EP3295777A4 - Liquid cooled coldplate - Google Patents

Liquid cooled coldplate Download PDF

Info

Publication number
EP3295777A4
EP3295777A4 EP16797099.5A EP16797099A EP3295777A4 EP 3295777 A4 EP3295777 A4 EP 3295777A4 EP 16797099 A EP16797099 A EP 16797099A EP 3295777 A4 EP3295777 A4 EP 3295777A4
Authority
EP
European Patent Office
Prior art keywords
liquid cooled
cooled coldplate
coldplate
liquid
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16797099.5A
Other languages
German (de)
French (fr)
Other versions
EP3295777A1 (en
Inventor
Matthew A. REEVES
Robert Scott HOLLAND
Sy-Jenq Loong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Microcool LLC
Original Assignee
Wolverine Tube Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolverine Tube Inc filed Critical Wolverine Tube Inc
Publication of EP3295777A1 publication Critical patent/EP3295777A1/en
Publication of EP3295777A4 publication Critical patent/EP3295777A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP16797099.5A 2015-05-15 2016-05-16 Liquid cooled coldplate Withdrawn EP3295777A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562162195P 2015-05-15 2015-05-15
US201662332733P 2016-05-06 2016-05-06
PCT/US2016/032730 WO2016187131A1 (en) 2015-05-15 2016-05-16 Liquid cooled coldplate

Publications (2)

Publication Number Publication Date
EP3295777A1 EP3295777A1 (en) 2018-03-21
EP3295777A4 true EP3295777A4 (en) 2019-01-23

Family

ID=57320348

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16797099.5A Withdrawn EP3295777A4 (en) 2015-05-15 2016-05-16 Liquid cooled coldplate

Country Status (4)

Country Link
EP (1) EP3295777A4 (en)
JP (1) JP2018518061A (en)
CN (1) CN108029219B (en)
WO (1) WO2016187131A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10279610B2 (en) * 2016-12-20 2019-05-07 Xerox Corporation Cooling insert
US10249554B2 (en) 2017-06-20 2019-04-02 General Electric Company Heat transfer assembly for a heat emitting device
WO2019175958A1 (en) * 2018-03-13 2019-09-19 日産自動車株式会社 Electric power converter
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
CN114975405B (en) * 2022-05-27 2024-06-07 盛合晶微半导体(江阴)有限公司 Wafer packaging system and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7197819B1 (en) * 2004-12-18 2007-04-03 Rinehart Motion Systems, Llc Method of assembling an electric power
US20110079376A1 (en) * 2009-10-03 2011-04-07 Wolverine Tube, Inc. Cold plate with pins
US20120320529A1 (en) * 2010-07-28 2012-12-20 Wolverine Tube, Inc. Enhanced clad metal base plate
US9003649B1 (en) * 2010-06-25 2015-04-14 Maxq Technology, Llc Method of making a two-sided fluid cooled assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
US5386500A (en) * 1987-06-02 1995-01-31 Cubital Ltd. Three dimensional modeling apparatus
RU2044606C1 (en) 1993-04-30 1995-09-27 Николай Николаевич Зубков Method of obtaining surfaces with alternative projections and hollows (variants) and tool for its realization
EP1276362B1 (en) * 2001-07-13 2006-02-01 Lytron, Inc. Flattened tube cold plate for liquid cooling electrical components
US7203064B2 (en) * 2003-12-12 2007-04-10 Intel Corporation Heat exchanger with cooling channels having varying geometry
JP4458973B2 (en) * 2004-07-28 2010-04-28 トヨタ自動車株式会社 Secondary air supply structure for internal combustion engine
US20060248918A1 (en) * 2005-01-31 2006-11-09 Robertson James D Cooler with container pockets and cold plate
JP4881583B2 (en) * 2005-06-27 2012-02-22 株式会社豊田自動織機 Power module heat sink
US8062918B2 (en) * 2008-05-01 2011-11-22 Intermolecular, Inc. Surface treatment to improve resistive-switching characteristics
JP5381561B2 (en) * 2008-11-28 2014-01-08 富士電機株式会社 Semiconductor cooling device
US8712598B2 (en) * 2011-01-14 2014-04-29 Microsoft Corporation Adaptive flow for thermal cooling of devices
CN202354023U (en) * 2012-03-02 2012-07-25 东莞爱美达电子有限公司 Water cooling plate containing staggered fins
CN104247010B (en) * 2012-10-29 2017-06-20 富士电机株式会社 Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7197819B1 (en) * 2004-12-18 2007-04-03 Rinehart Motion Systems, Llc Method of assembling an electric power
US20110079376A1 (en) * 2009-10-03 2011-04-07 Wolverine Tube, Inc. Cold plate with pins
US9003649B1 (en) * 2010-06-25 2015-04-14 Maxq Technology, Llc Method of making a two-sided fluid cooled assembly
US20120320529A1 (en) * 2010-07-28 2012-12-20 Wolverine Tube, Inc. Enhanced clad metal base plate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016187131A1 *

Also Published As

Publication number Publication date
CN108029219B (en) 2020-04-24
WO2016187131A1 (en) 2016-11-24
JP2018518061A (en) 2018-07-05
CN108029219A (en) 2018-05-11
EP3295777A1 (en) 2018-03-21

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