case 10. For example, when the heat generated inside the case 10 made of aluminum is 40 W, if the temperature of the case outside air 50 is 25 ° C., the heat inside the case 10 is continuously radiated to the outside through the case. The temperature of the air inside the case 10 is maintained at 35 ° C.

As described above, the electronic device cooling method and the electronic device cooling apparatus using the same according to the present invention almost completely seals the components, for example, the CPU 20 is generated using the heat transfer case 10 When the temperature of the air 40 inside the case 10 sealed by the case 10 rises, the heat generated inside the case 10 may be smoothly radiated to the outside through the case 10, and the case 10. By rapidly circulating the air 40 inside the case 10 using the cooling fan 30 to properly maintain the temperature of the CPU 20 that generates heat.

1, 2, 3A, and 3B, when the computer outside air is maintained at 25 ° C. as curve A, an unsealed conventional computer (see FIG. 1) is operated to operate the air inside the computer (40). The temperature of ') rises as shown by curve B (see FIG. 3A) and reaches an equilibrium state after a predetermined time, at which time the CPU 5 temperature rises as shown by curve D (see FIG. 3A) and reaches an equilibrium state after a predetermined time. do. On the other hand, the temperature of the air 40 inside the enclosed computer (see Fig. 2) according to the present invention is raised as shown by curve B '(see Fig. 3b) to reach equilibrium after a predetermined time, and the rotation of the fan 30 The temperature of the CPU 20 exposed to the position where the air flow rate and the wind speed of the internal air 40 are increased by increasing the number increases as shown by the curve D '(see FIG. 3B), and reaches an equilibrium state after a predetermined time. . If the CPU of the enclosed computer is placed in the same environment as the rotation speed of the conventional fan, the CPU 20 temperature is increased as shown by the curve E (see Fig. 3B).

As such, the electronic device cooling apparatus according to the present invention is sealed so that the noise and dust is almost completely blocked by the case, the noise generated inside the case does not leak to the outside, the outside dust does not flow into the inside The heat generated inside the case can be radiated to the outside of the case smoothly, and the temperature of the internal heating parts can be maintained at a desired temperature by controlling the size and rotation speed of the fan installed therein. The technology for controlling the cooling efficiency by adjusting the rotational speed of the cooling fan by sensing the temperature of the internal heating component is apparent to those skilled in the art as another embodiment of the cooling method of the present invention and a detailed description thereof will be omitted. In addition, the matters related to the design of the cooling capacity, such as the size of the cooling fan according to the amount of heat generated by the heat generating parts are not related to the present invention, so a detailed description thereof will be omitted.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the electronic device cooling apparatus according to a preferred embodiment of the present invention.

4 and 5, a main board 60, a CPU 20, a power supply 71, an auxiliary memory 70, and a fan 30 are installed in the computer, and these components are provided in a case. (10) is sealed off from the outside. A door 11 is installed in the case 10 to insert and withdraw the recording medium into the auxiliary memory device 70. The wires (not shown) connected to the outside from the inside of the computer are connected to the outside through the wire hole 90, the hole plug 91 is installed in the wire hole 90 so that the internal noise does not leak to the outside and the outside To prevent dust from entering the interior.

The case 10 is preferably made of a metal such as aluminum, copper, or iron, which conducts heat well. However, the case 10 is made of a non-metallic material such as glass, plastic, or acrylic resin, which has a relatively low thermal conductivity in view of the amount of heat generated inside the computer. It may be made. Considering the sound insulation and the cost, the case 10 and the door 11 are made of glass, plastic, and acrylic resin having good sound insulation, and a general heat sink as an auxiliary cooling means in order to radiate more heat inside the case 10 to the outside. Alternatively, it is preferable to use the flower type heat sink 83 shown in FIG. 7, and to use the thermoelectric element together with the heat sink to forcibly move the heat inside the case to the outside in consideration of the amount of heat to be radiated. desirable.

The heat sink 83 of the flower type heat sink 83 shown in FIG. 7 overlaps a plurality of unit heat sinks in which fixing holes are formed, and a heat absorbing surface is formed at a lower portion thereof, and is bent at a predetermined angle by a protrusion formed in the unit heat sinks. Since it is formed and has a flower shape as a whole, the heat dissipation surface is larger than that of a given heat absorption surface, thereby greatly improving the cooling effect. The shape of the flower type heat sink is not limited to that shown in FIG. 7, and various modifications may be made to fit the heating parts to be cooled.

