JP5572418B2 - 積層セラミックシート切断用熱剥離型粘着シート - Google Patents

積層セラミックシート切断用熱剥離型粘着シート Download PDF

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Publication number
JP5572418B2
JP5572418B2 JP2010042353A JP2010042353A JP5572418B2 JP 5572418 B2 JP5572418 B2 JP 5572418B2 JP 2010042353 A JP2010042353 A JP 2010042353A JP 2010042353 A JP2010042353 A JP 2010042353A JP 5572418 B2 JP5572418 B2 JP 5572418B2
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JP
Japan
Prior art keywords
heat
sensitive adhesive
pressure
cutting
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010042353A
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English (en)
Japanese (ja)
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JP2010229399A (ja
JP2010229399A5 (enExample
Inventor
和樹 副島
高正 平山
大輔 下川
正明 佐藤
幸生 有満
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2010042353A priority Critical patent/JP5572418B2/ja
Publication of JP2010229399A publication Critical patent/JP2010229399A/ja
Publication of JP2010229399A5 publication Critical patent/JP2010229399A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2010042353A 2009-03-04 2010-02-26 積層セラミックシート切断用熱剥離型粘着シート Active JP5572418B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010042353A JP5572418B2 (ja) 2009-03-04 2010-02-26 積層セラミックシート切断用熱剥離型粘着シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009050032 2009-03-04
JP2009050032 2009-03-04
JP2010042353A JP5572418B2 (ja) 2009-03-04 2010-02-26 積層セラミックシート切断用熱剥離型粘着シート

Publications (3)

Publication Number Publication Date
JP2010229399A JP2010229399A (ja) 2010-10-14
JP2010229399A5 JP2010229399A5 (enExample) 2014-01-16
JP5572418B2 true JP5572418B2 (ja) 2014-08-13

Family

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JP2010042353A Active JP5572418B2 (ja) 2009-03-04 2010-02-26 積層セラミックシート切断用熱剥離型粘着シート

Country Status (4)

Country Link
US (1) US8524361B2 (enExample)
JP (1) JP5572418B2 (enExample)
CN (1) CN101824283B (enExample)
TW (1) TWI529231B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456431B2 (ja) * 2009-10-20 2014-03-26 日東電工株式会社 加熱剥離型粘着シート
CN102019737B (zh) * 2010-09-30 2014-02-19 南亚塑胶工业股份有限公司 一种水性热发泡粘合胶板
JP2012117041A (ja) * 2010-11-12 2012-06-21 Nitto Denko Corp 粘着剤組成物、粘着剤層、及び、粘着テープ又はシート
JP2012193317A (ja) * 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
JP2013147541A (ja) * 2012-01-17 2013-08-01 Nitto Denko Corp 粘着剤用ポリマー、粘着剤組成物及び熱剥離性粘着シート
WO2013187183A1 (ja) * 2012-06-15 2013-12-19 株式会社村田製作所 導電性ペースト、ならびに積層セラミック電子部品およびその製造方法
JP6054208B2 (ja) * 2013-03-04 2016-12-27 日東電工株式会社 熱剥離型粘着シート
JP2015021082A (ja) * 2013-07-19 2015-02-02 日東電工株式会社 電子部品切断用熱剥離型粘着テープおよび電子部品の切断方法
JP6418872B2 (ja) * 2014-09-26 2018-11-07 ソマール株式会社 配線基板製造工程用バックアップフィルム
EP3281971B1 (en) * 2015-03-17 2019-08-14 Zeon Corporation Self-adsorbing foam sheet
JP6595216B2 (ja) * 2015-06-04 2019-10-23 ニッタ株式会社 感温性粘着テープ
CN105199659B (zh) * 2015-10-15 2018-03-20 烟台德邦科技有限公司 一种晶圆减薄临时粘接光固化胶粘剂
EP3450519A4 (en) * 2016-04-28 2020-04-22 Zeon Corporation SELF-ADHESIVE LAYER
BR112018070435A2 (pt) * 2016-04-28 2019-02-05 Zeon Corp camada autoadesiva
JP6712916B2 (ja) * 2016-07-11 2020-06-24 日東電工株式会社 粘着シート
CN109641433B (zh) * 2016-09-16 2021-05-14 日本瑞翁株式会社 层叠片及其制造方法
JP6768038B2 (ja) * 2018-07-26 2020-10-14 日東電工株式会社 粘着シート
CN109280497A (zh) * 2018-09-03 2019-01-29 嘉善欣达胶业有限公司 一种阻燃植绒胶粘剂
US12221568B2 (en) * 2019-01-22 2025-02-11 Sekisui Chemical Co., Ltd. Adhesive tape and method for producing same
CN110184006B (zh) * 2019-06-21 2021-06-15 广东硕成科技有限公司 一种热剥离胶黏剂及其制备方法
CN110713811B (zh) * 2019-10-30 2021-04-13 浙江龙游道明光学有限公司 一种反光膜用高弹性压敏胶的制造方法
WO2023083248A1 (en) * 2021-11-11 2023-05-19 Ddp Specialty Electronic Materials Us, Llc Adhesive system
TW202432773A (zh) 2022-12-29 2024-08-16 日商Ｄｉｃ股份有限公司 吸附帶、物品、吸附帶的剝離方法、及零件的製造方法

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SE374759B (enExample) 1969-03-24 1975-03-17 Litton Business Systems Inc
JPS5013878A (enExample) 1973-06-11 1975-02-13
JPS5661468A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS5661469A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Hot-bonding adhesive
JPS60252681A (ja) 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JP3897236B2 (ja) * 2001-11-26 2007-03-22 ソマール株式会社 再剥離性粘着シート
JP4063614B2 (ja) * 2002-08-30 2008-03-19 日東電工株式会社 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート
JP4682299B2 (ja) * 2003-11-17 2011-05-11 綜研化学株式会社 保護シート用感圧接着剤
JP2005187501A (ja) * 2003-12-24 2005-07-14 Lintec Corp 粘着シート
JP4588021B2 (ja) * 2004-03-11 2010-11-24 日東電工株式会社 加熱剥離型粘着シートおよび該加熱剥離型粘着シートを用いた被着体の加工方法
JP2005255829A (ja) * 2004-03-11 2005-09-22 Nitto Denko Corp 加熱剥離型粘着シートおよび被着体の加工方法
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート
JP5013878B2 (ja) 2004-11-29 2012-08-29 公立大学法人大阪府立大学 キチンを含む有機物の処理法
JP4947921B2 (ja) * 2005-05-18 2012-06-06 日東電工株式会社 加熱剥離型粘着シートおよび該加熱剥離型粘着シートを用いた被着体の加工方法
JP5235273B2 (ja) * 2005-12-27 2013-07-10 日東電工株式会社 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP2008266456A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 熱剥離型両面粘着シート
US20100215882A1 (en) * 2009-02-23 2010-08-26 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet

Also Published As

Publication number Publication date
TW201038707A (en) 2010-11-01
CN101824283A (zh) 2010-09-08
US20100224316A1 (en) 2010-09-09
JP2010229399A (ja) 2010-10-14
CN101824283B (zh) 2014-08-20
US8524361B2 (en) 2013-09-03
TWI529231B (zh) 2016-04-11

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