JP5599451B2 - キャリアからウエハを取り去るためのデバイスおよび方法 - Google Patents
キャリアからウエハを取り去るためのデバイスおよび方法 Download PDFInfo
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
− キャリアとウエハとからなるキャリア−ウエハ組立体を載置するための受け取り手段と、
− キャリアとウエハとの間の相互連結層によって提供された連結部を分離するための、特に破断させるための連結部除去手段と、
− キャリアからウエハを取り去るための、またはウエハからキャリアを取り去るための取り去り手段と、
を備えており、
連結部除去手段が、0から350℃、特に10から200℃、好ましくは20から80℃の温度範囲内で、さらに好ましくは環境温度で作動するよう形成されていることを特徴とする。
− 受け取り手段上に、キャリアとウエハとからなるキャリア−ウエハ組立体を載置するステップと、
− 連結部除去手段によってキャリアとウエハとの間の相互連結層によって提供された連結部を分離する、特に破断させるステップと、
− 取り去り装置によって、キャリアからウエハを取り去る、またはウエハからキャリアを取り去るステップと、
を含み、
連結部除去手段が、350℃までの温度で、特に10から200℃、好ましくは20から80℃の温度範囲内で、さらに好ましくは環境温度で作動するよう形成されていることを特徴とする。
1 キャリア
2 接着力低減層
3 中間層
4 ウエハ
5 駆動モータ
5w 駆動軸
6 受け取り手段
7 処理チャンバ
8 排水部
9 ウエハ受け取り部
10 圧力ライン
11 ウエハホルダ受け取り部
12 センサライン
13 センサ
14 吸引カップ
15 ウエハ受け取り部支持部
16 除去デバイス
17 流体ライン
18 アクチュエータ
19 溶剤ライン
20 溶剤アクチュエータ
21 キャリア−ウエハ組立体
22 内側領域
23 側縁部
24 下部
25 脚
26 脚
27 側壁
28 作動チャンバ
29 アクチュエータアーム
30 ウエハ受け取りアクチュエータアーム
31 溶剤アクチュエータアーム
32 矢印
33 回転矢印
34 溶剤
35 面
36 面
37 溶剤
38 フォイル
39 フィルムフレーム
40 溶剤ライン
41 出口
42 フィルムフレーム受け取り部
43 吸引カップ
Claims (27)
- ウエハをキャリアから取り去るための装置であって、前記キャリアは、前記キャリアと前記ウエハとの間の連結を提供する相互連結層によって前記ウエハに固定されており、
前記装置は、
− 前記キャリアと前記ウエハとからなるキャリア−ウエハ組立体を受け取るための受け取り手段であって、前記相互連結層が、前記キャリア−ウエハ組立体の周縁部において、前記キャリアと前記ウエハとの間に前記連結を提供する、受け取り手段と、
− 前記キャリアと前記ウエハとの間の前記連結を除去するための連結部除去手段であって、前記連結部除去手段は、少なくとも1つの除去デバイスを有しており、
前記除去デバイスが、
前記キャリア−ウエハ組立体の前記周縁部の少なくとも一部を包囲するための作動チャンバと、
前記作動チャンバへ、前記相互連結層の溶解のための溶剤を供給するための手段と、
を含む、連結部除去手段と、
− 前記キャリア−ウエハ組立体の前記周縁部を前記溶剤と接触させて前記周縁部における前記相互連結層を溶解させかつ前記キャリアと前記ウエハとの間の連結が破断されるよ
うに、前記連結部除去手段の前記作動チャンバの中を通して前記キャリア−ウエハ組立体の前記周縁部を移動させるために、前記キャリア−ウエハ組立体を回転させるための回転手段と、
− 前記キャリアから前記ウエハを取り去るための、または前記ウエハから前記キャリアを取り去るための、取り去り手段と、
を備えることを特徴とする装置。 - 前記連結部除去手段は、10から200℃の温度範囲内で作動することを特徴とする請求項1に記載の装置。
- 前記連結部除去手段が、加熱することなく作動することを特徴とする請求項1に記載の装置。
- 前記連結部除去手段はさらに、前記相互連結層を通過して切断するためのかつ前記相互連結層を取り除くためのブレードを含む機械的分離手段を備えることを特徴とする請求項1に記載の装置。
- 前記連結部除去手段はさらに、前記相互連結層を取り除くためのUV光源を具備してなることを特徴とする請求項1に記載の装置。
- 前記連結部除去手段は、前記キャリア−ウエハ組立体の周縁部上で作動することを特徴とする請求項1に記載の装置。
- 少なくとも1つの前記除去デバイスは、前記作動チャンバの封止のために、前記受け取り手段および/または前記取り去り手段と接触することを特徴とする請求項1に記載の装置。
- 前記作動チャンバは、前記キャリア−ウエハ組立体の前記周縁部の近傍において封止されることを特徴とする請求項1に記載の装置。
- 前記取り去り手段は、回転可能であることを特徴とする請求項1に記載の装置。
- 前記相互連結層は、熱可塑性接着剤であることを特徴とする請求項1に記載の装置。
- 前記連結部除去手段は、前記ウエハをクリーニングするための洗浄剤を供給するために溶剤ラインを含むことを特徴とする請求項1に記載の装置。
- 前記作動チャンバは、U字形状の断面を有することを特徴とする請求項1に記載の装置。
- 前記少なくとも1つの除去デバイスは、前記作動チャンバを規定するよう前記除去デバイスから延在する側壁と一対の脚とを含むことを特徴とする請求項1に記載の装置。