Since the higher the temperature of the heat absorbing surface than the heat dissipating surface, the higher the temperature of the thermoelectric element 80, the better the heat transfer performance. (81, 82) is preferably attached so that the thermoelectric element (80) to dissipate heat inside the computer to the outside smoothly. More preferably, it is preferable to use the flower type heat sink 83 shown in FIG. 7, and more preferably, as shown in FIG. 8, the two first and second thermoelectric elements 80a and 80b and the pipe radiator. It is good to use 100.

The pipe radiator 100 is in contact with the heat generating surface of the first thermoelectric element 80a installed in the case to absorb heat from the first tank 101 and the heat generating surface of the second thermoelectric element 80b installed in the case. A second tank 102 for absorbing heat in contact with the fluid, a fluid passage 103 installed outside the case and connecting the first tank and the second tank, and endothermic to vaporize the fluid in the fluid tank. It includes a fluid that is cooled and liquefied through the passage. The pressure inside the first tank 101, the second tank 102, and the fluid passage 103 is adjusted to allow the fluid to vaporize and condense at a desired temperature. When electricity is applied to the first thermoelectric element 80a by a controller (not shown), and electricity is cut off from the second thermoelectric element 80b, the first thermoelectric element 80a absorbs heat inside the heating element or the case. Is transferred to the first tank 101 and the fluid therein, and the fluid in the first tank 101 is vaporized to form a second tank (a) through the fluid passage 103 by the pressure inside the first tank 101. 102). When electricity is applied to the second thermoelectric element 80b by the controller and the electricity is cut off to the first thermoelectric element 80a, the second thermoelectric element 80b absorbs heat inside the heat generating part or the case and thus the second tank. And a fluid in the second tank 102 is vaporized and moved back to the first tank 101. As such, as the fluid moves, heat transferred to the fluid is radiated in the elongated fluid passage 103 to radiate and heat the heat generated therein to the outside.

As shown in FIG. 6, when the case 10 is formed to increase the heat dissipation area and the heat dissipation fins 12 are formed, the contact area with the internal and external air of the case 10 may be widened to radiate more heat. have. That is, the contact between the case 10 and the internal air and the outside air in a state where the inside of the computer is sealed by the case 10 and the temperature inside the case 10 is higher than the temperature outside the case 10. If the area is large, heat inside the case 10 is effectively transferred to the outside of the case 10.

On the other hand, in order to achieve a noise-free computer, it is possible to implement by sealing the HDD using a soundproofing member and a case by employing the electronic device cooling method of the present invention without sealing the whole computer. Then, the cooling fan and the CPU cooling fan of the power supply unit installed in the computer to provide noise can be solved by rotating at a rotational speed that generates little noise.

Referring to FIG. 9, the HDD 200 is almost completely sealed by the soundproofing member 201 and the cover 202, a fan 203 is installed inside the cover 202, and the cover 202 is heated. The sink 204 is provided. Accordingly, the noise of the HDD 200 is blocked by the cover 202 and the soundproofing member 201, and the heat generated from the HDD 200 is carried by the air convection generated by the fan 203, and the internal heat sink 204a. ), And is radiated to the outside air by the external heat sink 204b. When the cooling fan and CPU cooling fan of the power supply are rotated at a noise-free speed, the cooling fan is enlarged to increase the airflow and the heat dissipation area is large so that the power supply and the CPU can be cooled well. It is preferable to use a heat sink. As the CPU heat sink, it is preferable to use the flower type heat sink shown in FIG.

On the other hand, the fan 203 installed inside the cover 202 may be damaged or the HDD 200 may be damaged because the temperature inside the cover 202 exceeds an appropriate temperature due to failure or other reasons. Therefore, an electronic circuit for operating the buzzer 206 or a warning light (not shown) may be installed by sensing the temperature inside the cover and the rotation of the fan 203 so that a person may notice an excessive temperature rise inside the cover 202. . Preferably, the electronic circuit includes a temperature switch 205 installed inside the cover 202 and a buzzer 206 installed inside or outside the cover 202 such that the temperature inside the cover is at a predetermined temperature. Preferably, the temperature switch 205 is activated to reach a circuit for operating the buzzer 206 when reached.

As described above, the inside of the electronic device is sealed to prevent noise, the air flow inside the electronic product is strengthened, so that the temperature of the parts can be properly maintained, and the heat generated inside the case is smoothly radiated to the outside of the case. The noise generated inside the computer is prevented from leaking to the outside, and dust is not introduced into the computer.

Preferred embodiments of the invention described by the accompanying reference drawings are only one embodiment. Those skilled in the art will fully understand the preferred embodiments of the present invention to implement a similar type of electronic device cooling method and an electronic device cooling device using the same. Therefore, the true technical protection scope of the present invention will be defined by the appended claims.

