JP5580212B2 - カルボン酸化合物及びそれを含有するエポキシ樹脂組成物 - Google Patents

カルボン酸化合物及びそれを含有するエポキシ樹脂組成物 Download PDF

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Publication number
JP5580212B2
JP5580212B2 JP2010542997A JP2010542997A JP5580212B2 JP 5580212 B2 JP5580212 B2 JP 5580212B2 JP 2010542997 A JP2010542997 A JP 2010542997A JP 2010542997 A JP2010542997 A JP 2010542997A JP 5580212 B2 JP5580212 B2 JP 5580212B2
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Japan
Prior art keywords
epoxy resin
compound
carboxylic acid
resin composition
acid
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Expired - Fee Related
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JP2010542997A
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Japanese (ja)
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JPWO2010071168A1 (ja
Inventor
直房 宮川
政隆 中西
智江 佐々木
義浩 川田
健一 窪木
静 青木
瑞観 鈴木
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Priority to JP2010542997A priority Critical patent/JP5580212B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Die Bonding (AREA)
JP2010542997A 2008-12-19 2009-12-17 カルボン酸化合物及びそれを含有するエポキシ樹脂組成物 Expired - Fee Related JP5580212B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010542997A JP5580212B2 (ja) 2008-12-19 2009-12-17 カルボン酸化合物及びそれを含有するエポキシ樹脂組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008324305 2008-12-19
JP2008324305 2008-12-19
PCT/JP2009/071028 WO2010071168A1 (ja) 2008-12-19 2009-12-17 カルボン酸化合物及びそれを含有するエポキシ樹脂組成物
JP2010542997A JP5580212B2 (ja) 2008-12-19 2009-12-17 カルボン酸化合物及びそれを含有するエポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2010071168A1 JPWO2010071168A1 (ja) 2012-05-31
JP5580212B2 true JP5580212B2 (ja) 2014-08-27

Family

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JP2010542997A Expired - Fee Related JP5580212B2 (ja) 2008-12-19 2009-12-17 カルボン酸化合物及びそれを含有するエポキシ樹脂組成物

Country Status (6)

Country Link
JP (1) JP5580212B2 (zh)
KR (1) KR20110101139A (zh)
CN (1) CN102257039B (zh)
SG (1) SG172173A1 (zh)
TW (1) TWI435896B (zh)
WO (1) WO2010071168A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189553A (ja) * 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
TW201113330A (en) * 2009-08-21 2011-04-16 Jsr Corp Photo-semiconductor package composition
TWI488890B (zh) * 2009-10-06 2015-06-21 Nippon Kayaku Kk A polycarboxylic acid composition and a method for producing the same, and a hardening resin composition comprising the polycarboxylic acid composition
JP5680928B2 (ja) * 2010-10-04 2015-03-04 新日鉄住金化学株式会社 エポキシシリコーン樹脂含有硬化性樹脂組成物
JP5574906B2 (ja) * 2010-10-08 2014-08-20 エバーライト ユーエスエー、インク シリコーン含有封止材
JP2012092172A (ja) * 2010-10-25 2012-05-17 Jsr Corp 光半導体封止用組成物および発光素子
WO2012137837A1 (ja) * 2011-04-07 2012-10-11 日本化薬株式会社 多価カルボン酸樹脂およびその組成物
JP6006725B2 (ja) * 2011-09-09 2016-10-12 日本化薬株式会社 光半導体素子封止用硬化性樹脂組成物およびその硬化物
JP6150415B2 (ja) * 2011-09-27 2017-06-21 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
JP5644831B2 (ja) * 2012-10-23 2014-12-24 日立化成株式会社 リフレクターの製造方法及びｌｅｄ装置
WO2014136693A1 (ja) * 2013-03-05 2014-09-12 日本化薬株式会社 多価カルボン酸組成物、エポキシ樹脂用硬化剤組成物、エポキシ樹脂組成物およびその硬化物
JPWO2014157552A1 (ja) * 2013-03-28 2017-02-16 日本化薬株式会社 光半導体封止用エポキシ樹脂組成物、その硬化物および光半導体装置
US9926338B2 (en) * 2015-05-27 2018-03-27 Wacker Chemical Corporation Carboxylic acid functional siloxanes of defined structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362363A (ja) * 1986-09-03 1988-03-18 Nitto Electric Ind Co Ltd 光半導体装置
JPH06100762A (ja) * 1992-09-21 1994-04-12 Nippon Kayaku Co Ltd エポキシ樹脂組成物
JPH09194597A (ja) * 1996-01-11 1997-07-29 Dow Corning Corp オルガノシロキサン化合物及びそれを含む組成物
WO2007135909A1 (ja) * 2006-05-18 2007-11-29 Nippon Kayaku Kabushiki Kaisha 熱硬化性樹脂組成物及びその硬化物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6361016A (ja) * 1986-08-29 1988-03-17 New Japan Chem Co Ltd エポキシ樹脂硬化剤組成物
JP3080399B2 (ja) * 1990-01-29 2000-08-28 日東電工株式会社 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物ならびにその製法
JPH08120085A (ja) * 1994-10-21 1996-05-14 Nippon Paint Co Ltd 反応性乳化剤、水性シリコーン変性樹脂、水性塗料および塗膜
JP3527296B2 (ja) * 1994-10-21 2004-05-17 日本ペイント株式会社 新規なオルガノポリシロキサン化合物およびその製造方法
JP2001172390A (ja) * 1999-12-16 2001-06-26 Chisso Corp 変性オルガノポリシロキサンおよびその製造方法
JP4725986B2 (ja) * 2000-08-22 2011-07-13 Ｊｎｃ株式会社 変性ポリオルガノシロキサンおよびその製造方法
JP2005194388A (ja) * 2004-01-07 2005-07-21 Shin Etsu Chem Co Ltd シリコーン及びその製造方法
JP5004514B2 (ja) * 2006-06-16 2012-08-22 東レ・ダウコーニング株式会社 ゲル化剤、ゲル状組成物および化粧料
JP2008266285A (ja) * 2006-10-24 2008-11-06 Shiseido Co Ltd オルガノシロキサン誘導体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362363A (ja) * 1986-09-03 1988-03-18 Nitto Electric Ind Co Ltd 光半導体装置
JPH06100762A (ja) * 1992-09-21 1994-04-12 Nippon Kayaku Co Ltd エポキシ樹脂組成物
JPH09194597A (ja) * 1996-01-11 1997-07-29 Dow Corning Corp オルガノシロキサン化合物及びそれを含む組成物
WO2007135909A1 (ja) * 2006-05-18 2007-11-29 Nippon Kayaku Kabushiki Kaisha 熱硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
CN102257039B (zh) 2013-08-28
WO2010071168A1 (ja) 2010-06-24
JPWO2010071168A1 (ja) 2012-05-31
TW201033254A (en) 2010-09-16
SG172173A1 (en) 2011-07-28
CN102257039A (zh) 2011-11-23
TWI435896B (zh) 2014-05-01
KR20110101139A (ko) 2011-09-15

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