- 前記一対の脚は、前記作動チャンバを封止するよう、前記受け取り手段および/または前記取り去り手段と接触する面をそれぞれ有することを特徴とする請求項13に記載の装置。
- 前記回転手段は、回転軸を含むことを特徴とする請求項1に記載の装置。
- 前記連結部除去手段は、0℃から350℃の温度範囲で作動することを特徴とする請求項1に記載の装置。
- キャリアと、キャリア−ウエハ組立体を形成するウエハとの間に連結を提供する相互連結層を取り去るための装置であって、
前記装置は、
− 前記キャリアから前記ウエハを取り去るための、または前記ウエハから前記キャリアを取り去るための、取り去り手段と、
− 除去ポジションでの前記キャリア−ウエハ組立体の回転のための回転手段と、
− 連結部除去手段であって、
作動チャンバであって、前記キャリア−ウエハ組立体の周縁部の少なくとも一部を前記作動チャンバ内に収容できる、作動チャンバと、
前記作動チャンバに、前記キャリア−ウエハ組立体の前記周縁部における前記相互連結層を溶解するための溶剤を供給するための手段と、
を含む、連結部除去手段と、
を備えることを特徴とする装置。 - 前記溶剤は、前記キャリア−ウエハ組立体の前記周縁部において作用することを特徴とする請求項17に記載の装置。
- 前記連結部除去手段は、浸漬槽を備えることを特徴とする請求項17に記載の装置。
- 前記連結部除去手段は、前記作動チャンバを規定するU字形状の断面を有することを特徴とする請求項17に記載の装置。
- 前記作動チャンバは、一対の脚と側壁とによって規定されており、前記作動チャンバは、前記キャリア−ウエハ組立体へ向けて開放されていることを特徴とする請求項17に記載の装置。
- ウエハをキャリアから取り去るための方法であって、前記キャリアは、前記キャリアと前記ウエハとの間の連結を提供する相互連結層によって前記ウエハに固定されており、前記相互連結層が、前記キャリア−ウエハ組立体の周縁部において、前記キャリアと前記ウエハとの間に前記連結を提供しており、
前記方法は、
− 前記キャリアと前記ウエハとからなるキャリア−ウエハ組立体を受け取るための受け取り手段上に前記キャリア−ウエハ組立体を載置するステップと、
− 前記キャリア−ウエハ組立体の前記周縁部の少なくとも一部を包囲するための作動チャンバと、前記相互連結層の溶解のための溶剤を前記作動チャンバへ供給するための手段と、を含む少なくとも1つの除去デバイスを有する連結部除去手段によって、前記キャリアと前記ウエハとの間の連結を除去するステップと、
− 前記キャリア−ウエハ組立体の前記周縁部を前記溶剤と接触させて前記周縁部における前記相互連結層を溶解させかつ前記キャリアと前記ウエハとの間の連結が破断されるように、前記連結部除去手段の前記作動チャンバの中を通して前記キャリア−ウエハ組立体の前記周縁部を移動させるために、回転手段を使用して前記キャリア−ウエハ組立体を回転させるステップと、
− 取り去り手段によって、前記キャリアから前記ウエハを取り去るかあるいは前記ウエハから前記キャリアを取り去るステップと、
を含むことを特徴とする方法。 - 前記相互連結層は、
接着剤からなり、かつ、
前記キャリア−ウエハ組立体の前記周縁部の内側の領域において、少なくとも前記キャリアの方向において非接着状態となるように、その接着力が低減されていることを特徴とする請求項22に記載の方法。 - 請求項1ないし請求項21のいずれか一項に記載の装置を使用した請求項22または請求項23に基づく方法。
- キャリアと、キャリア−ウエハ組立体を形成するウエハとの間に連結を提供する相互連結層を取り去るための方法であって、
前記方法は、
− 連結部除去手段によって、前記キャリアと前記ウエハとの間の連結を除去するステップであって、
前記キャリア−ウエハ組立体の周縁部の少なくとも一部を作動チャンバ内に収容するステップと、
前記作動チャンバに、前記キャリア−ウエハ組立体の前記周縁部における前記相互連結層を溶解するための溶剤を供給するステップと、
を含む、ステップと、
− 除去ポジションにおいて、回転手段を使用して前記キャリア−ウエハ組立体を回転させるステップと、
− 取り去り手段によって、前記キャリアから前記ウエハを取り去るかあるいは前記ウエハから前記キャリアを取り去るステップと、
を含むことを特徴とする方法。 - 前記相互連結層は、
接着剤からなり、かつ、
前記キャリア−ウエハ組立体の前記周縁部の内側の領域において、少なくとも前記キャリアの方向において非接着状態となるように、その接着力が低減されていることを特徴とする請求項25に記載の方法。 - 請求項1ないし請求項21のいずれか一項に記載の装置を使用した請求項25または請求項26に基づく方法。
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JP5074940B2 (ja) | 2008-01-30 | 2012-11-14 | 東京応化工業株式会社 | 基板の処理方法 |
JP2009182256A (ja) | 2008-01-31 | 2009-08-13 | Tokyo Ohka Kogyo Co Ltd | 基板の処理装置および基板の処理方法 |
EP2230683B1 (de) | 2009-03-18 | 2016-03-16 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger |
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