GB2571054B - Module for liquid cooling - Google Patents

Module for liquid cooling Download PDF

Info

Publication number
GB2571054B
GB2571054B GB1714308.2A GB201714308A GB2571054B GB 2571054 B GB2571054 B GB 2571054B GB 201714308 A GB201714308 A GB 201714308A GB 2571054 B GB2571054 B GB 2571054B
Authority
GB
United Kingdom
Prior art keywords
module
liquid cooling
cooling
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1714308.2A
Other versions
GB2571054A (en
GB201714308D0 (en
Inventor
Edmunds Neil
Young Andrew
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iceotope Group Ltd
Original Assignee
Iceotope Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iceotope Group Ltd filed Critical Iceotope Group Ltd
Priority to GB1714308.2A priority Critical patent/GB2571054B/en
Publication of GB201714308D0 publication Critical patent/GB201714308D0/en
Priority to IL308679A priority patent/IL308679A/en
Priority to EP23153461.1A priority patent/EP4203016A1/en
Priority to TW111142513A priority patent/TWI836706B/en
Priority to IL273104A priority patent/IL273104B2/en
Priority to TW107131329A priority patent/TWI786175B/en
Priority to KR1020237018651A priority patent/KR102639521B1/en
Priority to CN202111385072.9A priority patent/CN114375131A/en
Priority to EP23153453.8A priority patent/EP4199076A1/en
Priority to CN201880058136.4A priority patent/CN111095541B/en
Priority to ES18769441T priority patent/ES2943656T3/en
Priority to EP18769441.9A priority patent/EP3679603B1/en
Priority to KR1020207009009A priority patent/KR102541199B1/en
Priority to US16/645,166 priority patent/US11096313B2/en
Priority to PCT/GB2018/052526 priority patent/WO2019048864A1/en
Priority to JP2020513520A priority patent/JP7183257B2/en
Priority to KR1020237018653A priority patent/KR102640723B1/en
Publication of GB2571054A publication Critical patent/GB2571054A/en
Publication of GB2571054B publication Critical patent/GB2571054B/en
Application granted granted Critical
Priority to US17/354,769 priority patent/US11369040B2/en
Priority to US17/354,781 priority patent/US11470739B2/en
Priority to US17/678,387 priority patent/US11653472B2/en
Priority to US17/902,747 priority patent/US11596082B2/en
Priority to JP2022186574A priority patent/JP2023029880A/en
Priority to JP2022186573A priority patent/JP2023029879A/en
Priority to US18/122,449 priority patent/US20230240042A1/en
Priority to US18/122,431 priority patent/US11968802B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1714308.2A 2017-09-06 2017-09-06 Module for liquid cooling Active GB2571054B (en)

Priority Applications (25)

Application Number Priority Date Filing Date Title
GB1714308.2A GB2571054B (en) 2017-09-06 2017-09-06 Module for liquid cooling
PCT/GB2018/052526 WO2019048864A1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
KR1020237018653A KR102640723B1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
JP2020513520A JP7183257B2 (en) 2017-09-06 2018-09-06 Immersion cooling heat sinks, heat sink devices and modules
IL273104A IL273104B2 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
EP23153461.1A EP4203016A1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
KR1020237018651A KR102639521B1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
CN202111385072.9A CN114375131A (en) 2017-09-06 2018-09-06 Heat sink, heat sink device and module for liquid immersion cooling
EP23153453.8A EP4199076A1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
CN201880058136.4A CN111095541B (en) 2017-09-06 2018-09-06 Heat sink, heat sink device and module for liquid immersion cooling
ES18769441T ES2943656T3 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
EP18769441.9A EP3679603B1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
KR1020207009009A KR102541199B1 (en) 2017-09-06 2018-09-06 Heat sinks, heat sink arrays and modules for immersion cooling
US16/645,166 US11096313B2 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
IL308679A IL308679A (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
TW111142513A TWI836706B (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
TW107131329A TWI786175B (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/354,781 US11470739B2 (en) 2017-09-06 2021-06-22 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/354,769 US11369040B2 (en) 2017-09-06 2021-06-22 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/678,387 US11653472B2 (en) 2017-09-06 2022-02-23 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/902,747 US11596082B2 (en) 2017-09-06 2022-09-02 Heat sink, heat sink arrangement and module for liquid immersion cooling
JP2022186573A JP2023029879A (en) 2017-09-06 2022-11-22 cooling module
JP2022186574A JP2023029880A (en) 2017-09-06 2022-11-22 cooling module
US18/122,449 US20230240042A1 (en) 2017-09-06 2023-03-16 Heat sink, heat sink arrangement and module for liquid immersion cooling
US18/122,431 US11968802B2 (en) 2017-09-06 2023-03-16 Heat sink, heat sink arrangement and module for liquid immersion cooling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1714308.2A GB2571054B (en) 2017-09-06 2017-09-06 Module for liquid cooling

Publications (3)

Publication Number Publication Date
GB201714308D0 GB201714308D0 (en) 2017-10-18
GB2571054A GB2571054A (en) 2019-08-21
GB2571054B true GB2571054B (en) 2020-03-25

Family

ID=60050658

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1714308.2A Active GB2571054B (en) 2017-09-06 2017-09-06 Module for liquid cooling

Country Status (1)

Country Link
GB (1) GB2571054B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201916763D0 (en) * 2019-11-18 2020-01-01 Iceotope Group Ltd Nozzle arrangement and cooling module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168348A (en) * 1991-07-15 1992-12-01 International Business Machines Corporation Impingment cooled compliant heat sink
JPH05251600A (en) * 1992-03-06 1993-09-28 Nec Corp Immersion jet cooling heat sink
JPH05275587A (en) * 1992-03-27 1993-10-22 Nec Corp Integrated circuit cooling structure
US20100103620A1 (en) * 2008-10-23 2010-04-29 International Business Machines Corporation Open Flow Cold Plate For Liquid Cooled Electronic Packages
US20120170222A1 (en) * 2011-01-05 2012-07-05 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
JP2014183260A (en) * 2013-03-21 2014-09-29 Toyota Central R&D Labs Inc Cooling device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168348A (en) * 1991-07-15 1992-12-01 International Business Machines Corporation Impingment cooled compliant heat sink
JPH05251600A (en) * 1992-03-06 1993-09-28 Nec Corp Immersion jet cooling heat sink
JPH05275587A (en) * 1992-03-27 1993-10-22 Nec Corp Integrated circuit cooling structure
US20100103620A1 (en) * 2008-10-23 2010-04-29 International Business Machines Corporation Open Flow Cold Plate For Liquid Cooled Electronic Packages
US20120170222A1 (en) * 2011-01-05 2012-07-05 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
JP2014183260A (en) * 2013-03-21 2014-09-29 Toyota Central R&D Labs Inc Cooling device

Also Published As

Publication number Publication date
GB2571054A (en) 2019-08-21
GB201714308D0 (en) 2017-10-18

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Free format text: REGISTERED BETWEEN 20200109 AND 20200115