GB2571053B - Heat sink for immersion cooling - Google Patents
Heat sink for immersion cooling Download PDFInfo
- Publication number
- GB2571053B GB2571053B GB1714304.1A GB201714304A GB2571053B GB 2571053 B GB2571053 B GB 2571053B GB 201714304 A GB201714304 A GB 201714304A GB 2571053 B GB2571053 B GB 2571053B
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat sink
- immersion cooling
- immersion
- cooling
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
Priority Applications (25)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1714304.1A GB2571053B (en) | 2017-09-06 | 2017-09-06 | Heat sink for immersion cooling |
TW111142513A TWI836706B (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
EP23153453.8A EP4199076A1 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US16/645,166 US11096313B2 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
CN202111385072.9A CN114375131A (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink device and module for liquid immersion cooling |
KR1020237018651A KR102639521B1 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
CN201880058136.4A CN111095541B (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink device and module for liquid immersion cooling |
KR1020237018653A KR102640723B1 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
IL273104A IL273104B1 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
ES18769441T ES2943656T3 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
TW107131329A TWI786175B (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
JP2020513520A JP7183257B2 (en) | 2017-09-06 | 2018-09-06 | Immersion cooling heat sinks, heat sink devices and modules |
EP18769441.9A EP3679603B1 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
PCT/GB2018/052526 WO2019048864A1 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
KR1020207009009A KR102541199B1 (en) | 2017-09-06 | 2018-09-06 | Heat sinks, heat sink arrays and modules for immersion cooling |
EP23153461.1A EP4203016A1 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
IL308679A IL308679A (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US17/354,781 US11470739B2 (en) | 2017-09-06 | 2021-06-22 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US17/354,769 US11369040B2 (en) | 2017-09-06 | 2021-06-22 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US17/678,387 US11653472B2 (en) | 2017-09-06 | 2022-02-23 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US17/902,747 US11596082B2 (en) | 2017-09-06 | 2022-09-02 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
JP2022186573A JP2023029879A (en) | 2017-09-06 | 2022-11-22 | cooling module |
JP2022186574A JP2023029880A (en) | 2017-09-06 | 2022-11-22 | cooling module |
US18/122,431 US20230217629A1 (en) | 2017-09-06 | 2023-03-16 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US18/122,449 US20230240042A1 (en) | 2017-09-06 | 2023-03-16 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1714304.1A GB2571053B (en) | 2017-09-06 | 2017-09-06 | Heat sink for immersion cooling |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201714304D0 GB201714304D0 (en) | 2017-10-18 |
GB2571053A GB2571053A (en) | 2019-08-21 |
GB2571053B true GB2571053B (en) | 2020-03-18 |
Family
ID=60050789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1714304.1A Active GB2571053B (en) | 2017-09-06 | 2017-09-06 | Heat sink for immersion cooling |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2571053B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201619987D0 (en) | 2016-11-25 | 2017-01-11 | Iceotope Ltd | Fluid cooling system |
US10609839B1 (en) | 2018-09-28 | 2020-03-31 | Liquidcool Solutions, Inc. | Liquid submersion cooled electronic systems and devices |
GB2601299A (en) * | 2020-11-18 | 2022-06-01 | Iceotope Group Ltd | System for cooling electronic devices in an electronic module |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5168348A (en) * | 1991-07-15 | 1992-12-01 | International Business Machines Corporation | Impingment cooled compliant heat sink |
JPH05251600A (en) * | 1992-03-06 | 1993-09-28 | Nec Corp | Immersion jet cooling heat sink |
JPH05275587A (en) * | 1992-03-27 | 1993-10-22 | Nec Corp | Integrated circuit cooling structure |
US20100103620A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Open Flow Cold Plate For Liquid Cooled Electronic Packages |
US20120170222A1 (en) * | 2011-01-05 | 2012-07-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
JP2014183260A (en) * | 2013-03-21 | 2014-09-29 | Toyota Central R&D Labs Inc | Cooling device |
-
2017
- 2017-09-06 GB GB1714304.1A patent/GB2571053B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5168348A (en) * | 1991-07-15 | 1992-12-01 | International Business Machines Corporation | Impingment cooled compliant heat sink |
JPH05251600A (en) * | 1992-03-06 | 1993-09-28 | Nec Corp | Immersion jet cooling heat sink |
JPH05275587A (en) * | 1992-03-27 | 1993-10-22 | Nec Corp | Integrated circuit cooling structure |
US20100103620A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Open Flow Cold Plate For Liquid Cooled Electronic Packages |
US20120170222A1 (en) * | 2011-01-05 | 2012-07-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
JP2014183260A (en) * | 2013-03-21 | 2014-09-29 | Toyota Central R&D Labs Inc | Cooling device |
Also Published As
Publication number | Publication date |
---|---|
GB2571053A (en) | 2019-08-21 |
GB201714304D0 (en) | 2017-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20200109 AND 20200115 |