The electronic device cooling method and the electronic device cooling apparatus using the same to seal the electronic device and to radiate heat generated inside the electronic device to the outside by forced air cooling, so that noise generated inside the electronic device does not leak to the outside. In addition, dust outside the electronic device may not be introduced into the electronic device.

Claims (16)

As a case used as a heat transfer medium, it encloses an electronic device including at least one heating part therein to seal and block noise and dust. The air inside the sealed case is forcedly circulated by the cooling fan in the case, and the heat generating parts are forced to cool, and the heat generated from the heat generating parts is forcibly moved to the case through the air inside the case, thereby causing the outside of the case. Cooling method of the electronic device to be transmitted to the heat dissipation heat to the outside of the heat generating parts. According to claim 1, wherein the heat absorbing portion is formed to extend the surface area inside the case and the auxiliary cooling means having a heat dissipation portion is extended to the outside of the case is installed in the case, the forced circulation air to the heat absorbing portion Cooling method of an electronic device, characterized in that to radiate the heat transmitted to the outside through the heat radiating portion. The method of claim 2, wherein the heat absorbing portion or the heat radiating portion of the auxiliary cooling means is a flower type heat sink having a large surface area. According to any one of claims 1 to 3, Between the heat absorbing portion and the heat radiating portion of the sub-cooling means through the thermoelectric element for forcibly moving heat from the heat absorbing portion to the heat radiating portion as electricity is applied Cooling method of the electronic device heat dissipation of the heat generating parts. The electronic device of claim 1, further comprising a flower type heat sink in close contact with at least one of the heat generating parts to radiate heat of the heat generating parts into the air inside the case. Cooling method. In an electronic device comprising at least one heating component, A case for blocking noise and dust to the outside of the electronic device and dissipating heat generated from the inside to the outside; And And at least one air circulation fan installed in the case to forcibly circulate the air therein so that the heat generating parts are forced to air-cooled while the heat of the heat generating parts is transferred to the outside of the case through the case. Electronic device chiller characterized in that. According to claim 6, wherein the heat absorbing portion is formed to extend the surface area inside the case and the heat dissipation portion is formed to extend the surface area outside the case is further provided with auxiliary cooling means installed in the case, forced by the air circulation fan The electronic device cooling apparatus characterized in that the heat transferred to the heat absorbing portion by the circulated air to radiate to the outside through the heat radiating portion. The electronic device of claim 7, further comprising a thermoelectric element disposed between the heat absorbing portion and the heat radiating portion of the auxiliary cooling means to forcibly transfer heat from the heat absorbing portion to the heat radiating portion as electricity is applied thereto. Chiller. The heat sink according to any one of claims 6 to 8, further comprising a flower-type heat sink in close contact with at least one of the heat generating parts to dissipate heat of the heat generating parts into the air inside the case. Electronic chiller. The apparatus of claim 6, further comprising: first and second thermoelectric elements installed in the case; First and second fluid tanks attached to heating surfaces of the first and second thermoelectric elements, respectively; Heat sinks attached to heat absorbing surfaces of the first and second thermoelectric elements; Installed on the outer surface of the case, by connecting the first and second fluid tanks, heat absorbed from the thermoelectric element to which electricity is applied among the first and second thermoelectric elements is transferred to the fluid in the fluid tank to vaporize the fluid A radiator in which heat transferred to the fluid is cooled when it is moved; And a controller configured to apply or cut off electricity to the first and second thermoelectric elements. The electronic device cooling apparatus according to any one of claims 6 to 8, wherein heat dissipation fins are formed inside and outside the case. Cooling an electronic device comprising a case, a circuit board installed on the base frame in the case, at least one heat generating component installed on the circuit board to generate heat, and an auxiliary memory device installed on the base frame. In an electronic device cooling device, A cover for enclosing the auxiliary memory device from noise and dust to fix the cover to the base frame; And an air circulation fan installed inside the cover to circulate air in the cover. The method of claim 12, wherein the heat absorbing portion having an extended surface area is formed inside the cover, and the heat dissipation portion having an extended surface area is formed outside the cover, further comprising at least one auxiliary cooling means installed on the cover. Electronic chiller. 14. The apparatus of claim 13, further comprising: auxiliary cooling means attached to at least one of the heating parts; The electronic device cooling apparatus further comprises at least one air circulation fan installed in the base frame to blow air while the wing is rotated at a speed that noise is not generated. 15. The electronic device cooling apparatus according to claim 13 or 14, wherein the auxiliary cooling means is a flower type heat sink. 15. The electronic device cooling apparatus according to any one of claims 12 to 14, further comprising a temperature switch installed inside the cover and a buzzer or a warning lamp installed inside or outside the cover.